Zen 2

Last updated

AMD Zen 2
AMD Zen 2 logo.png
General information
Launched7 July 2019;5 years ago (7 July 2019) [1]
Designed by AMD
Common manufacturers
CPUID codeFamily 17h
Cache
L1 cache 64 KB per core:
  • 32 KB instructions
  • 32 KB data
L2 cache512 KB per core
L3 cache16 MB per CCX (APU: 8 MB)
Architecture and classification
Technology node TSMC N7 [2] [3]
TSMC N6 [4]
Instruction set AMD64 (x86-64)
Physical specifications
Transistors
  • 5.89 billion (1× CCD) or
    9.69 billion (2× CCD)
    (3.8 billion per 7 nm 8-core "CCD" & 2.09 billion for the 12 nm "I/O die") [5]
Cores
    • 4–16 (desktop)
    • 24–64 (HEDT)
    • 12–64 (workstation)
    • Up to 64 (server)
    • 2–8 (mobile)
Sockets
Products, models, variants
Product code names
  • Matisse (desktop)
  • Rome (server) [3]
  • Castle Peak (HEDT/workstation)
  • Renoir (Desktop APU, mobile and embedded)
  • Mendocino (mobile and embedded refresh)
Brand names
History
Predecessor Zen+
Successor Zen 3
Support status
Supported

Zen 2 is a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nm MOSFET node from TSMC. The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips (codename "Matisse"), Ryzen 4000U/H (codename "Renoir") and Ryzen 5000U (codename "Lucienne") for mobile applications, as Threadripper 3000 for high-end desktop systems, [6] [7] and as Ryzen 4000G for accelerated processing units (APUs). The Ryzen 3000 series CPUs were released on 7 July 2019, [8] [9] while the Zen 2-based Epyc server CPUs (codename "Rome") were released on 7 August 2019. [10] An additional chip, the Ryzen 9 3950X, was released in November 2019. [8]

Contents

At CES 2019, AMD showed a Ryzen third-generation engineering sample that contained one chiplet with eight cores and 16 threads. [6] AMD CEO Lisa Su also said to expect more than eight cores in the final lineup. [11] At Computex 2019, AMD revealed that the Zen 2 "Matisse" processors would feature up to 12 cores, and a few weeks later a 16 core processor was also revealed at E3 2019, being the aforementioned Ryzen 9 3950X. [12] [13]

Zen 2 includes hardware mitigations to the Spectre security vulnerability. [14] Zen 2-based EPYC server CPUs use a design in which multiple CPU dies (up to eight in total) manufactured on a 7 nm process ("chiplets") are combined with a 14nm I/O die (as opposed to the 12nm IOD on Matisse variants) on each multi-chip module (MCM) package. Using this, up to 64 physical cores and 128 total compute threads (with simultaneous multithreading) are supported per socket. This architecture is nearly identical to the layout of the "pro-consumer" flagship processor Threadripper 3990X. [15] Zen 2 delivers about 15% more instructions per clock than Zen and Zen+, [16] [17] the 14- and 12-nm microarchitectures utilized on first and second generation Ryzen, respectively.

The Steam Deck, [18] [19] PlayStation 5, Xbox Series X and Series S all use chips based on the Zen 2 microarchitecture, with proprietary tweaks and different configurations in each system's implementation than AMD sells in its own commercially available APUs. [20] [21]

Design

Ryzen 5 3600 Infrared.jpg
AMD Epyc 7702 delidded.jpg
Two delidded Zen 2 processors designed with the multi-chip module approach. The Ryzen 5 3600 CPU on the left/top (used for mainstream Ryzen CPUs) uses a smaller, less capable I/O die and up to two CCDs (only one is used on this particular example), while the Epyc 7702 on the right/bottom (used for high-end desktop, HEDT, Ryzen Threadripper and server Epyc CPUs) uses a larger, more capable I/O die and up to eight CCDs.

Zen 2 is a significant departure from the physical design paradigm of AMD's previous Zen architectures, Zen and Zen+. Zen 2 moves to a multi-chip module design where the I/O components of the CPU are laid out on its own die which is separate from the dies containing processor cores, which are also called chiplets in this context. This separation has benefits in scalability and manufacturability. As physical interfaces don't scale very well with shrinks in process technology, their separation into a different die allows these components to be manufactured using a larger, more mature process node than the CPU dies. The CPU dies (referred to by AMD as core complex dies or CCDs), now more compact due to the move of I/O components onto another die, can be manufactured using a smaller process with fewer manufacturing defects than a larger die would exhibit (since the chances of a die having a defect increases with device (die) size) while also allowing for more dies per wafer. In addition, the central I/O die can service multiple chiplets, making it easier to construct processors with a large number of cores. [15] [22] [23]

Simplified illustration of the Zen 2 microarchitecture Zen2 Microarchitektur.svg
Simplified illustration of the Zen 2 microarchitecture
AMD@7nm(12nmIOD)@Zen2@Rome@EPYC 7702 ES@2S1404E2VJUG5 BB ES DSCx16 CCD polysilicon@5xLED.jpg
AMD@7nm(12nmIOD)@Zen2@Rome@EPYC 7702 ES@2S1404E2VJUG5 BB ES DSCx13 IOD polysilicon@5x.jpg
AMD@7nm(12nmIOD)@Zen2@Matisse@Ryzen 5 3600@100-000000031 BF 1923SUT 9HM6935R90062 DSCx8 IOD polysilicon@5x.jpg
On the left (top on mobile): Die shot of a Zen 2 Core Complex Die. On the middle: Die shot of a Zen 2 EPYC/Threadripper I/O die, On the right (bottom): I/O die of a Zen 2 mainstream Ryzen I/O die.

With Zen 2, each CPU chiplet houses 8 CPU cores, arranged in 2 core complexes (CCXs), each of 4 CPU cores. These chiplets are manufactured using TSMC's 7 nanometer MOSFET node and are about 74 to 80 mm2 in size. [22] The chiplet has about 3.8 billion transistors, while the 12 nm I/O die (IOD) is ~125 mm2 and has 2.09 billion transistors. [24] The amount of L3 cache has been doubled to 32 MB, with each CCX in the chiplet now having access to 16 MB of L3 compared to the 8 MB of Zen and Zen+. [25] AVX2 performance is greatly improved by an increase in execution unit width from 128-bit to 256-bit. [26] There are multiple variants of the I/O die: one manufactured on GlobalFoundries 14 nanometer process, and another manufactured using the same company's 12 nanometer process. The 14 nanometer dies have more features and are used for the EPYC Rome processors, whereas the 12 nm versions are used for consumer processors. [22] Both processes have similar feature sizes, so their transistor density is also similar. [27]

AMD's Zen 2 architecture can deliver higher performance at a lower power consumption than Intel's Cascade Lake architecture, with an example being the AMD Ryzen Threadripper 3970X running with a TDP of 140 W in ECO mode delivering higher performance than the Intel Core i9-10980XE running with a TDP of 165 W. [28]

New features

Feature tables

CPUs

APUs

APU features table

Products

On 26 May 2019, AMD announced six Zen 2-based desktop Ryzen processors (codenamed "Matisse"). These included 6-core and 8-core variants in the Ryzen 5 and Ryzen 7 product lines, as well as a new Ryzen 9 line that includes the company's first 12-core and 16-core mainstream desktop processors. [34]

The Matisse I/O die is also used as the X570 chipset.

AMD's second generation of Epyc processors, codenamed "Rome", feature up to 64 cores, and were launched on 7 August 2019. [10]

Desktop CPUs

3000 series (Matisse)

Common features of Ryzen 3000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
Branding and Model Cores
(threads)		Thermal Solution Clock rate (GHz) L3 cache
(total)		 TDP Chiplets Core
config [lower-roman 1] 		Release
date		 MSRP
BaseBoost
Ryzen 9 3950X 16 (32)N/A3.54.764 MB105 W [lower-roman 2] 2 × CCD
1 × I/OD		4 × 4Nov 25, 2019US $749
3900XT 12 (24)3.84 × 3Jul 7, 2020US $499
3900X Wraith Prism 4.6Jul 7, 2019
3900 [lower-alpha 1] OEM3.14.365 WOct 8, 2019OEM
Ryzen 7 3800XT 8 (16)N/A3.94.732 MB105 W1 × CCD
1 × I/OD		2 × 4Jul 7, 2020US $399
3800X Wraith Prism 4.5Jul 7, 2019
3700X [lower-alpha 1] 3.64.4065 W [lower-roman 3] US $329
Ryzen 5 3600XT 6 (12)N/A3.84.595 W2 × 3Jul 7, 2020US $249
3600X Wraith Spire (non-LED) 4.4Jul 7, 2019
3600 [lower-alpha 1] Wraith Stealth 3.64.265 WUS $199
3500X [37] 6 (6)4.1Oct 8, 2019China
¥1099
3500 OEM16 MBNov 15, 2019OEM (West)
Japan
¥16000 [38]
Ryzen 3 3300X 4 (8) Wraith Stealth 3.84.31 × 4Apr 21, 2020US $119
3100 3.63.92 × 2US $99
  1. ↑ Core Complexes (CCXs) × cores per CCX
  2. ↑ Ryzen 9 3900X and Ryzen 9 3950X may consume over 145 W under load. [35]
  3. ↑ Ryzen 7 3700X may consume 90 W under load. [36]
  1. 1 2 3 Model also available as PRO 3600, PRO 3700, PRO 3900, released on September 30, 2019 for OEMs.

Common features of Ryzen 3000 HEDT/workstation CPUs:

  • Socket: sTRX4 (Threadripper), sWRX8 (Threadripper PRO).
  • Threadripper CPUs support DDR4-3200 in quad-channel mode while Threadripper PRO CPUs support DDR4-3200 in octa-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Threadripper CPUs support 64 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
Branding and Model Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 TDP Chiplets Core
config [lower-roman 1] 		Release
date		 MSRP
BaseBoost
Ryzen
Threadripper
PRO		 3995WX 64 (128)2.74.2256 MB280 W
[lower-roman 2] 		8 × CCD
1 × I/OD		16 × 4Jul 14, 2020
3975WX 32 (64)3.5128 MB4 × CCD
1 × I/OD		8 × 4
3955WX 16 (32)3.94.364 MB2 × CCD
1 × I/OD		4 × 4
3945WX 12 (24)4.04 × 3
Ryzen
Threadripper		 3990X 64 (128)2.9256 MB8 × CCD
1 × I/OD		16 × 4Feb 7, 2020US $3990
3970X 32 (64)3.74.5128 MB4 × CCD
1 × I/OD		8 × 4Nov 25, 2019US $1999
3960X 24 (48)3.88 × 3US $1399
  1. ↑ Core Complexes (CCXs) × cores per CCX
  2. ↑ Ryzen Threadripper 3990X may consume over 490 W under load. [39]

4000 series (Renoir)

Based on the Ryzen 4000G series APUs but with the integrated graphics disabled. Common features of Ryzen 4000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
  • Bundled with AMD Wraith Stealth

The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock. [40] [41] [42]

Branding and model Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 TDP Core
config [lower-roman 1] 		Release
date		 MSRP
BaseBoost
AMD4800S [40] [41] 8 (16)4.08 MB2 × 42022bundled with desktop kit
4700S [42] 3.675 W2021
Ryzen 5 4500 6 (12)4.165 W2 × 3Apr 4, 2022US $129
Ryzen 3 4100 4 (8)3.84.04 MB1 × 4US $99
    1. ↑ Core Complexes (CCX) × cores per CCX

    Desktop APUs

    Initially only provided to OEM; later, AMD released retail Zen 2 desktop APUs in April 2022. [43] Common features of Ryzen 4000 desktop APUs:

    Branding and model CPU GPU TDP Release
    date    		 Release
    price
    Cores
    (threads)    		 Clock rate (GHz) L3 cache
    (total)    		Core
    Config [lower-roman 1]     		ModelClock
    (GHz)    		Config [lower-roman 2] Processing
    power [lower-roman 3]
    (GFLOPS)
    BaseBoost
    Ryzen 7 4700G [lower-alpha 1] 8 (16)3.64.48 MB2 × 4Radeon
    Graphics [lower-alpha 2]     		2.1512:32:16
    8 CU    		2150.465 WJul 21, 2020OEM
    4700GE [lower-alpha 1] 3.14.32.0204835 W
    Ryzen 5 4600G [lower-alpha 1] [44] 6 (12)3.74.22 × 31.9448:28:14
    7 CU    		1702.465 WJul 21, 2020
    (OEM) /
    Apr 4, 2022
    (retail)    		OEM /
    US $154
    4600GE [lower-alpha 1] 3.335 WJul 21, 2020OEM
    Ryzen 3 4300G [lower-alpha 1] 4 (8)3.84.04 MB1 × 41.7384:24:12
    6 CU    		1305.665 W
    4300GE [lower-alpha 1] 3.535 W
    1. ↑ Core complexes (CCXs) × cores per CCX
    2. ↑ Unified shaders  : Texture mapping units  : Render output units and Compute units (CU)
    3. ↑ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
    1. 1 2 3 4 5 6 Model also available as PRO version as 4350GE, [lower-alpha 3] 4350G, [lower-alpha 4] 4650GE, [lower-alpha 5] 4650G, [lower-alpha 6] 4750GE, [lower-alpha 7] 4750G, [lower-alpha 8] released on July 21, 2020 for OEM only. [lower-alpha 9]
    2. ↑ All of the iGPUs are branded as AMD Radeon Graphics.
    3. "AMD Ryzen 3 PRO 4350GE". AMD. Retrieved 18 October 2022.
    4. "AMD Ryzen 3 PRO 4350G". AMD. Retrieved 18 October 2022.
    5. "AMD Ryzen 3 PRO 4650GE". AMD. Retrieved 18 October 2022.
    6. "AMD Ryzen 3 PRO 4650G". AMD. Retrieved 18 October 2022.
    7. "AMD Ryzen 3 PRO 4750GE". AMD. Retrieved 18 October 2022.
    8. "AMD Ryzen 3 PRO 4750G". AMD. Retrieved 18 October 2022.
    9. "AMD Ryzen 4000 Series Desktop Processors with AMD Radeon Graphics Set to Deliver Breakthrough Performance for Commercial and Consumer Desktop PCs". AMD. 21 July 2020. Retrieved 18 October 2022.

    Mobile APUs

    Renoir (4000 series)

    Common features of Ryzen 4000 notebook APUs:

    Branding and Model CPU GPU TDP Release
    date
    Cores
    (threads)    		 Clock rate (GHz) L3 cache
    (total)    		Core
    config [lower-roman 1]     		ModelClock
    (GHz)    		Config [lower-roman 2] Processing
    power
    (GFLOPS) [lower-roman 3]
    BaseBoost
    Ryzen 9 4900H 8 (16)3.34.48 MB2 × 4Radeon
    Graphics
    [lower-alpha 1]     		1.75512:32:8
    8 CU    		179235–54 WMar 16, 2020
    4900HS 3.04.335 W
    Ryzen 7 4800H [45] 2.94.21.6448:28:8
    7 CU    		1433.635–54 W
    4800HS 35 W
    4980U [lower-alpha 2] 2.04.41.95512:32:8
    8 CU    		1996.810–25 WApr 13, 2021
    4800U 1.84.21.751792Mar 16, 2020
    4700U [lower-alpha 3] 8 (8)2.04.11.6448:28:8
    7 CU    		1433.6
    Ryzen 5 4600H [46] 6 (12)3.04.02 × 31.5384:24:8
    6 CU    		115235–54 W
    4600HS [47] 35 W
    4680U [lower-alpha 2] 2.1448:28:8
    7 CU    		134410–25 WApr 13, 2021
    4600U [lower-alpha 3] 384:24:8
    6 CU    		1152Mar 16, 2020
    4500U 6 (6)2.3
    Ryzen 3 4300U [lower-alpha 3] 4 (4)2.73.74 MB1 × 41.4320:20:8
    5 CU    		896
    1. ↑ Core Complexes (CCX) × cores per CCX
    2. ↑ Unified shaders  : texture mapping units  : render output units and compute units (CU)
    3. ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
    1. ↑ All of the iGPUs are branded as AMD Radeon Graphics.
    2. 1 2 Only found on the Microsoft Surface Laptop 4.
    3. 1 2 3 Model also available as PRO version as 4450U, [lower-alpha 4] 4650U, [lower-alpha 5] 4750U, [lower-alpha 6] released May 7, 2020.
    4. "AMD Ryzen 3 PRO 4450U". AMD.
    5. "AMD Ryzen 5 PRO 4650U". AMD.
    6. "AMD Ryzen 7 PRO 4750U". AMD.

    Lucienne (5000 series)

    Common features of Ryzen 5000 notebook APUs:

    Branding and Model CPU GPU TDP Release
    date
    Cores
    (threads)    		 Clock rate (GHz) L3 cache
    (total)    		Core
    config [lower-roman 1]     		ModelClock
    (GHz)    		Config [lower-roman 2] Processing
    power
    (GFLOPS) [lower-roman 3]
    BaseBoost
    Ryzen 7 5700U 8 (16)1.84.38 MB2 × 4Radeon
    Graphics
    [lower-alpha 1]     		1.9512:32:8
    8 CU    		1945.610–25 WJan 12, 2021
    Ryzen 5 5500U [48] 6 (12)2.14.02 × 31.8448:28:8
    7 CU    		1612.8
    Ryzen 3 5300U 4 (8)2.63.84 MB1 × 41.5384:24:8
    6 CU    		1152
    1. ↑ Core Complexes (CCX) × cores per CCX
    2. ↑ Unified shaders  : texture mapping units  : render output units and compute units (CU)
    3. ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
    1. ↑ All of the iGPUs are branded as AMD Radeon Graphics.

    Ultra-mobile APUs

    In 2022, AMD announced the Mendocino ultra-mobile APUs. [49]

    Common features of Ryzen 7020 notebook APUs:

    Branding and Model CPU GPU TDP Release
    date
    Cores
    (threads)    		 Clock rate (GHz) L3 cache
    (total)    		Core
    config [lower-roman 1]     		ModelClock
    (GHz)    		Processing
    power [lower-roman 2]
    (GFLOPS)
    BaseBoost
    Ryzen 5 7520U [lower-roman 3] 4 (8)2.84.34 MB1 × 4610M
    2 CU    		1.9486.415 WSeptember 20, 2022 [50]
    Ryzen 3 7320U [lower-roman 3] 2.44.1
    1. ↑ Core Complexes (CCX) × cores per CCX
    2. ↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
    3. 1 2 Model also available as Chromebook optimized version as 7520C [lower-roman 4] and 7320C [lower-roman 5] released on May 23, 2023
    4. "AMD Ryzen 5 7520C". AMD.
    5. "AMD Ryzen 3 7320C". AMD.

    Embedded APUs

    ModelRelease
    date    		 Fab CPU GPU Socket PCIe
    support    		 Memory
    support         		TDP
    Cores
    (threads)    		 Clock rate (GHz) Cache Archi-
    tecture         		Config [lower-roman 1] Clock
    (GHz)    		Processing
    power [lower-roman 2]
    (GFLOPS)
    BaseBoost L1 L2 L3
    V2516 [51] November 10, 2020 [52] TSMC
    7FF    		6 (12)2.13.9532 KB inst.
    32 KB data
    per core    		512 KB
    per core    		8 MB GCN 5 384:24:8
    6 CU    		1.51152FP620
    (8+4+4+4)
    PCIe 3.0     		DDR4-3200
    dual-channel
    LPDDR4X-4266
    quad-channel     		10–25 W
    V2546 [51] 3.03.9535–54 W
    V2718 [51] 8 (16)1.74.15448:28:8
    7 CU    		1.61433.610–25 W
    V2748 [51] 2.94.2535–54 W
    1. ↑ Unified Shaders  : Texture Mapping Units  : Render Output Units and Compute Units (CU)
    2. ↑ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

    Server CPUs

    Common features:

    Model Cores
    (threads)    		 Compute chiplets Core
    config [lower-roman 1]     		Clock rate (GHz) Cache SocketScaling TDP Release
    date    		Release
    price
    BaseBoost L1 L2 L3
    7232P8 (16)2 × CCD4 × 23.13.232 KiB
    i-cache
    32 KiB
    d-cache
    (per core)    		512 KiB
    (per core)    		32 MiB SP3 1P120 WAug 7, 2019$450
    72524 × 23.13.264 MiB2P$475
    72624 × CCD8 × 13.23.4128 MiB155 W$575
    7F328 × 13.73.9128 MiB180 WApr 14, 2020 [53] $2100
    727212 (24)2 × CCD4 × 32.93.264 MiB
    		2P120 WAug 7, 2019$625
    728216 (32)2 × CCD4 × 42.83.264 MiB
    		$650
    7302P4 × CCD8 × 233.3128 MiB1P155 W$825
    73022P$978
    7F528 × CCD16 × 13.53.9256 MiB240 WApr 14, 2020 [53] $3100
    735224 (48)4 × CCD8 × 32.33.2128 MiB
    		2P155 WAug 7, 2019$1350
    7402P2.83.351P180 W$1250
    74022P$1783
    7F726 × CCD12 × 23.23.7192 MiB240 WApr 14, 2020 [53] $2450
    745232 (64)4 × CCD8 × 42.353.35128 MiB
    		2P155 WAug 7, 2019$2025
    7502P2.53.351P180 W$2300
    75022P$2600
    75422.93.4225 W$3400
    75328 × CCD16 × 22.43.3256 MiB200 W$3350
    755248 (96)6 × CCD12 × 42.23.3192 MiB2P200 W$4025
    76428 × CCD16 × 32.33.3256 MiB225 W$4775
    766264 (128)8 × CCD16 × 423.3256 MiB2P225 W$6150
    7702P23.351P200 W$4425
    77022P$6450
    77422.253.4225 W$6950
    7H122.63.3280 WSep 18, 2019
    1. ↑ Core Complexes (CCX) × cores per CCX

    Video game consoles and other embedded

    See also

    Related Research Articles

    <span class="mw-page-title-main">Multi-chip module</span> Electronic assembly containing multiple integrated circuits that behaves as a unit

    A multi-chip module (MCM) is generically an electronic assembly where multiple integrated circuits, semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach.

    <span class="mw-page-title-main">AMD APU</span> Series of microprocessors by AMD

    AMD Accelerated Processing Unit (APU), formerly known as Fusion, is a series of 64-bit microprocessors from Advanced Micro Devices (AMD), combining a general-purpose AMD64 central processing unit (CPU) and 3D integrated graphics processing unit (IGPU) on a single die.

    Zen is a family of computer processor microarchitectures from AMD, first launched in February 2017 with the first generation of its Ryzen CPUs. It is used in Ryzen, Ryzen Threadripper, and Epyc (server).

    <span class="mw-page-title-main">Zen (first generation)</span> 2017 AMD 14-nanometer processor microarchitecture

    Zen is the first iteration in the Zen family of computer processor microarchitectures from AMD. It was first used with their Ryzen series of CPUs in February 2017. The first Zen-based preview system was demonstrated at E3 2016, and first substantially detailed at an event hosted a block away from the Intel Developer Forum 2016. The first Zen-based CPUs, codenamed "Summit Ridge", reached the market in early March 2017, Zen-derived Epyc server processors launched in June 2017 and Zen-based APUs arrived in November 2017.

    <span class="mw-page-title-main">Ryzen</span> AMD brand for microprocessors

    Ryzen is a brand of multi-core x86-64 microprocessors designed and marketed by Advanced Micro Devices (AMD) for desktop, mobile, server, and embedded platforms based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream, enthusiast, server, and workstation segments and accelerated processing units (APUs) marketed for mainstream and entry-level segments and embedded systems applications.

    Zen+ is the name for a computer processor microarchitecture by AMD. It is the successor to the first gen Zen microarchitecture, and was first released in April 2018, powering the second generation of Ryzen processors, known as Ryzen 2000 for mainstream desktop systems, Threadripper 2000 for high-end desktop setups and Ryzen 3000G for accelerated processing units (APUs).

    <span class="mw-page-title-main">Epyc</span> AMD brand for server microprocessors

    Epyc is a brand of multi-core x86-64 microprocessors designed and sold by AMD, based on the company's Zen microarchitecture. Introduced in June 2017, they are specifically targeted for the server and embedded system markets.

    The Radeon RX Vega series is a series of graphics processors developed by AMD. These GPUs use the Graphics Core Next (GCN) 5th generation architecture, codenamed Vega, and are manufactured on 14 nm FinFET technology, developed by Samsung Electronics and licensed to GlobalFoundries. The series consists of desktop graphics cards and APUs aimed at desktops, mobile devices, and embedded applications.

    <span class="mw-page-title-main">Threadripper</span> Brand of microprocessors

    Threadripper, or Ryzen Threadripper, is a brand of HEDT and workstation multi-core x86-64 microprocessors designed and marketed by Advanced Micro Devices (AMD), and based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream and workstation segments, and as such comes in two line-ups, Threadripper and Threadripper PRO respectively.

    <span class="mw-page-title-main">Zen 4</span> 2022 AMD 5-nanometer processor microarchitecture

    Zen 4 is the name for a CPU microarchitecture designed by AMD, released on September 27, 2022. It is the successor to Zen 3 and uses TSMC's N6 process for I/O dies, N5 process for CCDs, and N4 process for APUs. Zen 4 powers Ryzen 7000 performance desktop processors, Ryzen 8000G series mainstream desktop APUs, and Ryzen Threadripper 7000 series HEDT and workstation processors. It is also used in extreme mobile processors, thin & light mobile processors, as well as EPYC 8004/9004 server processors.

    <span class="mw-page-title-main">Zen 5</span> 2024 AMD 4-nanometer processor microarchitecture

    Zen 5 is the name for a CPU microarchitecture by AMD, shown on their roadmap in May 2022, launched for mobile in July 2024 and for desktop in August 2024. It is the successor to Zen 4 and is currently fabricated on TSMC's N4X process. Zen 5 is also planned to be fabricated on the N3E process in the future.

    <span class="mw-page-title-main">Zen 3</span> 2020 AMD 7-nanometer processor microarchitecture

    Zen 3 is the name for a CPU microarchitecture by AMD, released on November 5, 2020. It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. Zen 3 powers Ryzen 5000 mainstream desktop processors and Epyc server processors. Zen 3 is supported on motherboards with 500 series chipsets; 400 series boards also saw support on select B450 / X470 motherboards with certain BIOSes. Zen 3 is the last microarchitecture before AMD switched to DDR5 memory and new sockets, which are AM5 for the desktop "Ryzen" chips alongside SP5 and SP6 for the EPYC server platform and sTRX8. According to AMD, Zen 3 has a 19% higher instructions per cycle (IPC) on average than Zen 2.

    References

    1. ↑ "AMD Unleashes Ultimate PC Gaming Platform with Worldwide Availability of AMD Radeon RX 5700 Series Graphics Cards and AMD Ryzen 3000 Series Desktop Processors". AMD (Press release). Santa Clara, California. 7 July 2019. Retrieved 7 November 2020.
    2. ↑ Larabel, Michael (16 May 2017). "AMD Talks Up Vega Frontier Edition, Epyc, Zen 2, ThreadRipper". Phoronix. Retrieved 16 May 2017.
    3. 1 2 Cutress, Ian (20 June 2017). "AMD EPYC Launch Event Live Blog". AnandTech. Retrieved 21 June 2017.
    4. ↑ Boshor, Gavin (20 September 2022). "AMD Launches Mendocino APUs: Zen 2-based Ryzen and Athlon 7020 Series with RDNA 2 Graphics". AnandTech. Retrieved 26 September 2022.
    5. ↑ "Zen 2 - Microarchitectures - AMD". WikiChip. Retrieved 14 June 2020.
    6. 1 2 Cutress, Ian (9 January 2019). "AMD Ryzen third Gen 'Matisse' Coming Mid 2019: Eight Core Zen 2 with PCIe 4.0 on Desktop". AnandTech. Retrieved 15 January 2019.
    7. ↑ online, heise (27 May 2019). "AMD Ryzen 3000: 12-Kernprozessoren für den Mainstream". c't Magazin.
    8. 1 2 Leather, Antony (7 July 2019). "AMD Ryzen 9 3900X and Ryzen 7 3700X Review: Old Ryzen Owners Look Away Now". Forbes. Retrieved 13 April 2023.
    9. ↑ Ridley, Jacob (27 May 2019). "AMD Ryzen 3000 CPUs launching July 7 with up to 12 cores". PCGamesN. Retrieved 28 May 2019.
    10. 1 2 "2nd Gen AMD EPYC Processors Set New Standard for the Modern Datacenter with Record-Breaking Performance and Significant TCO Savings". AMD. 7 August 2019. Retrieved 8 August 2019.
    11. ↑ Hachman, Mark (9 January 2019). "AMD's CEO Lisa Su confirms ray tracing GPU development, hints at more 3rd-gen Ryzen cores". PCWorld. Retrieved 15 January 2019.
    12. ↑ Curtress, Ian (26 May 2019). "AMD Ryzen 3000 Announced: Five CPUs, 12 Cores for $499, Up to 4.6 GHz, PCIe 4.0, Coming 7/7". AnandTech. Retrieved 3 July 2019.
    13. ↑ Thomas, Bill (10 June 2019). "AMD announces the Ryzen 9 3950X, a 16-core mainstream processor". TechRadar. Retrieved 3 July 2019.
    14. ↑ Alcorn, Paul (31 January 2018). "AMD Predicts Double-Digit Revenue Growth In 2018, Ramps Up GPU Production". Tom's Hardware. Retrieved 31 January 2018.
    15. 1 2 Shilov, Anton (6 November 2018). "AMD Unveils 'Chiplet' Design Approach: 7nm Zen 2 Cores Meet 14 nm I/O Die". AnandTech. Retrieved 13 April 2023.
    16. ↑ Cutress, Ian (10 June 2019). "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". AnandTech. Retrieved 13 April 2023.
    17. ↑ Walton, Steven (16 November 2020). "AMD Ryzen 5000 IPC Performance Tested". TechSpot. Retrieved 18 April 2021.
    18. ↑ Hollister, Sean (13 November 2021). "Steam Deck: Five big things we learned from Valve's developer summit". The Verge. Retrieved 13 April 2023.
    19. ↑ "Steam Deck :: Tech Specs".
    20. ↑ Warren, Tom (24 February 2020). "Microsoft reveals more Xbox Series X specs, confirms 12 teraflops GPU". The Verge. Retrieved 24 February 2020.
    21. ↑ Leadbetter, Richard (18 March 2020). "Inside PlayStation 5: the specs and the tech that deliver Sony's next-gen vision". Eurogamer. Retrieved 18 March 2020.
    22. 1 2 3 Cutress, Ian (10 June 2019). "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". AnandTech. p. 1. Retrieved 17 June 2019.
    23. ↑ De Gelas, Johan (7 August 2019). "AMD Rome Second Generation EPYC Review: 2x 64-core Benchmarked". AnandTech. Retrieved 29 September 2019.
    24. ↑ November 2019, Paul Alcorn 21 (21 November 2019). "AMD Ryzen 9 3900X and Ryzen 7 3700X Review: Zen 2 and 7nm Unleashed". Tom's Hardware.{{cite web}}: CS1 maint: numeric names: authors list (link)
    25. ↑ Cutress, Ian (10 June 2019). "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". AnandTech. Retrieved 17 June 2019.
    26. ↑ Cutress, Ian (10 June 2019). "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". AnandTech. Retrieved 17 June 2019.
    27. ↑ Schor, David (22 July 2018). "VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP".
    28. ↑ Mujtaba, Hassan (24 December 2019). "AMD Ryzen Threadripper 3970X Is An Absolutely Efficient Monster CPU".
    29. ↑ "AMD Zen 2 CPUs Come With A Few New Instructions - At Least WBNOINVD, CLWB, RDPID - Phoronix". www.phoronix.com.
    30. ↑ "GNU Binutils Adds Bits For AMD Zen 2's RDPRU + MCOMMIT Instructions - Phoronix". www.phoronix.com.
    31. ↑ btarunr (12 June 2019). "AMD Zen 2 has Hardware Mitigation for Spectre V4". TechPowerUp. Retrieved 18 October 2019.
    32. ↑ Agner, Fog. "Surprising new feature in AMD Ryzen 3000". Agner's CPU blog.
    33. ↑ Cutress, Ian (10 June 2019). "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". AnandTech. Retrieved 12 January 2023.
    34. ↑ Cutress, Ian (26 May 2019). "AMD Ryzen 3000 Announced: Five CPUs, 12 Cores for $499, Up to 4.6 GHz, PCIe 4.0, Coming 7/7". AnandTech. Retrieved 17 June 2019.
    35. ↑ Alcorn, Paul (14 November 2019). "Tom's Hardware Ryzen 9 3950X review". Tom's Hardware. Retrieved 12 May 2020.
    36. ↑ Alcorn, Paul (31 December 2020). "AMD Ryzen 9 3900X and Ryzen 7 3700X Review: Zen 2 and 7nm Unleashed". Tom's Hardware. Retrieved 16 April 2024.
    37. ↑ Cutress, Ian (8 October 2019). "AMD Brings Ryzen 9 3900 and Ryzen 5 3500X To Life". AnandTech.
    38. ↑ Syed, Areej (17 February 2020). "AMD Launches Ryzen 5 3500 in Japan with 6 Cores/6 Threads for 16K Yen". Hardware Times.
    39. ↑ Hill, Luke (7 February 2020). "Kitguru AMD Ryzen Threadripper 3990X CPU Review". KitGuru. Retrieved 12 May 2020.
    40. 1 2 Leadbetter, Richard; Judd, Will (30 July 2023). "AMD 4800S Desktop Kit review: playing PC games on the Xbox Series X CPU". Eurogamer. Retrieved 20 September 2023.
    41. 1 2 WhyCry (31 July 2023). "AMD 4800S Desktop Kit, a PC repurposed APU from Xbox Series X has been tested". VideoCardz. Retrieved 20 September 2023.
    42. 1 2 Alcorn, Paul (10 October 2021). "AMD 4700S Review: Defective PlayStation 5 Chips Resurrected". Tom's Hardware. Retrieved 7 July 2023.
    43. ↑ https://www.techpowerup.com/cpu-specs/ryzen-5-4600g.c2319
    44. ↑ "AMD Spring 2022 Ryzen Desktop Processor Update Includes Six New Models Besides 5800X3D". TechPowerUp. 16 March 2022. Retrieved 8 March 2024.
    45. ↑ "AMD Ryzen 7 4800H Specs". TechPowerUp. Retrieved 17 September 2021.
    46. ↑ "AMD Ryzen 5 4600H Specs". TechPowerUp. Retrieved 17 September 2021.
    47. ↑ "AMD Ryzen 5 4600HS". AMD.[ dead link ]
    48. ↑ "AMD Ryzen 5 5500U Specs". TechPowerUp. Retrieved 17 September 2021.
    49. ↑ "AMD Details 7020 Series Ryzen and Athlon 'Mendocino' Mobile APUs". Tom's Hardware. 20 September 2022.
    50. ↑ "AMD Ryzen 7020 Series Processors for Mobile Bring High-End Performance and Long Battery Life to Everyday Users". 20 September 2022. Retrieved 21 September 2022.
    51. 1 2 3 4 "Product Brief: AMD Ryzen Embedded V2000 Processor Family" (PDF). AMD.
    52. ↑ "AMD Unveils AMD Ryzen Embedded V2000 Processors with Enhanced Performance and Power Efficiency". AMD.
    53. 1 2 3 "New 2nd Gen AMD EPYC™ Processors Redefine Performance for Database, Commercial HPC and Hyperconverged Workloads". AMD. 14 April 2020.
    54. ↑ "AMD 4700S 8-Core Processor Desktop Kit". AMD. Retrieved 26 September 2022.
    This page is based on this Wikipedia article
    Text is available under the CC BY-SA 4.0 license; additional terms may apply.
    Images, videos and audio are available under their respective licenses.