List of AMD Ryzen processors

The Ryzen family is an x86-64 microprocessor family from AMD, based on the Zen microarchitecture. The Ryzen lineup includes Ryzen 3, Ryzen 5, Ryzen 7, Ryzen 9, and Ryzen Threadripper with up to 96 cores. All consumer desktop Ryzens (except PRO models) and all mobile processors with the HX suffix have an unlocked multiplier. In addition, all support Simultaneous Multithreading (SMT) except earlier Zen/Zen+ based desktop and mobile Ryzen 3, and some models of Zen 2 based mobile Ryzen.

Desktop processors

Ryzen 1000 series

Summit Ridge (1000 series, Zen based)

Common features of Ryzen 1000 desktop CPUs:

• Socket: AM4.
• All the CPUs support DDR4-2666 in dual-channel mode.
• All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
• No integrated graphics.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• Node/fabrication process: GlobalFoundries 14 LP.

Branding and Model		Cores (threads)	Clock rate (GHz)			L3 cache (total)	TDP	Core config [i]	Release date	Launch price [a]
			Base	PBO 1–2 (≥3)	XFR [1] 1–2
Ryzen 7	1800X [2]	8 (16)	3.6	4.0 (3.7)	4.1	16 MB	95 W	2 × 4	March 2, 2017	US $499
	PRO 1700X		3.4	3.8 (3.5)	3.9				June 29, 2017	OEM
	1700X [2]								March 2, 2017	US $399
	PRO 1700		3.0	3.7 (3.2)	3.75		65 W		June 29, 2017	OEM
	1700 [2]								March 2, 2017	US $329
Ryzen 5	1600X [3]	6 (12)	3.6	4.0 (3.7)	4.1		95 W	2 × 3	April 11, 2017	US $249
	PRO 1600		3.2	3.6 (3.4)	3.7		65 W		June 29, 2017	OEM
	1600 [3]								April 11, 2017	US $219
	1500X [3]	4 (8)	3.5	3.7 (3.6)	3.9			2 × 2		US $189
	PRO 1500								June 29, 2017	OEM
	1400 [3]		3.2	3.4 (3.4)	3.45	8 MB			April 11, 2017	US $169
Ryzen 3	1300X [4]	4 (4)	3.5	3.7 (3.5)	3.9				July 27, 2017	US $129
	PRO 1300								June 29, 2017	OEM
	PRO 1200		3.1	3.4 (3.1)	3.45
	1200 [4]								July 27, 2017	US $109

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1. Manufacturer suggested retail price at launch

1. Core Complexes (CCX) × cores per CCX

Whitehaven (Threadripper 1000 series, Zen based)

Common features of Ryzen 1000 HEDT CPUs:

• Socket: TR4.
• All the CPUs support DDR4-2666 in quad-channel mode.
• All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
• No integrated graphics.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• Node/fabrication process: GlobalFoundries 14LP.

Branding and Model		Cores (threads)	Clock rate (GHz)			L3 cache (total)	TDP	Chiplets	Core config [i]	Release date	Launch price [a]
			Base	PBO 1–4 (≥5)	XFR [1] 1–2
Ryzen Threadripper	1950X [5]	16 (32)	3.4	4.0 (3.7)	4.2	32 MB	180 W	2 × CCD [ii]	4 × 4	August 10, 2017	US $999
	1920X [5]	12 (24)	3.5						4 × 3		US $799
	1900X [5]	8 (16)	3.8	4.0 (3.9)		16 MB			2 × 4	August 31, 2017	US $549

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1. Manufacturer suggested retail price at launch

1. Core Complexes (CCX) × cores per CCX
2. Processor package actually contains two additional inactive dies to provide structural support to the integrated heat spreader.

Ryzen 2000 series

Raven Ridge (2000 series with Radeon Graphics, Zen/GCN5 based)

Common features of Ryzen 2000 desktop APUs:

• Socket: AM4.
• All the CPUs support DDR4-2933 in dual-channel mode.
• All the CPUs support 16 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated GCN 5th generation GPU.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• Fabrication process: GlobalFoundries 14LP.

Branding and Model		CPU				GPU				TDP	Release date	Launch price [a]
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Model	Clock (GHz)	Config [i]	Processing power (GFLOPS) [ii]
			Base	Boost
Ryzen 5	2400G [6] [b]	4 (8)	3.6	3.9	4 MB	RX Vega 11	1.25	704:44:16 11 CU	1760	46–65 W	February 12, 2018	US $169
	2400GE [b]		3.2	3.8						35 W	April 19, 2018	OEM
Ryzen 3	2200G [6] [b]	4 (4)	3.5	3.7		Vega 8	1.1	512:32:16 8 CU	1126	46–65 W	February 12, 2018	US $99
	2200GE [b]		3.2	3.6						35 W	April 19, 2018	OEM
	PRO 2100GE [7]	2 (4)		—		Vega 3	1.0	192:12:4 3 CU [8]	384		2019

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1. Unified Shaders  : Texture Mapping Units  : Render Output Units and Compute Units (CU)
2. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

1. Manufacturer suggested retail price at launch
2. Model also available as PRO version; 2200GE, 2200G, 2400GE, 2400G, released on May 14, 2018 for OEM only. ^[9]

Pinnacle Ridge (2000 series, Zen+ based)

Common features of Ryzen 2000 desktop CPUs:

• Socket: AM4.
• All the CPUs support DDR4-2933 in dual-channel mode, except for R7 2700E, R5 2600E, R5 1600AF and R3 1200AF which support it at DDR4-2666 speeds.
• All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
• No integrated graphics.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• Fabrication process: GlobalFoundries 12LP (14LP+).

Branding and Model		Cores (threads)	Clock rate (GHz)		L3 cache (total)	TDP	Core config [i]	Release date	Launch price [a]
			Base	PB2
Ryzen 7	2700X [10] [b]	8 (16)	3.7	4.3	16 MB	105 W	2 × 4	April 19, 2018	US $329
	2700 [10] [b]		3.2	4.1		65 W			US $299
	2700E		2.8	4.0		45 W		September 19, 2018	OEM
Ryzen 5	2600X [10]	6 (12)	3.6	4.2		95 W	2 × 3	April 19, 2018	US $229
	2600 [10] [b]		3.4	3.9		65 W			US $199
	2600E		3.1	4.0		45 W		September 19, 2018	OEM
	1600 (AF) [14] [c]		3.2	3.6		65 W		October 11, 2019 [15]	US $85
	2500X	4 (8)	3.6	4.0	8 MB		1 × 4	September 10, 2018	OEM
Ryzen 3	2300X	4 (4)	3.5
	1200 (AF) [16] [c]		3.1	3.4				April 21, 2020	US $60

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1. Core Complexes (CCX) × cores per CCX

1. Manufacturer suggested retail price at launch
2. Model also available as PRO version as 2600 ^[11] , 2700 ^[12] , 2700X ^[13] , released on September 19, 2018.
3. AF models are 12 nm Zen+ refresh of 14 nm Zen models (1200 ^[17] and 1600 ^[18] with "AF" instead of "AE" in the part numbers).

Colfax (Threadripper 2000 series, Zen+ based)

Common features of Ryzen 2000 HEDT CPUs:

• Socket: TR4.
• All the CPUs support DDR4-2933 in quad-channel mode.
• All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
• No integrated graphics.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• Fabrication process: GlobalFoundries 12LP (14LP+).

Branding and Model		Cores (threads)	Clock rate (GHz)		L3 cache (total)	TDP	Chiplets	Core config [i]	Release date	Launch price [a]
			Base	PB2
Ryzen Threadripper	2990WX [19]	32 (64)	3.0	4.2	64 MB	250 W	4 × CCD	8 × 4	Aug 13, 2018	US $1799
	2970WX [19]	24 (48)						8 × 3	Oct 2018	US $1299
	2950X [19]	16 (32)	3.5	4.4	32 MB	180 W	2 × CCD	4 × 4	Aug 31, 2018	US $899
	2920X [19]	12 (24)		4.3				4 × 3	Oct 2018	US $649

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1. Manufacturer suggested retail price at launch

1. Core Complexes (CCX) × cores per CCX

Ryzen 3000 series

Picasso (3000 series with Radeon Graphics, Zen+/GCN5 based)

Common features of Ryzen 3000 desktop APUs:

• Socket: AM4.
• All the CPUs support DDR4-2933 in dual-channel mode.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: GlobalFoundries 12LP (14LP+).

Branding and Model		CPU				GPU				TDP	Release date	MSRP
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Model	Clock (GHz)	Config [i]	Processing power (GFLOPS) [ii]
			Base	Boost
Ryzen 5	PRO 3400G	4 (8)	3.7	4.2	4 MB	Radeon RX Vega 11	1.4	704:44:8 11 CU	1971.2	65 W	Sep 30, 2019	OEM
	3400G [20]										Jul 7, 2019	US $149
	PRO 3400GE		3.3	4.0			1.3		1830.4	35 W	Sep 30, 2019	OEM
	PRO 3350G		3.6			Radeon Vega 10		640:40:8 10 CU	1664	65 W	Jul 21, 2020
	PRO 3350GE	4 (4)	3.3	3.9			1.2		1536	35 W
Ryzen 3	PRO 3200G		3.6	4.0		Radeon Vega 8	1.25	512:32:8 8 CU	1280	65 W	Sep 30, 2019
	3200G [20]										Jul 7, 2019	US $99
	3200GE		3.3	3.8			1.2		1228.8	35 W	Jul 7, 2019	OEM
	PRO 3200GE										Sep 30, 2019

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1. Unified shaders  : Texture mapping units  : Render output units and Compute units (CU)
2. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Matisse (3000 series, Zen 2 based)

Common features of Ryzen 3000 desktop CPUs:

• Socket: AM4.
• All the CPUs support DDR4-3200 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
• No integrated graphics.
• Fabrication process: TSMC 7FF.

Branding and Model		Cores (threads)	Thermal Solution	Clock rate (GHz)		L3 cache (total)	TDP	Chiplets [i]	Core config [ii]	Release date	MSRP
				Base	Boost
Ryzen 9	3950X	16 (32)	N/A	3.5	4.7	64 MB	105 W [iii]	2 × CCD 1 × I/OD	4 × 4	Nov 25, 2019	US $749
	3900XT	12 (24)		3.8					4 × 3	Jul 7, 2020	US $499
	3900X		Wraith Prism		4.6					Jul 7, 2019
	3900 [a]		OEM	3.1	4.3		65 W			Oct 8, 2019	OEM
Ryzen 7	3800XT	8 (16)	N/A	3.9	4.7	32 MB	105 W	1 × CCD 1 × I/OD	2 × 4	Jul 7, 2020	US $399
	3800X		Wraith Prism		4.5					Jul 7, 2019
	3700X [a]			3.6	4.4		065 W [iv]				US $329
Ryzen 5	3600XT	6 (12)	N/A	3.8	4.5		95 W		2 × 3	Jul 7, 2020	US $249
	3600X		Wraith Spire (non-LED)		4.4					Jul 7, 2019
	3600 [a]		Wraith Stealth	3.6	4.2		65 W				US $199
	3500X [23]	6 (6)			4.1					Oct 8, 2019	China ¥1099
	3500		OEM			16 MB				Nov 15, 2019	OEM (West) Japan ¥16000 [24]
Ryzen 3	3300X	4 (8)	Wraith Stealth	3.8	4.3				1 × 4	Apr 21, 2020	US $119
	3100			3.6	3.9				2 × 2		US $99

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1. A Core Complex Die contains 1-2 Core Complexes (CCXs).
2. Core Complexes (CCXs) × cores per CCX
3. Ryzen 9 3900X and Ryzen 9 3950X may consume over 145 W under load. ^[21]
4. Ryzen 7 3700X may consume 90 W under load. ^[22]

1. Model also available as PRO 3600, PRO 3700, PRO 3900, released on September 30, 2019 for OEMs.

Castle Peak (Threadripper 3000 series, Zen 2 based)

Common features of Ryzen 3000 HEDT/workstation CPUs:

• Socket: sTRX4 (Threadripper), sWRX8 (Threadripper PRO).
• Threadripper CPUs support DDR4-3200 in quad-channel mode while Threadripper PRO CPUs support DDR4-3200 in octa-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• Threadripper CPUs support 64 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
• No integrated graphics.
• Fabrication process: TSMC 7FF.

Branding and Model		Cores (threads)	Clock rate (GHz)		L3 cache (total)	TDP	Chiplets	Core config [i]	Release date	MSRP
			Base	Boost
Ryzen Threadripper PRO	3995WX	64 (128)	2.7	4.2	256 MB	280 W [ii]	8 × CCD 1 × I/OD	16 × 4	Jul 14, 2020
	3975WX	32 (64)	3.5		128 MB		4 × CCD 1 × I/OD	8 × 4
	3955WX	16 (32)	3.9	4.3	64 MB		2 × CCD 1 × I/OD	4 × 4
	3945WX	12 (24)	4.0					4 × 3
Ryzen Threadripper	3990X	64 (128)	2.9		256 MB		8 × CCD 1 × I/OD	16 × 4	Feb 7, 2020	US $3990
	3970X	32 (64)	3.7	4.5	128 MB		4 × CCD 1 × I/OD	8 × 4	Nov 25, 2019	US $1999
	3960X	24 (48)	3.8					8 × 3		US $1399

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1. Core Complexes (CCXs) × cores per CCX
2. Ryzen Threadripper 3990X may consume over 490 W under load. ^[25]

Ryzen 4000 series

Renoir (4000 series, Zen 2 based)

Based on the Ryzen 4000G series APUs with the integrated GPU disabled. Common features of Ryzen 4000 desktop CPUs:

• Socket: AM4.
• All the CPUs support DDR4-3200 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
• No integrated graphics.
• Fabrication process: TSMC 7FF.
• Bundled with AMD Wraith Stealth

The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock. ^{[26] [27] [28]}

Branding and model		Cores (threads)	Clock rate (GHz)		L3 cache (total)	TDP	Core config [i]	Release date	MSRP
			Base	Boost
AMD	4800S [26] [27]	8 (16)		4.0	8 MB		2 × 4	2022	bundled with desktop kit
	4700S [28]		3.6			75 W		2021
Ryzen 5	4500	6 (12)		4.1		65 W	2 × 3	Apr 4, 2022	US $129
Ryzen 3	4100	4 (8)	3.8	4.0	4 MB		1 × 4		US $99

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1. Core Complexes (CCX) × cores per CCX

Renoir (4000 series with Radeon Graphics, Zen 2/GCN5 based)

Common features of Ryzen 4000 desktop APUs:

• Socket: AM4.
• All the CPUs support DDR4-3200 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: TSMC 7FF.

Branding and model		CPU					GPU				TDP	Release date	Release price
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core Config [i]	Model	Clock (GHz)	Config [ii]	Processing power [iii] (GFLOPS)
			Base	Boost
Ryzen 7	4700G [a]	8 (16)	3.6	4.4	8 MB	2 × 4	Radeon Graphics [b]	2.1	512:32:16 8 CU	2150.4	65 W	Jul 21, 2020	OEM
	4700GE [a]		3.1	4.3				2.0		2048	35 W
Ryzen 5	4600G [a] [29]	6 (12)	3.7	4.2		2 × 3		1.9	448:28:14 7 CU	1702.4	65 W	Jul 21, 2020 (OEM) / Apr 4, 2022 (retail)	OEM / US $154
	4600GE [a]		3.3								35 W	Jul 21, 2020	OEM
Ryzen 3	4300G [a]	4 (8)	3.8	4.0	4 MB	1 × 4		1.7	384:24:12 6 CU	1305.6	65 W
	4300GE [a]		3.5								35 W

• v
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• e

1. Core complexes (CCXs) × cores per CCX
2. Unified shaders  : Texture mapping units  : Render output units and Compute units (CU)
3. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

1. Model also available as PRO version as 4350GE, ^[30] 4350G, ^[31] 4650GE, ^[32] 4650G, ^[33] 4750GE, ^[34] 4750G, ^[35] released on July 21, 2020 for OEM only. Refresh models 4355GE, 4355G, 4655GE, 4655G released November 11, 2022. ^[36]
2. All of the iGPUs are branded as AMD Radeon Graphics.

Ryzen 5000 series

Vermeer (5000 series, Zen 3 based)

Common features of Ryzen 5000 desktop CPUs:

• Socket: AM4.
• All the CPUs support DDR4-3200 in dual-channel mode.
• All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
• No integrated graphics.
• L1 cache: 64 KB per core (32 KB data + 32 KB instruction).
• L2 cache: 512 KB per core.
• Fabrication process: TSMC 7FF.

Branding and model		Cores (threads)	Thermal solution	Clock rate (GHz)		L3 cache (total)	TDP	Chiplets	Core config [i]	Release date	MSRP
				Base	Boost
Ryzen 9	5950X	16 (32)	—	3.4	4.9	64 MB	105 W	2 × CCD 1 × I/OD	2 × 8	Nov 5, 2020	US $799
	5900XT			3.3	4.8					Jul 31, 2024	US $349
	5900X	12 (24)		3.7					2 × 6	Nov 5, 2020	US $549
	5900			3.0	4.7		65 W			Jan 12, 2021	OEM
	PRO 5945									Sep 2022 [37]
Ryzen 7	5800X3D	8 (16)		3.4	4.5	96 MB	105 W	1 × CCD 1 × I/OD	1 × 8	Apr 20, 2022	US $449
	5800XT		Wraith Prism	3.8	4.8	32 MB				Jul 31, 2024	US $249
	5800X		—		4.7					Nov 5, 2020	US $449
	5800			3.4	4.6		65 W			Jan 12, 2021	OEM
	5700X3D			3.0	4.1	96 MB	105 W			Jan 31, 2024 [38]	US $249
	5700X			3.4	4.6	32 MB	65 W			Apr 4, 2022	US $299
	PRO 5845									Sep 2022	OEM
Ryzen 5	5600X3D	6 (12)		3.3	4.4	96 MB	105 W		1 × 6	Jul 7, 2023 US Only [39]	US $229 [40]
	5600XT		Wraith Stealth	3.7	4.7	32 MB	65 W			Oct 31, 2024	US $194 [41]
	5600X			3.7	4.6					Nov 5, 2020	US $299
	5600T			3.5	4.5					Oct 31, 2024	US $186 [41]
	5600			3.5	4.4					Apr 4, 2022	US $199
	PRO 5645		—	3.7	4.6					Sep 2022	OEM
	5500X3D			3.0	4.0	96 MB	105 W			Jun 5, 2025	LATAM Only [42]

• v
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1. Core Complexes (CCX) × cores per CCX

Cezanne (5000 series, Zen 3 based)

Cezanne based CPUs that have the integrated GPU disabled. Common features of Ryzen 5000 (Cezanne) desktop CPUs:

• Socket: AM4.
• CPUs support DDR4-3200 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
• No integrated graphics.
• Fabrication process: TSMC 7FF.

Branding and model		Cores (threads)	Thermal solution	Clock rate (GHz)		L3 cache (total)	TDP	Core config [i]	Release date	MSRP (USD)
				Base	Boost
Ryzen 7	5700 [43]	8 (16)	Wraith Stealth	3.7	4.6	16 MB	65 W	1 × 8	Apr 4, 2022 (OEM), Dec 21, 2023 (retail)	$179
Ryzen 5	5500	6 (12)		3.6	4.2			1 × 6	Apr 4, 2022	$159
Ryzen 3	5100 [44] [45] [46]	4 (8)	–	3.8		8 MB		1 × 4	2023	OEM

• v
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1. Core Complexes (CCX) × cores per CCX

Cezanne (5000 series with Radeon Graphics, Zen 3/GCN5 based)

Common features of Ryzen 5000 desktop APUs:

• Socket: AM4.
• All the CPUs support DDR4-3200 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: TSMC 7FF.

Branding and model		CPU					GPU [a]			Thermal solution	TDP	Release date	MSRP
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config [i]	Clock (MHz)	Config [ii]	Processing power [iii] (GFLOPS)
			Base	Boost
Ryzen 7	5705G	8 (16)	3.8	4.6	16 MB	1 × 8	2000	512:32:8 8 CU	2048	—	65 W
	5700G [b]									Wraith Stealth		Apr 13, 2021 (OEM), Aug 5, 2021 (retail)	US $359
	5705GE		3.2							—	35 W
	5700GE [b]									Wraith Stealth		Apr 13, 2021	OEM
Ryzen 5	5600GT	6 (12)	3.6			1 × 6	1900	448:28:8 7 CU	1702.4		65 W	Jan 31, 2024 [47]	US $140
	5605G		3.9	4.4						—
	5600G [b]									Wraith Stealth		Apr 13, 2021 (OEM), Aug 5, 2021 (retail)	US $259
	5605GE		3.4							—	35 W
	5600GE [b]									Wraith Stealth		Apr 13, 2021	OEM
	5500GT		3.6								65 W	Jan 31, 2024 [47]	US $125
Ryzen 3	5305G	4 (8)	4.0	4.2	8 MB	1 × 4	1700	384:24:8 6 CU	1305.6	—
	5300G [b]									OEM		Apr 13, 2021	OEM
	5305GE		3.6							—	35 W
	5300GE [b]									OEM		Apr 13, 2021	OEM

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX
2. Unified shaders  : texture mapping units  : render output units and compute units (CU)
3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

1. All of the iGPUs are branded as AMD Radeon Graphics.
2. Model also available as PRO version as 5350GE, ^[48] 5350G, ^[49] 5650GE, ^[50] 5650G, ^[51] 5750GE, ^[52] 5750G, ^[53] released June 1, 2021. Refresh models 5355GE, 5355G, 5655GE, 5655G, 5755GE, 5755G released September 5, 2024. ^[54]

Chagall (Threadripper 5000 series, Zen 3 based)

Common features of Ryzen 5000 workstation CPUs:

• Socket: sWRX8.
• All the CPUs support DDR4-3200 in octa-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
• No integrated graphics.
• Fabrication process: TSMC 7FF.

Branding and Model		Cores (threads)	Clock rate (GHz)		L3 cache (total)	TDP	Chiplets	Core config [i]	Release date	MSRP
			Base	Boost
Ryzen Threadripper PRO	5995WX	64 (128)	2.7	4.5	256 MB	280 W	8 × CCD 1 × I/OD	8 × 8	Mar 8, 2022 (OEM) / ? (retail)	OEM / US $6500
	5975WX	32 (64)	3.6		128 MB		4 × CCD 1 × I/OD	4 × 8	Mar 8, 2022 (OEM) / ? (retail)	OEM / US $3300
	5965WX	24 (48)	3.8					4 × 6	Mar 8, 2022 (OEM) / ? (retail)	OEM / US $2400
	5955WX	16 (32)	4.0		64 MB		2 × CCD 1 × I/OD	2 × 8	Mar 8, 2022	OEM
	5945WX	12 (24)	4.1					2 × 6

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX

Ryzen 7000 series

Raphael (7000 series, Zen 4/RDNA2 based)

Common features of Ryzen 7000 desktop CPUs:

• Socket: AM5.
• All the CPUs support DDR5-5200 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost). ^[i] Models with "F" suffixes are without iGPUs.
• Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).

Branding and model		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Thermal solution	Chiplets	Core config [ii]	TDP	Release date	MSRP
			Base	Boost
Ryzen 9	7950X3D	16 (32)	4.2	5.7	128 MB [iii]	—	2 × CCD 1 × I/OD	2 × 8	120 W	Feb 28, 2023	US $699
	7950X		4.5		64 MB				170 W	Sep 27, 2022
	7900X3D	12 (24)	4.4	5.6	128 MB [iii]			2 × 6	120 W	Feb 28, 2023	US $599
	7900X		4.7		64 MB				170 W	Sep 27, 2022	US $549
	7900		3.7	5.4		Wraith Prism			65 W	Jan 10, 2023	US $429 [57]
	PRO 7945					Wraith Spire				Jun 13, 2023	OEM
Ryzen 7	7800X3D	8 (16)	4.2	5.0	96 MB	—	1 × CCD 1 × I/OD	1 × 8	120 W	Apr 6, 2023	US $449
	7700X		4.5	5.4	32 MB				105 W	Sep 27, 2022	US $399
	7700		3.8	5.3		Wraith Prism			65 W	Jan 10, 2023	US $329 [57]
	PRO 7745					Wraith Spire				Jun 13, 2023	OEM
Ryzen 5	7600X3D [58] [59]	6 (12)	4.1	4.7	96 MB	—		1 × 6		Aug 31, 2024 [iv]	US $299
	7600X		4.7	5.3	32 MB				105 W	Sep 27, 2022
	7600		3.8	5.1		Wraith Stealth			65 W	Jan 10, 2023	US $229 [57]
	PRO 7645					Wraith Spire				Jun 13, 2023	OEM
	7500F		3.7	5.0		Wraith Stealth				Jul 22, 2023	US $179 [60]
	7400F			4.7						Jan 9, 2025

• v
• t
• e

1. Self identifies as "AMD Radeon Graphics". See RDNA 2 § Integrated graphics processors (iGPs).
2. Core Complexes (CCX) × cores per CCX
3. Only one of the two CCXes has additional 64 MB 3D V-Cache. ^[55] Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower. ^[56]
4. Release date for US, where it is only sold though MicroCenter. ^[58] In Europe it is only available in Germany, and only through MindFactory, which released it on September 5, 2024. ^[59]

Storm Peak (Threadripper 7000 series, Zen 4 based)

Common features of Ryzen 7000 HEDT/workstation CPUs:

• Socket: sTR5.
• Threadripper CPUs support DDR5-5200 in quad-channel mode while Threadripper PRO CPUs support DDR5-5200 in octa-channel mode with ECC support.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• Threadripper CPUs support 48 PCIe 5.0 and 24 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 5.0 lanes. In addition, all processor models have 4 PCIe 4.0 lanes reserved as link to the chipset.
• No integrated graphics.
• Fabrication process: TSMC 5FF.

Branding and model		Cores (threads)	Clock rate (GHz)		L3 cache (total)	TDP	Chiplets	Core config [i]	Release date	MSRP
			Base	Boost
Ryzen Threadripper PRO	7995WX	96 (192)	2.5	5.1	384 MB	350 W	12 × CCD 1 × I/OD	12 × 8	Nov 21, 2023 [61]	US $9999
	7985WX	64 (128)	3.2		256 MB		8 × CCD 1 × I/OD	8 × 8		US $7349
	7975WX	32 (64)	4.0	5.3	128 MB		4 × CCD 1 × I/OD	4 × 8		US $3899
	7965WX	24 (48)	4.2					4 × 6		US $2649
	7955WX	16 (32)	4.5		64 MB		2 × CCD 1 × I/OD	2 × 8		US $1899
	7945WX	12 (24)	4.7					2 × 6		US $1399
Ryzen Threadripper	7980X	64 (128)	3.2	5.1	256 MB		8 × CCD 1 × I/OD	8 × 8		US $4999
	7970X	32 (64)	4.0	5.3	128 MB		4 × CCD 1 × I/OD	4 × 8		US $2499
	7960X	24 (48)	4.2					4 × 6		US $1499

• v
• t
• e

1. Core Complexes (CCXs) × cores per CCX

Ryzen 8000 series

Phoenix (8000 series, Zen 4 based)

Common features of Ryzen 8000 desktop CPUs:

• Socket: AM5.
• All the CPUs support DDR5-5200 RAM in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• All the CPUs support 20 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
• No integrated graphics.
• Fabrication process: TSMC 4 nm FinFET.

Branding and model		Cores (threads)	Clock rate (GHz)		L3 cache (total)	NPU	Thermal solution	TDP	Core config [a]	Release date	MSRP
			Base	Boost
Ryzen 7	8700F	8 (16)	4.1	5.0	16 MB	Partial [b]	Wraith Stealth	65 W	1 × 8	April 1, 2024 [62]	OEM [63]
Ryzen 5	8400F	6 (12)	4.2	4.7		No			1 × 6

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX.
2. Ryzen AI is only available when paired with a Radeon graphics card that features AI acceleration, such as the RX 7000 series.

Phoenix (8000 series with Radeon Graphics, Zen 4/RDNA3/XDNA based)

Common features of Ryzen 8000G desktop APUs:

• Socket: AM5.
• All the CPUs support DDR5-5200 RAM in dual-channel mode in 2x1R and 2x2R configuration, but only DDR5-3600 for 4x1R and 4x2R.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• Models with Zen 4c cores (codenamed Phoenix 2) support 14 PCIe 4.0 lanes, while models without them support 20 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated RDNA 3 GPU.
• Includes XDNA AI Engine (Ryzen AI) on models without Zen 4c cores.
• Fabrication process: TSMC 4 nm FinFET.

Branding and model		CPU							GPU			NPU	Thermal solution	TDP	Release date	MSRP
		Cores (threads)			Clock rate (GHz)		L3 cache (total)	Core config [a]	Model	Core config [b] [c]	Clock (GHz)
		Total	Zen 4	Zen 4c	Base	Boost
Ryzen 7	8700G [d]	8 (16)	8 (16)	—	4.2	5.1	16 MB	1 × 8	780M	12 CUs 768:48:24:12	2.9	Ryzen AI Up to 16 TOPS	Wraith Spire	65 W	Jan 31, 2024 [64]	US $329
	PRO 8700GE				3.6						2.7		—	35 W	Apr 16, 2024[ citation needed ]	US $299
Ryzen 5	8600G [d]	6 (12)	6 (12)		4.3	5.0		1 × 6	760M	8 CUs 512:32:16:8	2.8		Wraith Stealth	65 W	Jan 31, 2024 [64]	US $229
	PRO 8600GE				3.9						2.6		—	35 W	Apr 16, 2024[ citation needed ]	??
	8500G [d]		2 (4)	4 (8)	4.1 / 3.2 [e]	5.0 / 3.7 [f]		2 + 4	740M	4 CUs 256:16:8:4	2.8	No	Wraith Stealth	65 W	Jan 31, 2024	US $179
	8500GE [d]				3.9 / 3.1 [e]								—	35 W	Apr 16, 2024[ citation needed ]	??
Ryzen 3	8300G [d]	4 (8)	1 (2)	3 (6)	4.0 / 3.2 [e]	4.9 / 3.6 [f]	8 MB	1 + 3			2.6		Wraith Stealth	65 W	Jan 2024 (OEM) / Q1 2024 (retail)	OEM / TBA
	8300GE [d]												—	35 W	Apr 16, 2024[ citation needed ]	??

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX, or Zen 4 + Zen 4c cores
2. Unified shaders  : Texture mapping units  : Render output units  : Ray accelerators  : AI accelerators and Compute units (CU)
3. GPUs based on RDNA 3 have dual-issue stream processors so that up to two shader instructions can be executed per clock cycle under certain parallelism conditions.
4. Model also available as PRO version as 8300G ^[65] , 8300GE ^[66] , 8500G ^[67] , 8500GE ^[68] , 8600G ^[69] , 8700G ^[70] .
5. Zen 4 cores' base frequency / Zen 4c cores' base frequency
6. Zen 4 cores' boost frequency / Zen 4c cores' boost frequency

Ryzen 9000 series

Granite Ridge (9000 series, Zen 5 based)

Common features of Ryzen 9000 desktop CPUs:

• Socket: AM5.
• All the CPUs support DDR5-5600 in dual-channel mode.
• All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated RDNA2 GPU with 2 CUs and base and boost clock speeds of 0.4 GHz and 2.2 GHz, respectively.
• L1 cache: 80 KB (48 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• Fabrication process: TSMC N4X FinFET (N6 FinFET for the I/O die).

Branding and Model		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Thermal solution	TDP	Chiplets	Core config [i]	Release date	Launch MSRP
			Base	Boost
Ryzen 9	9950X3D [71] [72]	16 (32)	4.3	5.7	128 MB [ii]	—	170 W	2 × CCD 1 × I/OD	2 × 8	March 12, 2025	US $699
	9950X [74] [75]		4.3	5.7	64 MB					August 15, 2024	US $649
	9900X3D [71] [72]	12 (24)	4.4	5.5	128 MB [ii]		120 W		2 × 6	March 12, 2025	US $599
	9900X [74] [75]		4.4	5.6	64 MB					August 15, 2024	US $499
Ryzen 7	9800X3D [76] [77]	8 (16)	4.7	5.2	96 MB			1 × CCD 1 × I/OD	1 × 8	November 7, 2024	US $479
	9700X [74] [75]		3.8	5.5	32 MB		65 W [a]			August 8, 2024	US $359
Ryzen 5	9600X [74] [75]	6 (12)	3.9	5.4					1 × 6		US $279
	9600 [78]		3.8	5.2		Wraith Stealth	65 W			February 19, 2025	TBA

• v
• t
• e

1. TDP configurable to 105 W

1. Core Complexes (CCX) × cores per CCX
2. Only one of the two CCXes has 3D V-Cache. ^[73]

Shimada Peak (Threadripper 9000 series, Zen 5 based)

Common features of Ryzen 9000 HEDT/workstation CPUs:

• Socket: sTR5.
• Threadripper CPUs support DDR5-6400 in quad-channel mode while Threadripper PRO CPUs support DDR5-6400 in octa-channel mode with ECC support.
• L1 cache: 80 KB (48 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• Threadripper CPUs support 48 PCIe 5.0 and 24 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 5.0 lanes. In addition, all processor models have 4 PCIe 4.0 lanes reserved as link to the chipset.
• No integrated graphics.
• Fabrication process: TSMC 4nm FinFET.

Branding and model		Cores (threads)	Clock rate (GHz)		L3 cache (total)	TDP	Chiplets	Core config [i]	Release date	MSRP
			Base	Boost
Ryzen Threadripper PRO	9995WX	96 (192)	2.5	5.4	384 MB	350 W	12 × CCD 1 × I/OD	12 × 8	July 2025 [79]	TBA
	9985WX	64 (128)	3.2		256 MB		8 × CCD 1 × I/OD	8 × 8		TBA
	9975WX	32 (64)	4.0		128 MB		4 × CCD 1 × I/OD	4 × 8		TBA
	9965WX	24 (48)	4.2					4 × 6		TBA
	9955WX	16 (32)	4.5		64 MB		2 × CCD 1 × I/OD	2 × 8		TBA
	9945WX	12 (24)	4.7					2 × 6		TBA
Ryzen Threadripper	9980X	64 (128)	3.2		256 MB		8 × CCD 1 × I/OD	8 × 8		TBA
	9970X	32 (64)	4.0		128 MB		4 × CCD 1 × I/OD	4 × 8		TBA
	9960X	24 (48)	4.2					4 × 6		TBA

• v
• t
• e

1. Core Complexes (CCXs) × cores per CCX

Mobile processors

Ryzen 2000 series

Raven Ridge (Zen/GCN5 based)

Common features of Ryzen 2000 notebook APUs:

• Socket: FP5.
• The U-series CPUs support DDR4-2400 in dual-channel mode, while the H-series CPUs support it at DDR4-3200 speeds.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 12 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: GlobalFoundries 14LP.

Branding and Model		CPU					GPU				TDP	Release date
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config [i]	Model [a]	Clock (GHz)	Config [ii]	Processing power (GFLOPS) [iii]
			Base	Boost
Ryzen 7	2800H	4 (8)	3.3	3.8	4 MB	1 × 4	RX Vega 11	1.3	704:44:16 11 CUs	1830.4	35–54 W	Sep 10, 2018
	2700U [b]		2.2				RX Vega 10		640:40:16 10 CUs	1664	12–25 W	Oct 26, 2017
Ryzen 5	2600H		3.2	3.6			Vega 8	1.1	512:32:16 8 CUs	1126.4	35–54 W	Sep 10, 2018
	2500U [b]		2.0								12–25 W	Oct 26, 2017
Ryzen 3	2300U [b]	4 (4)		3.4			Vega 6		384:24:8 6 CUs	844.8		Jan 8, 2018
	2200U	2 (4)	2.5			1 × 2	Vega 3		192:12:4 3 CUs	422.4

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX
2. Unified shaders  : Texture mapping units  : Render output units and Compute units (CU)
3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

1. Branded as Radeon Vega instead of Radeon RX Vega on the PRO CPUs.
2. Model also available as PRO version as 2300U, 2500U, 2700U, released on May 15, 2018.

Ryzen 3000 series

Dalí (Zen/GCN5 based)

Common features of Ryzen 3000 notebook APUs:

• Socket: FP5.
• All the CPUs support DDR4-2400 in dual-channel mode.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 12 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: GlobalFoundries 14LP.

Branding and Model		CPU					GPU				TDP	Release date
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config [i]	Model	Clock (GHz)	Config [ii]	Processing power (GFLOPS) [iii]
			Base	Boost
Ryzen 3	3250U	2 (4)	2.6	3.5	4 MB	1 × 2	Vega 3	1.2	192:12:4 3 CUs	460.8	12–25 W	Jan 6, 2020
	3250C											Sep 22, 2020
	3200U											Jan 6, 2019

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX
2. Unified Shaders  : Texture Mapping Units  : Render Output Units and Compute Units (CU)
3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Picasso (Zen+/GCN5 based)

Common features of Ryzen 3000 notebook APUs:

• Socket: FP5.
• All the CPUs support DDR4-2400 in dual-channel mode.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: GlobalFoundries 12LP (14LP+).

Branding and Model		CPU					GPU				TDP	Release date
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config [i]	Model	Clock (GHz)	Config [ii]	Processing power (GFLOPS) [iii]
			Base	Boost
Ryzen 7	3780U [80]	4 (8)	2.3	4.0	4 MB	1 × 4	RX Vega 11	1.4	704:44:16 11 CU	1971.2	15 W	Oct 2019
	3750H [81]						RX Vega 10		640:40:16 10 CU [82]	1792.0	35 W	Jan 6, 2019
	3700C [83]										15 W	Sep 22, 2020
	3700U [a] [84]											Jan 6, 2019
Ryzen 5	3580U [85]		2.1	3.7			Vega 9	1.3	576:36:16 9 CU	1497.6		Oct 2019
	3550H [86]						Vega 8	1.2	512:32:16 8 CU [87]	1228.8	35 W	Jan 6, 2019
	3500C [88]										15 W	Sep 22, 2020
	3500U [a] [89]											Jan 6, 2019
	3450U [90]			3.5								Jun 2020
Ryzen 3	3350U [91]	4 (4)					Vega 6		384:24:8 6 CU [92]	921.6		Jan 6, 2019
	3300U [a] [93]

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX
2. Unified Shaders  : Texture Mapping Units  : Render Output Units and Compute Units (CU)
3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

1. Model also available as PRO version ^{[94] [95] [96]} , released April 8, 2019.

Ryzen 4000 series

Renoir (Zen 2/GCN5 based)

Common features of Ryzen 4000 notebook APUs:

• Socket: FP6.
• All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: TSMC 7FF.

Branding and Model		CPU					GPU				TDP	Release date
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config [i]	Model	Clock (GHz)	Config [ii]	Processing power (GFLOPS) [iii]
			Base	Boost
Ryzen 9	4900H	8 (16)	3.3	4.4	8 MB	2 × 4	Radeon Graphics [a]	1.75	512:32:8 8 CU	1792	35–54 W	Mar 16, 2020
	4900HS		3.0	4.3							35 W
Ryzen 7	4800H [97]		2.9	4.2				1.6	448:28:8 7 CU	1433.6	35–54 W
	4800HS										35 W
	4980U [b]		2.0	4.4				1.95	512:32:8 8 CU	1996.8	10–25 W	Apr 13, 2021
	4800U		1.8	4.2				1.75		1792		Mar 16, 2020
	4700U [c]	8 (8)	2.0	4.1				1.6	448:28:8 7 CU	1433.6
Ryzen 5	4600H [98]	6 (12)	3.0	4.0		2 × 3		1.5	384:24:8 6 CU	1152	35–54 W
	4600HS [99]										35 W
	4680U [b]		2.1						448:28:8 7 CU	1344	10–25 W	Apr 13, 2021
	4600U [c]								384:24:8 6 CU	1152		Mar 16, 2020
	4500U	6 (6)	2.3
Ryzen 3	4300U [c]	4 (4)	2.7	3.7	4 MB	1 × 4		1.4	320:20:8 5 CU	896

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX
2. Unified shaders  : texture mapping units  : render output units and compute units (CU)
3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

1. All of the iGPUs are branded as AMD Radeon Graphics.
2. Only found on the Microsoft Surface Laptop 4.
3. Model also available as PRO version as 4450U, ^[100] 4650U, ^[101] 4750U, ^[102] released May 7, 2020.

Ryzen 5000 series

Lucienne (Zen 2/GCN5 based)

Common features of Ryzen 5000 notebook APUs:

• Socket: FP6.
• All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: TSMC 7FF.

Branding and Model		CPU					GPU				TDP	Release date
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config [i]	Model	Clock (GHz)	Config [ii]	Processing power (GFLOPS) [iii]
			Base	Boost
Ryzen 7	5700U	8 (16)	1.8	4.3	8 MB	2 × 4	Radeon Graphics [a]	1.9	512:32:8 8 CU	1945.6	10–25 W	Jan 12, 2021
Ryzen 5	5500U [103]	6 (12)	2.1	4.0		2 × 3		1.8	448:28:8 7 CU	1612.8
Ryzen 3	5300U	4 (8)	2.6	3.8	4 MB	1 × 4		1.5	384:24:8 6 CU	1152

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX
2. Unified shaders  : texture mapping units  : render output units and compute units (CU)
3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

1. All of the iGPUs are branded as AMD Radeon Graphics.

Cezanne and Barceló (Zen 3/GCN5 based)

Cezanne (2021 models), Barceló (2022 models). Common features of Ryzen 5000 notebook APUs:

• Socket: FP6.
• All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: TSMC 7FF.

Branding and model		CPU						GPU				TDP	Release date
		Cores (threads)	Clock rate (GHz)			L3 cache (total)	Core config [i]	Model	Clock (GHz)	Config [ii]	Processing power (GFLOPS) [iii]
			Base	Boost (Single Core)	Boost (All Core)
Ryzen 9	5980HX	8 (16)	3.3	4.8	4.4	16 MB	1 × 8	Radeon Graphics [a]	2.1	512:32:8 8 CUs	2150.4	35–54 W	Jan 12, 2021
	5980HS		3.0		4.0							35 W
	5900HX		3.3	4.6	4.2							35–54 W
	5900HS		3.0		4.0							35 W
Ryzen 7	5800H [104]		3.2	4.4					2.0		2048	35–54 W
	5800HS		2.8									35 W
	5825U [b] [c]		2.0	4.5								15 W	Jan 4, 2022
	5800U [b]		1.9	4.4	3.4							10–25 W	Jan 12, 2021
Ryzen 5	5600H [114]	6 (12)	3.3	4.2			1 × 6		1.8	448:28:8 7 CUs	1612.8	35–54 W
	5600HS		3.0									35 W
	5625U [b] [c]		2.3	4.3	3.6							15 W	Jan 4, 2022
	5600U [b]			4.2								10–25 W	Jan 12, 2021
	5560U			4.0		8 MB			1.6	384:24:8 6 CUs	1228.8
	5500H	4 (8)	3.3	4.2			1 × 4		1.8		1382.4	35–54 W	Jun 23, 2023
Ryzen 3	5425U [b] [c]		2.3	4.3	3.8				1.6		1228.8	15 W	Jan 4, 2022
	5400U [b] [115]		2.7	4.1								10–25 W	Jan 12, 2021
	5125C	2 (4)	3.0	—	—		1 × 2		1.2	192:12:8 3 CUs	460.8	15 W	May 5, 2022

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX
2. Unified shaders  : texture mapping units  : render output units and compute units (CU)
3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

1. All of the iGPUs are branded as AMD Radeon Graphics.
2. Model also available as PRO version as 5450U, ^[105] 5650U, ^[106] 5850U, ^[107] released on March 16, 2021 and as 5475U, ^[108] 5675U, ^[109] 5875U, ^[110] released on April 19, 2022.
3. Model also available as Chromebook optimized version as 5425C, ^[111] 5625C, ^[112] 5825C, ^[113] released on May 5, 2022.

Ryzen 6000 series

Rembrandt (Zen 3+/RDNA2 based)

Common features of Ryzen 6000 notebook APUs:

• Socket: FP7, FP7r2.
• All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 4.0 lanes.
• Native USB 4 (40Gbps) Ports: 2
• Native USB 3.2 Gen 2 (10Gbps) Ports: 2
• Includes integrated RDNA 2 GPU.
• Fabrication process: TSMC N6 FinFET.

Branding and model		CPU					GPU				TDP	Release date
		Cores (threads)	Clock (GHz)		L3 cache (total)	Core config [i]	Model	Clock (GHz)	Config [ii]	Processing power (GFLOPS) [iii]
			Base	Boost
Ryzen 9	6980HX	8 (16)	3.3	5.0	16 MB	1 × 8	680M	2.4	768:48:8 12 CUs	3686.4	45 W	Jan 4, 2022 [116]
	6980HS										35 W
	6900HX [a]			4.9							45 W
	6900HS [a]										35 W
Ryzen 7	6800H [a]		3.2	4.7				2.2		3379.2	45 W
	6800HS [a]										35 W
	6800U [a]		2.7								15–28 W
Ryzen 5	6600H [a]	6 (12)	3.3	4.5		1 × 6	660M	1.9	384:24:8 6 CUs	1459.2	45 W
	6600HS [a]										35 W
	6600U [a]		2.9								15–28 W

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX
2. Unified shaders  : texture mapping units  : render output units and compute units (CU)
3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

1. Model also available as PRO version (6650U ^[117] , 6650H ^[118] , 6650HS ^[119] , 6850U ^[120] , 6850H ^[121] , 6850HS ^[122] , 6950H ^[123] , 6950HS ^[124] ), released on April 19, 2022.

Ryzen 7000 series

Mendocino (7020 series, Zen 2/RDNA2 based)

Common features of Ryzen 7020 notebook APUs:

• Socket: FT6
• All the CPUs support LPDDR5-5500 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 4 PCIe 3.0 lanes.
• Native USB 4 (40Gbps) Ports: 0
• Native USB 3.2 Gen 2 (10Gbps) Ports: 1
• Includes integrated RDNA 2 GPU.
• Fabrication process: TSMC N6 FinFET.

Branding and Model		CPU					GPU			TDP	Release date
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config [i]	Model	Clock (GHz)	Processing power [ii] (GFLOPS)
			Base	Boost
Ryzen 5	7520U [iii]	4 (8)	2.8	4.3	4 MB	1 × 4	610M 2 CU	1.9	486.4	15 W	September 20, 2022 [125]
Ryzen 3	7320U [iii]		2.4	4.1

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX
2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
3. Model also available as Chromebook optimized version as 7520C ^[126] and 7320C ^[127] released on May 23, 2023

Barcelo-R (7030 series, Zen 3/GCN5 based)

Common features of Ryzen 7030 notebook APUs:

• Socket: FP6.
• All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes.
• Native USB 4 (40Gbps) Ports: 0
• Native USB 3.2 Gen 2 (10Gbps) Ports: 2
• Includes integrated GCN 5th generation GPU.
• Fabrication process: TSMC N7 FinFET.

Branding and Model		CPU					GPU			TDP	Release date
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config [a]	Model	Clock (GHz)	Processing power [b] (GFLOPS)
			Base	Boost
Ryzen 7	(PRO) 7730U	8 (16)	2.0	4.5	16 MB	1 × 8	Vega 8 CU	2.0	2048	15 W	January 4, 2023 [128]
Ryzen 5	(PRO) 7530U	6 (12)				1 × 6	Vega 7 CU		1792
	7430U		2.3	4.3				1.8	1612.8		Q4 2023
Ryzen 3	(PRO) 7330U	4 (8)			8 MB	1 × 4	Vega 6 CU		1382.4		January 4, 2023 [129]

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX
2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Rembrandt-R (7035 series, Zen 3+/RDNA2 based)

Common features of Ryzen 7035 notebook APUs:

• Socket: FP7, FP7r2.
• All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 4.0 lanes.
• Native USB 4 (40Gbps) Ports: 0
• Native USB 3.2 Gen 2 (10Gbps) Ports: 2
• Includes integrated RDNA 2 GPU.
• Fabrication process: TSMC N6 FinFET.

Branding and model		CPU					GPU			TDP	Release date [130]
		Cores (threads)	Clock (GHz)		L3 cache (total)	Core config [a]	Model	Clock (GHz)	Processing power [b] (GFLOPS)
			Base	Boost
Ryzen 7	7735HS	8 (16)	3.2	4.75	16 MB	1 × 8	680M 12 CU	2.2	3379.2	35–54 W	April 30, 2023
	7735H
	7736U		2.7	4.7						15–28 W	January 4, 2023
	7735U			4.75						15–30 W
	7435HS		3.1	4.5			—			35–54 W	2024 [131]
	7435H
Ryzen 5	7535HS	6 (12)	3.3	4.55		1 × 6	660M 6 CU	1.9	1459.2		April 30, 2023
	7535H
	7535U		2.9							15–30 W	January 4, 2023
	7235HS	4 (8)	3.2	4.2	8 MB	1 × 4	—			35–53 W	2024 [132]
	7235H
Ryzen 3	7335U		3.0	4.3			660M 4 CU	1.8	921.6	15–30 W	January 4, 2023

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX
2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Phoenix (7040 series, Zen 4/RDNA3/XDNA based)

Common features of Ryzen 7040 notebook APUs:

• Socket: FP7, FP7r2, FP8.
• All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• All models support AVX-512 using a half-width 256-bit FPU.
• PCIe 4.0 support.
• Native USB 4 (40Gbps) Ports: 2
• Native USB 3.2 Gen 2 (10Gbps) Ports: 2
• Includes integrated RDNA 3 GPU.
• Includes XDNA AI Engine (Ryzen AI).
• Fabrication process: TSMC N4 FinFET.

Branding and model		CPU							GPU		NPU	PCIe (lanes)	TDP	Release date [133]
		Cores (threads)			Clock (GHz)		L3 cache (total)	Core config [a]	Model	Clock (GHz)
		Total	Zen 4	Zen 4c	Base	Boost
Ryzen 9	(PRO) 7940HS	8 (16)	8 (16)	—	4.0	5.2	16 MB	1 × 8	780M 12 CU	2.8	Ryzen AI Up to 10 TOPS	20	35–54 W	April 30, 2023 [b]
	7940H [c]
Ryzen 7	(PRO) 7840HS				3.8	5.1				2.7
	7840H [c]
	(PRO) 7840U				3.3								15–30 W	May 3, 2023 [b]
Ryzen 5	(PRO) 7640HS	6 (12)	6 (12)		4.3	5.0		1 × 6	760M 8 CU	2.6			35–54 W	April 30, 2023 [b]
	7640H [c]
	(PRO) 7640U				3.5	4.9							15–30 W	May 3, 2023 [b]
	(PRO) 7545U		2 (4)	4 (8)	3.7 / 3.0 [d]	4.9 / 3.5 [e]		2 + 4	740M 4 CU	2.8	No	14		November 2, 2023
	(PRO) 7540U		6 (12)	—	3.2	4.9		1 × 6		2.5				May 3, 2023 [b]
Ryzen 3	7440U	4 (8)	1 (2)	3 (6)	3.6 / 2.8 [d]	4.7 / 3.3 [e]	8 MB	1 + 3

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
2. PRO versions launched on 13 June 2023.
3. China-only version of the HS SKU that lacks support for AMD EXPO and FreeSync technologies.
4. Zen 4 cores' base frequency / Zen 4c cores' base frequency
5. Zen 4 cores' boost frequency / Zen 4c cores' boost frequency

Dragon Range (7045 series, Zen 4/RDNA2 based)

Common features of Ryzen 7045 notebook CPUs:

• Socket: FL1.
• All the CPUs support DDR5-5200 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• All the CPUs support 28 PCIe 5.0 lanes.
• Native USB 4 (40Gbps) Ports: 0
• Native USB 3.2 Gen 2 (10Gbps) Ports: 4
• Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost) ^[i] .
• Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O and graphics die).

Branding and model		Cores (threads)	Clock (GHz)		L3 cache (total)	Chiplets	Core config [a]	TDP	Release date [134]
			Base	Boost
Ryzen 9	7945HX3D	16 (32)	2.3	5.4	128 MB [ii]	2 × CCD 1 × I/OD	2 × 8	55–75 W	July 27, 2023
	7945HX		2.5		64 MB				February 28, 2023
	7940HX		2.4	5.2					January 17, 2024
	7845HX	12 (24)	3.0	5.2			2 × 6	45–75 W	February 28, 2023
Ryzen 7	7840HX		2.9	5.1					January 17, 2024
	7745HX	8 (16)	3.6	5.1	32 MB	1 × CCD 1 × I/OD	1 × 8		February 28, 2023
Ryzen 5	7645HX	6 (12)	4.0	5.0			1 × 6

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX

1. Self identifies as "AMD Radeon 610M". See RDNA 2 § Integrated graphics processors (iGPs).
2. Only one of the two CCXes has additional 64 MB of 3D V-Cache. Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.

Ryzen 8000 series

Hawk Point (8040 series, Zen 4/RDNA3/XDNA based)

Key features of Ryzen 8040 notebook APUs:

• Socket: BGA (FP7, FP7r2 or FP8 type packages).
• All models support DDR5-5600 or LPDDR5X-7500 in 128-bit "dual-channel" mode.
• CPU uses Zen4 cores (Phoenix) or a combination of Zen4 and Zen4c cores (Phoenix2).
• GPU uses the RDNA 3 (Navi 3) architecture.
• Some models include first generation Ryzen AI NPU (XDNA).
• All models support AVX-512 using a half-width 256-bit FPU.
• PCIe 4.0 support.
• Native USB 4 (40Gbps) Ports: 2
• Native USB 3.2 Gen 2 (10Gbps) Ports: 2
• Fabrication process: TSMC N4 FinFET.

Branding and model		CPU							GPU		NPU	PCIe (lanes)	TDP	Release date
		Cores (threads)			Clock (GHz)		L3 cache (total)	Core config [a]	Model	Clock (GHz)
		Total	Zen 4	Zen 4c	Base	Boost
Ryzen 9	8945HS	8 (16)	8 (16)	—	4.0	5.2	16 MB	1 × 8	Radeon 780M 12 CU	2.8	Ryzen AI up to 16 TOPS	20	35-54 W	December 6, 2023 [135]
Ryzen 7	8845HS				3.8	5.1				2.7
	8840HS				3.3								20-30 W
	8840U												15-30 W
Ryzen 5	8645HS	6 (12)	6 (12)		4.3	5.0		1 × 6	Radeon 760M 8 CU	2.6			35-54 W
	8640HS				3.5	4.9							20-30 W
	8640U												15-30 W
	8540U		2 (4)	4 (8)	3.7 / 3.0 [b]	4.9 / 3.5 [c]		2 + 4	Radeon 740M 4 CU	2.8	No	14
Ryzen 3	8440U	4 (8)	1 (2)	3 (6)	3.6 / 2.8 [b]	4.7 / 3.3 [c]	8 MB	1 + 3		2.5

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
2. Zen 4 cores' base frequency / Zen 4c cores' base frequency
3. Zen 4 cores' boost frequency / Zen 4c cores' boost frequency

Ryzen 200 series

Hawk Point Refresh (200 series, Zen 4/RDNA3/XDNA based)

Branding and Model		CPU							GPU		NPU (Ryzen AI)	TDP	Release date
		Cores (threads)			Clock (GHz)		L3 cache (total)	Core config	Model	Clock (GHz)
		Total	Zen 4	Zen 4c	Base	Boost
Ryzen 9	270	8 (16)	8 (16)	—	4.0	5.2	16 MB	1 × 8	780M 12 CU	2.8	16 TOPS	35–54 W	Q2 2025 [136]
Ryzen 7	260				3.8	5.1				2.7
	(PRO) 250				3.3							15–30 W
Ryzen 5	240	6 (12)	6 (12)		4.3	5.0		1 × 6	760M 8 CU	2.6		35–54 W
	(PRO) 230				3.5	4.9						15–30 W
	(PRO) 220		2 (4)	4 (8)	3.7 / 3.0	4.9 / 3.5		2 + 4	740M 4 CU	2.8	—
Ryzen 3	(PRO) 210	4 (8)	1 (2)	3 (6)	3.6 / 2.8	4.7 / 3.3	8 MB	1 + 3		2.5

Ryzen AI 300 series

Strix Point and Krackan Point (Zen 5/RDNA3.5/XDNA2 based)

Common features of Ryzen AI 300 notebook APUs:

• Socket: BGA, FP8 package type.
• All models support DDR5-5600 or LPDDR5X-8000 in dual-channel mode.
• All models support 16 PCIe 4.0 lanes.
• Native USB4 (40Gbps) Ports: 2
• Native USB 3.2 Gen 2 (10Gbps) Ports: 2
• iGPU uses the RDNA 3.5 microarchitecture.
• NPU uses the XDNA 2 AI Engine (Ryzen AI).
• Both Zen5 and Zen5c cores support AVX-512 using a half-width 256-bit FPU.
• L1 cache: 80 KB (48 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• Fabrication process: TSMC N4P FinFET.

Branding and model		CPU							GPU		NPU (Ryzen AI)	TDP	Release date
		Cores (threads)			Clock (GHz)			L3 cache (total)	Model	Clock (GHz)
		Total	Zen 5	Zen 5c	Base	Boost (Zen 5)	Boost (Zen 5c)
Ryzen AI 9	(PRO) HX 375	12 (24)	4 (8)	8 (16)	2.0	5.1	3.3	24 MB	890M 16 CUs	2.9	55 TOPS	15–54 W	June 2, 2024 [137]
	(PRO) HX 370 [138]										50 TOPS
	365 [138]	10 (20)		6 (12)		5.0			880M 12 CUs
Ryzen AI 7	PRO 360 [139] [140]	8 (16)	3 (6)	5 (10)				16 MB					October 10, 2024 [141]
	(PRO) 350		4 (8)	4 (8)			3.5		860M 8 CU	3.0			Q1 2025 [136]
Ryzen AI 5	(PRO) 340	6 (12)	3 (6)	3 (6)		4.8	3.4		840M 4 CU	2.9
	330	4 (8)	1 (2)			4.5		8 MB	820M 2 CU	2.8		15–28 W	July 2025 [142]

• v
• t
• e

Strix Halo (Zen 5/RDNA3.5/XDNA2 based)

Branding and Model		CPU				GPU		Memory			NPU (Ryzen AI)	Chiplets	Core config	TDP	Release date
		Cores (threads)	Clock (GHz)		L3 cache (total)	Model	Clock (GHz)	Bus type & width	Clock (MT/s)	Bandwidth (GB/s)
			Base	Boost
Ryzen AI MAX+	(PRO) 395	16 (32)	3.0	5.1	64 MB	8060S 40 CUs	2.9	LPDDR5X 256-bit	Up to 8000	Up to 256	50 TOPS	2 × CCD 1 × I/OD with GPU	2 × 8	45–120 W	Q1 2025 [143]
Ryzen AI MAX	(PRO) 390	12 (24)	3.2	5.0		8050S 32 CUs	2.8						2 × 6
	(PRO) 385	8 (16)	3.6		32 MB							1 × CCD 1 × I/OD with GPU	1 × 8
	PRO 380	6 (12)	3.6	4.9	16 MB	8040S 16 CUs		LPDDR5X 128-bit		Up to 128			1 × 6

Ryzen 9000 series

Fire Range (Zen 5/RDNA2 based)

Common features of Ryzen 9000 Fire Range series:

• Socket: FL1
• All Models support DDR5-5600 in 128-bit mode; Maximum memory: 96 GB
• All models support 28 PCIe 5.0 lanes
• Native USB4 (40Gbps) Ports: 2
• Native USB 3.2 Gen 2 (10 Gbps): 4
• Native USB 2.0 (480 Mbps): 1
• iGPU: AMD Radeon 610M (2 CU @ 2200 MHz)
• No NPU
• L1 cache: 80 KB (48 KB data + 32 KB instruction) per core
• L2 cache: 1 MB per core
• Fabrication process: TSMC N4 FinFET (CCD) + TSMC N6 FinFET (I/OD)

Branding and Model		Cores (threads)	Clock (GHz)		L3 cache (total)	Chiplets	Core config	TDP	Release date
			Base	Boost
Ryzen 9	9955HX3D [144]	16 (32)	2.3	5.4	128 MB	2 × CCD 1 × I/OD	2 × 8	54 W	1H 2025
	9955HX [144]	16 (32)	2.5		64 MB
	9850HX [144]	12 (24)	3.0	5.2			2 × 6

Handheld gaming PC processors

Ryzen Z1 series (Zen 4/RDNA3 based)

Common features of Ryzen Z1 handheld APUs:

• Socket: FP7, FP7r2, FP8.
• All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• All the CPUs support 20 PCIe 4.0 lanes.
• Includes integrated RDNA 3 GPU.
• Fabrication process: TSMC 4 nm FinFET.

Branding and model		CPU							GPU		TDP	Release date
		Cores (threads)			Clock (GHz)		L3 cache (total)	Core config [a]	Model	Clock (GHz)
		Total	Zen 4	Zen 4c	Base	Boost
Ryzen	Z1 Extreme	8 (16)	8 (16)	—	3.3	5.1	16 MB	1 × 8	780M[ citation needed ] 12 CU	2.7[ citation needed ]	9–30 W	May 2023 [145]
	Z1	6 (12)	2 (4)	4 (8)[ citation needed ]	3.2	4.9		2 + 4	740M[ citation needed ] 4 CU	2.5[ citation needed ]

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores

Ryzen Z2 series (multiple architectures)

Branding and Model [a]		CPU							GPU		NPU (Ryzen AI)	TDP	Release date
		Cores (threads)			Clock (GHz)		L3 cache (total)	Core config	Model	Clock (GHz)
		Total	Zen 2/3+/4/5	Zen 5c	Base	Boost
Ryzen AI	Z2 Extreme	8 (16)	3 (6) (Zen 5)	5 (10) (Zen 5c)	2.0	5.0 / 3.3	16 MB	3 + 5	890M (RDNA3.5) 16 CU	2.9	50 TOPS	15–35 W	June 2025 [156]
Ryzen	Z2 Extreme										—		Q1 2025 [157]
	Z2		8 (16) (Zen 4)	—	3.3	5.1		1 × 8	780M (RDNA3) 12 CU	2.7		15–30 W
	Z2 Go	4 (8)	4 (8) (Zen 3+)		3.0	4.3	8 MB	1 × 4	680M (RDNA2) 12 CU	2.2
	Z2 A		4 (8) (Zen 2)		2.8	3.8	4 MB		(RDNA2) 8 CU	1.8		6–20 W	June 2025 [156]

• v
• t
• e

1. References: ^{[146] [147] [148] [149] [150] [151] [152] [153] [154] [155] [156]}

Embedded processors

1000 series

Great Horned Owl (V1000 series, Zen/GCN5 based)

Model	Release date	Fab	CPU						GPU				Memory support	TDP	Junction temp. range (°C)
			Cores (threads)	Clock rate (GHz)		Cache			Model	Config [i]	Clock (GHz)	Processing power (GFLOPS) [ii]
				Base	Boost	L1	L2	L3
V1202B	February 2018	GloFo 14LP	2 (4)	2.3	3.2	64 KB inst. 32 KB data per core	512 KB per core	4 MB	Vega 3	192:12:16 3 CU	1.0	384	DDR4-2400 dual-channel	12–25 W	0–105
V1404I	December 2018		4 (8)	2.0	3.6				Vega 8	512:32:16 8 CU	1.1	1126.4			-40–105
V1500B				2.2	—				—						0–105
V1605B	February 2018			2.0	3.6				Vega 8	512:32:16 8 CU	1.1	1126.4
V1756B				3.25									DDR4-3200 dual-channel	35–54 W
V1780B	December 2018			3.35					—
V1807B	February 2018				3.8				Vega 11	704:44:16 11 CU	1.3	1830.4

• v
• t
• e

1. Unified Shaders  : Texture Mapping Units  : Render Output Units and Compute Units (CU)
2. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Banded Kestrel (R1000 series, Zen/GCN5 based)

Model	Release date	Fab	CPU						GPU				Memory support	TDP
			Cores (threads)	Clock rate (GHz)		Cache			Model	Config [i]	Clock (GHz)	Processing power (GFLOPS) [ii]
				Base	Boost	L1	L2	L3
R1102G	February 25, 2020	GloFo 14LP	2 (2)	1.2	2.6	64 KB inst. 32 KB data per core	512 KB per core	4 MB	Vega 3	192:12:4 3 CU	1.0	384	DDR4-2400 single-channel	6 W
R1305G			2 (4)	1.5	2.8								DDR4-2400 dual-channel	8-10 W
R1505G	April 16, 2019			2.4	3.3									12–25 W
R1606G				2.6	3.5						1.2	460.8

• v
• t
• e

1. Unified Shaders  : Texture Mapping Units  : Render Output Units and Compute Units (CU)
2. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

2000 series

Grey Hawk (V2000 series, Zen 2/GCN5 based)

Model	Release date	Fab	CPU						GPU				Socket	PCIe support	Memory support	TDP
			Cores (threads)	Clock rate (GHz)		Cache			Archi- tecture	Config [i]	Clock (GHz)	Processing power [ii] (GFLOPS)
				Base	Boost	L1	L2	L3
V2516 [158]	Nov 10, 2020 [159]	TSMC 7FF	6 (12)	2.1	3.95	32 KB inst. 32 KB data per core	512 KB per core	8 MB	GCN 5	384:24:8 6 CU	1.5	1152	FP6	20 (8+4+4+4) PCIe 3.0	DDR4-3200 dual-channel LPDDR4X-4266 quad-channel	10–25 W
V2546 [158]				3.0	3.95											35–54 W
V2A46 [158]	Jan 4, 2023 [160]				3.2					448:28:8 7 CU	1.6	1433.6
V2718 [158]	Nov 10, 2020		8 (16)	1.7	4.15											10–25 W
V2748 [158]				2.9	4.25											35–54 W

• v
• t
• e

1. Unified Shaders  : Texture Mapping Units  : Render Output Units and Compute Units (CU)
2. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

River Hawk (R2000 series, Zen+ based)

Model	Release date	Fab	CPU						GPU				Socket	PCIe support	Memory support	TDP
			Cores (threads)	Clock rate (GHz)		Cache			Archi- tecture	Config [i]	Clock (GHz)	Processing power [ii] (GFLOPS)
				Base	Boost	L1	L2	L3
R2312 [161]	June 7, 2022 [162]	GloFo 12LP	2 (4)	2.7	3.5	64 KB inst. 32 KB data per core	512 KB per core	4 MB	GCN 5	192:12:4 3 CU	1.2	460.8	FP5	8 lanes Gen 3	DDR4-2400 dual-channel ECC	10–25 W
R2314 [161]			4 (4)	2.1						384:24:8 6 CU		921.6		16 lanes Gen 3	DDR4-2666 dual-channel ECC	10–35 W

• v
• t
• e

1. Unified Shaders  : Texture Mapping Units  : Render Output Units and Compute Units (CU)
2. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

3000 series

(V3000 series, Zen 3 based)

Model	Release date	Fab	CPU						Socket	PCIe support	Memory support	TDP
			Cores (threads)	Clock rate (GHz)		Cache
				Base	Boost	L1	L2	L3
V3C14 [163] [164]	September 27, 2022 [165]	TSMC 7FF	4 (8)	2.3	3.8	32 KB inst. 32 KB data per core	512 KB per core	8 MB	FP7r2	20 (8+4+4+4) PCIe 4.0	DDR5-4800 dual-channel	15 W
V3C44 [163] [164]				3.5	3.8							45 W
V3C16 [163] [164]			6 (12)	2.0	3.8			16 MB				15 W
V3C18I [163] [164]			8 (16)	1.9	3.8							15 W
V3C48 [163] [164]				3.3	3.8							45 W

• v
• t
• e

5000 series

(Ryzen Embedded 5000 series, Zen 3 based)

Common features of Ryzen Embedded 5000 series CPUs:

• Socket: AM4.
• All the CPUs support ECC DDR4-3200 dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• No integrated graphics.
• All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
• Fabrication process: TSMC 7FF.

Processor branding	Model	Cores (threads)	Clock rate (GHz)		L3 cache (total)	Chiplets	Core config [i]	TDP	Release date
			Base	Boost
Ryzen Embedded	5950E [166]	16 (32)	3.05	3.4	64 MB	2 × CCD 1 × I/OD	2 × 8	105 W	Apr 20, 2023
	5900E [167]	12 (24)	3.35	3.7			2 × 6
	5800E [168]	8 (16)	3.4		32 MB	1 × CCD 1 × I/OD	1 × 6	65-100 W
	5600E [169]	6 (12)	3.3	3.6				65 W

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX

7000 series

(Ryzen Embedded 7000 series, Zen 4/RDNA2 based)

Common features of Ryzen Embedded 7000 series CPUs:

• Socket: AM5.
• All the CPUs support ECC DDR5-5200 dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated RDNA 2 GPU with 2 CUs and boost clock speeds of 2200 MHz.
• Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).

Processor branding	Model	Cores (threads)	Clock rate (GHz)		L3 cache (total)	Chiplets	Core config [i]	TDP	Release date
			Base	Boost
Ryzen Embedded	7945	12 (24)	3.7	5.4	64 MB	2 × CCD 1 × I/OD	2 × 6	65 W	Nov 14, 2023 [170]
	7745	8 (16)	3.8	5.3	32 MB	1 × CCD 1 × I/OD	1 × 8
	7700X		4.5	5.4				105 W
	7645	6 (12)	3.8	5.1			1 × 6	65 W
	7600X		4.7	5.3				105 W

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX

See also

• Table of AMD processors
• List of AMD Athlon processors
• List of AMD processors with 3D graphics
• List of AMD CPU microarchitectures
• List of AMD chipsets

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