List of AMD Ryzen processors

Last updated April 14, 2024

The Ryzen family is an x86-64 microprocessor family from AMD, based on the Zen microarchitecture. The Ryzen lineup includes Ryzen 3, Ryzen 5, Ryzen 7, Ryzen 9, and Ryzen Threadripper with up to 96 cores. All consumer desktop Ryzens (except PRO models) and all mobile processors with the HX suffix have an unlocked multiplier. In addition, all support Simultaneous Multithreading (SMT) except earlier Zen/Zen+ based desktop and mobile Ryzen 3, and some models of Zen 2 based mobile Ryzen.

Desktop processors

Ryzen 1000 series

Summit Ridge (1000 series, Zen based)

Common features of Ryzen 1000 desktop CPUs:

Socket: AM4.
All the CPUs support DDR4-2666 in dual-channel mode.
L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
No integrated graphics.
Node/fabrication process: GlobalFoundries 14 LP.

Branding and Model		Cores (threads)	Thermal solution	Clock rate (GHz)			L3 cache (total)	TDP	Core config^{[lower-roman 1]}	Release date
Branding and Model		Cores (threads)	Thermal solution	Base	PBO 1–2 (≥3)	XFR^[1] 1–2	L3 cache (total)	TDP	Core config^{[lower-roman 1]}	Release date
Ryzen 7	1800X	8 (16)	Wraith Max (OEM only)	3.6	4.0 (3.7)	4.1	16 MB	95 W	2 × 4	March 2, 2017
	PRO 1700X		Wraith Spire	3.4	3.8 (3.5)	3.9				June 29, 2017
	1700X		Wraith Max (OEM only)	3.4	3.8 (3.5)	3.9				March 2, 2017
	PRO 1700		Wraith Spire	3.0	3.7 (3.2)	3.75		65 W		June 29, 2017
	1700		Wraith Spire LED (retail) Wraith Spire (OEM)	3.0	3.7 (3.2)	3.75		65 W		March 2, 2017
Ryzen 5	1600X	6 (12)	Wraith Max (OEM only)	3.6	4.0 (3.7)	4.1		95 W	2 × 3	April 11, 2017
	PRO 1600		Wraith Spire	3.2	3.6 (3.4)	3.7		65 W		June 29, 2017
	1600			3.2	3.6 (3.4)	3.7				April 11, 2017
	1500X	4 (8)		3.5	3.7 (3.6)	3.9			2 × 2	April 11, 2017
	PRO 1500			3.5	3.7 (3.6)	3.9				June 29, 2017
	1400		Wraith Stealth	3.2	3.4 (3.4)	3.45	8 MB			April 11, 2017
Ryzen 3	1300X	4 (4)	Wraith Stealth	3.5	3.7 (3.5)	3.9				July 27, 2017
	PRO 1300		Wraith Spire	3.5	3.7 (3.5)	3.9				June 29, 2017
	PRO 1200		Wraith Spire	3.1	3.4 (3.1)	3.45				June 29, 2017
	1200		Wraith Stealth	3.1	3.4 (3.1)	3.45				July 27, 2017

↑ Core Complexes (CCX) × cores per CCX

Whitehaven (Threadripper 1000 series, Zen based)

Common features of Ryzen 1000 HEDT CPUs:

Socket: TR4.
All the CPUs support DDR4-2666 in quad-channel mode.
L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
No integrated graphics.
Node/fabrication process: GlobalFoundries 14LP.

Branding and Model		Cores (threads)	Clock rate (GHz)			L3 cache (total)	TDP	Chiplets	Core config^{[lower-roman 1]}	Release date	MSRP
Branding and Model		Cores (threads)	Base	PBO 1–4 (≥5)	XFR^[1] 1–2	L3 cache (total)	TDP	Chiplets	Core config^{[lower-roman 1]}	Release date	MSRP
Ryzen Threadripper	1950X	16 (32)	3.4	4.0 (3.7)	4.2	32 MB	180 W	2 × CCD^{[lower-roman 2]}	4 × 4	Aug 31, 2017	US $999
	1920X	12 (24)	3.5	4.0 (3.7)		32 MB			4 × 3		US $799
	1900X	8 (16)	3.8	4.0 (3.9)		16 MB			2 × 4		US $549

↑ Core Complexes (CCX) × cores per CCX
↑ Processor package actually contains two additional inactive dies to provide structural support to the integrated heat spreader.

Ryzen 2000 series

Raven Ridge (2000 series with Radeon Graphics, Zen/GCN5 based)

Common features of Ryzen 2000 desktop APUs:

Socket: AM4.
All the CPUs support DDR4-2933 in dual-channel mode.
L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 16 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
Includes integrated GCN 5th generation GPU.
Fabrication process: GlobalFoundries 14LP.

Branding and Model		CPU				GPU				TDP	Release date	MSRP
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Model	Clock (GHz)	Config^{[lower-roman 1]}	Processing power (GFLOPS)^{[lower-roman 2]}
		Cores (threads)	Base	Boost	L3 cache (total)	Model	Clock (GHz)	Config^{[lower-roman 1]}	Processing power (GFLOPS)^{[lower-roman 2]}
Ryzen 5	2400G ^{[lower-alpha 1]}	4 (8)	3.6	3.9	4 MB	RX Vega 11	1.25	704:44:16 11 CU	1760	46‑65 W	Feb 12, 2018	US $169
Ryzen 5	2400GE ^{[lower-alpha 1]}	4 (8)	3.2	3.8		RX Vega 11	1.25	704:44:16 11 CU	1760	35 W	Apr 19, 2018	OEM
Ryzen 3	2200G ^{[lower-alpha 1]}	4 (4)	3.5	3.7		Vega 8	1.1	512:32:16 8 CU	1126	46‑65 W	Feb 12, 2018	US $99
	2200GE ^{[lower-alpha 1]}	4 (4)	3.2	3.6		Vega 8	1.1	512:32:16 8 CU	1126	35 W	Apr 19, 2018	OEM
	PRO 2100GE^[2]	2 (4)	3.2	—		Vega 3	1.0	192:12:4 3 CU^[3]	384	35 W	2019	OEM

↑ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
↑ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

1 2 3 4 Model also available as PRO version; 2200GE, 2200G, 2400GE, 2400G, released on May 14, 2018 for OEM only.^{[lower-alpha 2]}
"World's Largest Commercial PC Manufacturers Introduce AMD Ryzen PRO Mobile and Desktop APU Powered Systems". AMD (Press release). May 14, 2018. Retrieved April 8, 2023.

Pinnacle Ridge (2000 series, Zen+ based)

Common features of Ryzen 2000 desktop CPUs:

Socket: AM4.
All the CPUs support DDR4-2933 in dual-channel mode, except for R7 2700E and R5 2600E which support it at DDR4-2666 speeds.
L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
No integrated graphics.
Fabrication process: GlobalFoundries 12LP (14LP+).

Branding and Model		Cores (threads)	Thermal Solution	Clock rate (GHz)		L3 cache (total)	TDP	Core config^{[lower-roman 1]}	Release date	MSRP
Branding and Model		Cores (threads)	Thermal Solution	Base	PB2	L3 cache (total)	TDP	Core config^{[lower-roman 1]}	Release date	MSRP
Ryzen 7	2700X ^{[lower-alpha 1]}	8 (16)	Wraith Prism	3.7	4.3	16 MB	105 W	2 × 4	Apr 19, 2018	US $329
	2700 ^{[lower-alpha 1]}		Wraith Spire (LED)	3.2	4.1		65 W		Apr 19, 2018	US $299
	2700E		OEM	2.8	4.0		45 W		Sep 19, 2018	OEM
Ryzen 5	2600X	6 (12)	Wraith Spire (non LED)	3.6	4.2		95 W	2 × 3	Apr 19, 2018	US $229
	2600 ^{[lower-alpha 1]}		Wraith Stealth	3.4	3.9		65 W		Apr 19, 2018	US $199
	2600E		OEM	3.1	4.0		45 W		Sep 19, 2018	OEM
	1600 (AF) ^{[lower-alpha 2]}		Wraith Stealth	3.2	3.6		65 W		Oct 11, 2019	US $85
	2500X	4 (8)	OEM	3.6	4.0	8 MB		1 × 4	Sep 10, 2018	OEM
Ryzen 3	2300X	4 (4)	OEM	3.5	4.0				Sep 10, 2018	OEM
Ryzen 3	1200 (AF)^[7]^{[lower-alpha 2]}	4 (4)	Wraith Stealth	3.1	3.4				Apr 21, 2020	US $60

↑ Core Complexes (CCX) × cores per CCX

1 2 3 Model also available as PRO version as 2600^[4], 2700^[5], 2700X^[6], released on September 19, 2018.
1 2 AF models are 12 nm Zen+ refresh of 14 nm Zen models (1200^{[lower-alpha 3]} and 1600^{[lower-alpha 4]} with "AF" suffixes).
"AMD Ryzen 3 1200". AMD. Retrieved October 9, 2022.
"AMD Ryzen 5 1600". AMD. Retrieved October 9, 2022.

Colfax (Threadripper 2000 series, Zen+ based)

Common features of Ryzen 2000 HEDT CPUs:

Socket: TR4.
All the CPUs support DDR4-2933 in quad-channel mode.
L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
No integrated graphics.
Fabrication process: GlobalFoundries 12LP (14LP+).

Branding and Model		Cores (threads)	Clock rate (GHz)		L3 cache (total)	TDP	Chiplets	Core config^{[lower-roman 1]}	Release date	MSRP
Branding and Model		Cores (threads)	Base	PB2	L3 cache (total)	TDP	Chiplets	Core config^{[lower-roman 1]}	Release date	MSRP
Ryzen Threadripper	2990WX^[8]	32 (64)	3.0	4.2	64 MB	250 W	4 × CCD	8 × 4	Aug 13, 2018	US $1799
	2970WX^[9]	24 (48)	3.0	4.2	64 MB	250 W	4 × CCD	8 × 3	Oct 2018	US $1299
	2950X^[10]	16 (32)	3.5	4.4	32 MB	180 W	2 × CCD	4 × 4	Aug 31, 2018	US $899
	2920X^[11]	12 (24)	3.5	4.3	32 MB	180 W	2 × CCD	4 × 3	Oct 2018	US $649

↑ Core Complexes (CCX) × cores per CCX

Ryzen 3000 series

Picasso (3000 series with Radeon Graphics, Zen+/GCN5 based)

Common features of Ryzen 3000 desktop APUs:

Socket: AM4.
All the CPUs support DDR4-2933 in dual-channel mode.
L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 16 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
Includes integrated GCN 5th generation GPU.
Fabrication process: GlobalFoundries 12LP (14LP+).

Branding and Model		CPU				GPU				TDP	Release date	MSRP
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Model	Clock (GHz)	Config^{[lower-roman 1]}	Processing power (GFLOPS)^{[lower-roman 2]}
		Cores (threads)	Base	Boost	L3 cache (total)	Model	Clock (GHz)	Config^{[lower-roman 1]}	Processing power (GFLOPS)^{[lower-roman 2]}
Ryzen 5	PRO 3400G	4 (8)	3.7	4.2	4 MB	Radeon RX Vega 11	1.4	704:44:8 11 CU	1971.2	65 W	Sep 30, 2019	OEM
	3400G ^[12]		3.7	4.2			1.4		1971.2	65 W	Jul 7, 2019	US $149
	PRO 3400GE		3.3	4.0			1.3		1830.4	35 W	Sep 30, 2019	OEM
	PRO 3350G		3.6	4.0		Radeon Vega 10	1.3	640:40:8 10 CU	1664	65 W	Jul 21, 2020
	PRO 3350GE	4 (4)	3.3	3.9		Radeon Vega 10	1.2	640:40:8 10 CU	1536	35 W	Jul 21, 2020
Ryzen 3	PRO 3200G		3.6	4.0		Radeon Vega 8	1.25	512:32:8 8 CU	1280	65 W	Sep 30, 2019
	3200G ^[12]		3.6	4.0			1.25		1280	65 W	Jul 7, 2019	US $99
	3200GE		3.3	3.8			1.2		1228.8	35 W	Jul 7, 2019	OEM
	PRO 3200GE		3.3	3.8			1.2		1228.8	35 W	Sep 30, 2019	OEM

↑ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
↑ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Matisse (3000 series, Zen 2 based)

Common features of Ryzen 3000 desktop CPUs:

Socket: AM4.
All the CPUs support DDR4-3200 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
No integrated graphics.
Fabrication process: TSMC 7FF.

Branding and Model		Cores (threads)	Thermal Solution	Clock rate (GHz)		L3 cache (total)	TDP	Chiplets	Core config^{[lower-roman 1]}	Release date	MSRP
Branding and Model		Cores (threads)	Thermal Solution	Base	Boost	L3 cache (total)	TDP	Chiplets	Core config^{[lower-roman 1]}	Release date	MSRP
Ryzen 9	3950X	16 (32)	N/A	3.5	4.7	64 MB	105 W^{[lower-roman 2]}	2 × CCD 1 × I/OD	4 × 4	Nov 25, 2019	US $749
	3900XT	12 (24)	N/A	3.8	4.7				4 × 3	Jul 7, 2020	US $499
	3900X		Wraith Prism	3.8	4.6					Jul 7, 2019	US $499
	3900 ^{[lower-alpha 1]}		OEM	3.1	4.3		65 W			Oct 8, 2019	OEM
Ryzen 7	3800XT	8 (16)	N/A	3.9	4.7	32 MB	105 W	1 × CCD 1 × I/OD	2 × 4	Jul 7, 2020	US $399
	3800X		Wraith Prism	3.9	4.5		105 W			Jul 7, 2019	US $399
	3700X ^{[lower-alpha 1]}		Wraith Prism	3.6	4.4		065 W^{[lower-roman 3]}			Jul 7, 2019	US $329
Ryzen 5	3600XT	6 (12)	N/A	3.8	4.5		95 W		2 × 3	Jul 7, 2020	US $249
	3600X		Wraith Spire (non-LED)	3.8	4.4		95 W			Jul 7, 2019	US $249
	3600 ^{[lower-alpha 1]}		Wraith Stealth	3.6	4.2		65 W			Jul 7, 2019	US $199
	3500X ^[14]	6 (6)	Wraith Stealth		4.1					Oct 8, 2019	China ¥1099
	3500	6 (6)	OEM		4.1	16 MB				Nov 15, 2019	OEM (West) Japan ¥16000^[15]
Ryzen 3	3300X	4 (8)	Wraith Stealth	3.8	4.3				1 × 4	Apr 21, 2020	US $119
Ryzen 3	3100	4 (8)	Wraith Stealth	3.6	3.9				2 × 2	Apr 21, 2020	US $99

↑ Core Complexes (CCXs) × cores per CCX
↑ Ryzen 9 3900X and Ryzen 9 3950X may consume over 145 W under load.^[13]
↑ Ryzen 7 3700X may consume over 90 W under load.^[13]

1 2 3 Model also available as PRO 3600, PRO 3700, PRO 3900, released on September 30, 2019 for OEMs.

Castle Peak (Threadripper 3000 series, Zen 2 based)

Common features of Ryzen 3000 HEDT/workstation CPUs:

Socket: sTRX4 (Threadripper), sWRX8 (Threadripper PRO).
Threadripper CPUs support DDR4-3200 in quad-channel mode while Threadripper PRO CPUs support DDR4-3200 in octa-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
Threadripper CPUs support 64 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
No integrated graphics.
Fabrication process: TSMC 7FF.

Branding and Model		Cores (threads)	Clock rate (GHz)		L3 cache (total)	TDP	Chiplets	Core config^{[lower-roman 1]}	Release date	MSRP
Branding and Model		Cores (threads)	Base	Boost	L3 cache (total)	TDP	Chiplets	Core config^{[lower-roman 1]}	Release date	MSRP
Ryzen Threadripper PRO	3995WX	64 (128)	2.7	4.2	256 MB	280 W ^{[lower-roman 2]}	8 × CCD 1 × I/OD	16 × 4	Jul 14, 2020
	3975WX	32 (64)	3.5	4.2	128 MB		4 × CCD 1 × I/OD	8 × 4
	3955WX	16 (32)	3.9	4.3	64 MB		2 × CCD 1 × I/OD	4 × 4
	3945WX	12 (24)	4.0		64 MB		2 × CCD 1 × I/OD	4 × 3
Ryzen Threadripper	3990X	64 (128)	2.9		256 MB		8 × CCD 1 × I/OD	16 × 4	Feb 7, 2020	US $3990
	3970X	32 (64)	3.7	4.5	128 MB		4 × CCD 1 × I/OD	8 × 4	Nov 25, 2019	US $1999
	3960X	24 (48)	3.8	4.5	128 MB		4 × CCD 1 × I/OD	8 × 3	Nov 25, 2019	US $1399

↑ Core Complexes (CCXs) × cores per CCX
↑ Ryzen Threadripper 3990X may consume over 490 W under load.^[16]

Ryzen 4000 series

Renoir (4000 series, Zen 2 based)

Based on the Ryzen 4000G series APUs with the integrated GPU disabled. Common features of Ryzen 4000 desktop CPUs:

Socket: AM4.
All the CPUs support DDR4-3200 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
No integrated graphics.
Fabrication process: TSMC 7FF.
Bundled with AMD Wraith Stealth

The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock.^[17]^[18]^[19]

Branding and model		Cores (threads)	Clock rate (GHz)		L3 cache (total)	TDP	Core config^{[lower-roman 1]}	Release date	MSRP
Branding and model		Cores (threads)	Base	Boost	L3 cache (total)	TDP	Core config^{[lower-roman 1]}	Release date	MSRP
AMD	4800S^[17]^[18]	8 (16)		4.0	8 MB		2 × 4	2022	bundled with desktop kit
AMD	4700S ^[19]	8 (16)	3.6	4.0		75 W	2 × 4	2021	bundled with desktop kit
Ryzen 5	4500	6 (12)	3.6	4.1		65 W	2 × 3	Apr 4, 2022	US $129
Ryzen 3	4100	4 (8)	3.8	4.0	4 MB	65 W	1 × 4	Apr 4, 2022	US $99

↑ Core Complexes (CCX) × cores per CCX

Renoir (4000 series with Radeon Graphics, Zen 2/GCN5 based)

Common features of Ryzen 4000 desktop APUs:

Socket: AM4.
All the CPUs support DDR4-3200 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
Includes integrated GCN 5th generation GPU.
Fabrication process: TSMC 7FF.

Branding and model		CPU					GPU				TDP	Release date	Release price
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core Config^{[lower-roman 1]}	Model	Clock (GHz)	Config^{[lower-roman 2]}	Processing power^{[lower-roman 3]} (GFLOPS)
		Cores (threads)	Base	Boost	L3 cache (total)	Core Config^{[lower-roman 1]}	Model	Clock (GHz)	Config^{[lower-roman 2]}	Processing power^{[lower-roman 3]} (GFLOPS)
Ryzen 7	4700G ^{[lower-alpha 1]}	8 (16)	3.6	4.4	8 MB	2 × 4	Radeon Graphics^{[lower-alpha 2]}	2.1	512:32:16 8 CU	2150.4	65 W	Jul 21, 2020	OEM
Ryzen 7	4700GE ^{[lower-alpha 1]}	8 (16)	3.1	4.3		2 × 4		2.0	512:32:16 8 CU	2048	35 W	Jul 21, 2020	OEM
Ryzen 5	4600G ^{[lower-alpha 1]}^[20]	6 (12)	3.7	4.2		2 × 3		1.9	448:28:14 7 CU	1702.4	65 W	Jul 21, 2020 (OEM) / Apr 4, 2022 (retail)	OEM / US $154
Ryzen 5	4600GE ^{[lower-alpha 1]}	6 (12)	3.3	4.2		2 × 3		1.9	448:28:14 7 CU	1702.4	35 W	Jul 21, 2020	OEM
Ryzen 3	4300G ^{[lower-alpha 1]}	4 (8)	3.8	4.0	4 MB	1 × 4		1.7	384:24:12 6 CU	1305.6	65 W
Ryzen 3	4300GE ^{[lower-alpha 1]}	4 (8)	3.5	4.0	4 MB	1 × 4		1.7	384:24:12 6 CU	1305.6	35 W

↑ Core complexes (CCXs) × cores per CCX
↑ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
↑ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

1 2 3 4 5 6 Model also available as PRO version as 4350GE,^{[lower-alpha 3]} 4350G,^{[lower-alpha 4]} 4650GE,^{[lower-alpha 5]} 4650G,^{[lower-alpha 6]} 4750GE,^{[lower-alpha 7]} 4750G,^{[lower-alpha 8]} released on July 21, 2020 for OEM only.^{[lower-alpha 9]}
↑ All of the iGPUs are branded as AMD Radeon Graphics.
"AMD Ryzen 3 PRO 4350GE". AMD. Retrieved October 18, 2022.
"AMD Ryzen 3 PRO 4350G". AMD. Retrieved October 18, 2022.
"AMD Ryzen 3 PRO 4650GE". AMD. Retrieved October 18, 2022.
"AMD Ryzen 3 PRO 4650G". AMD. Retrieved October 18, 2022.
"AMD Ryzen 3 PRO 4750GE". AMD. Retrieved October 18, 2022.
"AMD Ryzen 3 PRO 4750G". AMD. Retrieved October 18, 2022.
"AMD Ryzen 4000 Series Desktop Processors with AMD Radeon Graphics Set to Deliver Breakthrough Performance for Commercial and Consumer Desktop PCs". AMD. July 21, 2020. Retrieved October 18, 2022.

Ryzen 5000 series

Vermeer (5000 series, Zen 3 based)

Common features of Ryzen 5000 desktop CPUs:

Socket: AM4.
All the CPUs support DDR4-3200 in dual-channel mode.
L1 cache: 64 KB per core (32 KB data + 32 KB instruction).
L2 cache: 512 KB per core.
All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
No integrated graphics.
Fabrication process: TSMC 7FF.

Branding and model		Cores (threads)	Thermal solution	Clock rate (GHz)		L3 cache (total)	TDP	Chiplets	Core config^{[lower-roman 1]}	Release date	MSRP
Branding and model		Cores (threads)	Thermal solution	Base	Boost	L3 cache (total)	TDP	Chiplets	Core config^{[lower-roman 1]}	Release date	MSRP
Ryzen 9	5950X	16 (32)	—	3.4	4.9	64 MB	105 W	2 × CCD 1 × I/OD	2 × 8	Nov 5, 2020	US $799
	5900X	12 (24)		3.7	4.8		105 W		2 × 6	Nov 5, 2020	US $549
	5900			3.0	4.7		65 W			Jan 12, 2021	OEM
	PRO 5945			3.0	4.7		65 W			Sep 2022^[21]	OEM
Ryzen 7	5800X3D	8 (16)		3.4	4.5	96 MB	105 W	1 × CCD 1 × I/OD	1 × 8	Apr 20, 2022	US $449
	5800X			3.8	4.7	32 MB	105 W			Nov 5, 2020	US $449
	5800			3.4	4.6	32 MB	65 W			Jan 12, 2021	OEM
	5700X3D			3.0	4.1	96 MB	105 W			Jan 31, 2024^[22]	US $249
	5700X			3.4	4.6	32 MB	65 W			Apr 4, 2022	US $299
	PRO 5845			3.4	4.6	32 MB	65 W			Sep 2022	OEM
Ryzen 5	5600X3D	6 (12)		3.3	4.4	96 MB	105 W		1 × 6	Jul 7, 2023 US Only^[23]	US $229^[24]
	5600X		Wraith Stealth	3.7	4.6	32 MB	65 W			Nov 5, 2020	US $299
	5600		Wraith Stealth	3.5	4.4					Apr 4, 2022	US $199
	PRO 5645		—	3.7	4.6					Sep 2022	OEM

↑ Core Complexes (CCX) × cores per CCX

Cezanne (5000 series, Zen 3 based)

Cezanne based CPUs that have the integrated GPU disabled. Common features of Ryzen 5000 (Cezanne) desktop CPUs:

Socket: AM4.
CPUs support DDR4-3200 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
No integrated graphics.
Fabrication process: TSMC 7FF.

Branding and model		Cores (threads)	Thermal solution	Clock rate (GHz)		L3 cache (total)	TDP	Core config^{[lower-roman 1]}	Release date	MSRP (USD)
Branding and model		Cores (threads)	Thermal solution	Base	Boost	L3 cache (total)	TDP	Core config^{[lower-roman 1]}	Release date	MSRP (USD)
Ryzen 7	5700 ^[25]	8 (16)	Wraith Stealth	3.7	4.6	16 MB	65 W	1 × 8	Apr 4, 2022 (OEM), Dec 21, 2023 (retail)	$179
Ryzen 5	5500	6 (12)	Wraith Stealth	3.6	4.2	16 MB		1 × 6	Apr 4, 2022	$159
Ryzen 3	5100^[26]^[27]^[28]	4 (8)	–	3.8	4.2	8 MB		1 × 4	2023	OEM

↑ Core Complexes (CCX) × cores per CCX

Cezanne (5000 series with Radeon Graphics, Zen 3/GCN5 based)

Common features of Ryzen 5000 desktop APUs:

Socket: AM4.
All the CPUs support DDR4-3200 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
Includes integrated GCN 5th generation GPU.
Fabrication process: TSMC 7FF.

Branding and model		CPU					GPU ^{[lower-alpha 1]}			Thermal solution	TDP	Release date	MSRP
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config^{[lower-roman 1]}	Clock (MHz)	Config^{[lower-roman 2]}	Processing power^{[lower-roman 3]} (GFLOPS)
		Cores (threads)	Base	Boost	L3 cache (total)	Core config^{[lower-roman 1]}	Clock (MHz)	Config^{[lower-roman 2]}	Processing power^{[lower-roman 3]} (GFLOPS)
Ryzen 7	5700G ^{[lower-alpha 2]}	8 (16)	3.8	4.6	16 MB	1 × 8	2000	512:32:8 8 CU	2048	Wraith Stealth	65 W	Apr 13, 2021 (OEM), Aug 5, 2021 (retail)	US $359
Ryzen 7	5700GE ^{[lower-alpha 2]}	8 (16)	3.2			1 × 8	2000	512:32:8 8 CU	2048		35 W	Apr 13, 2021	OEM
Ryzen 5	5600GT	6 (12)	3.6			1 × 6	1900	448:28:8 7 CU	1702.4		65 W	Jan 31, 2024^[29]	US $140
	5600G ^{[lower-alpha 2]}		3.9	4.4							65 W	Apr 13, 2021 (OEM), Aug 5, 2021 (retail)	US $259
	5600GE ^{[lower-alpha 2]}		3.4								35 W	Apr 13, 2021	OEM
	5500GT		3.6								65 W	Jan 31, 2024^[29]	US $125
Ryzen 3	5300G ^{[lower-alpha 2]}	4 (8)	4.0	4.2	8 MB	1 × 4	1700	384:24:8 6 CU	1305.6	OEM	65 W	Apr 13, 2021	OEM
Ryzen 3	5300GE ^{[lower-alpha 2]}	4 (8)	3.6	4.2	8 MB	1 × 4	1700	384:24:8 6 CU	1305.6	OEM	35 W	Apr 13, 2021	OEM

↑ Core Complexes (CCX) × cores per CCX
↑ Unified shaders : texture mapping units : render output units and compute units (CU)
↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

↑ All of the iGPUs are branded as AMD Radeon Graphics.
1 2 3 4 5 6 Model also available as PRO version as 5350GE,^{[lower-alpha 3]} 5350G,^{[lower-alpha 4]} 5650GE,^{[lower-alpha 5]} 5650G,^{[lower-alpha 6]} 5750GE,^{[lower-alpha 7]} 5750G,^{[lower-alpha 8]} released June 1, 2021.^{[lower-alpha 9]}
"AMD Ryzen 3 PRO 5350GE". AMD.
"AMD Ryzen 3 PRO 5350G". AMD.
"AMD Ryzen 5 PRO 5650GE". AMD.
"AMD Ryzen 5 PRO 5650G". AMD.
"AMD Ryzen 7 PRO 5750GE". AMD.
"AMD Ryzen 7 PRO 5750G". AMD.
btarunr (June 1, 2021). "AMD Announces Ryzen 5000G and PRO 5000G Desktop Processors". TechPowerUp.

Chagall (Threadripper 5000 series, Zen 3 based)

Common features of Ryzen 5000 workstation CPUs:

Socket: sWRX8.
All the CPUs support DDR4-3200 in octa-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
No integrated graphics.
Fabrication process: TSMC 7FF.

Branding and Model		Cores (threads)	Clock rate (GHz)		L3 cache (total)	TDP	Chiplets	Core config^{[lower-roman 1]}	Release date	MSRP
Branding and Model		Cores (threads)	Base	Boost	L3 cache (total)	TDP	Chiplets	Core config^{[lower-roman 1]}	Release date	MSRP
Ryzen Threadripper PRO	5995WX	64 (128)	2.7	4.5	256 MB	280 W	8 × CCD 1 × I/OD	8 × 8	Mar 8, 2022 (OEM) / ? (retail)	OEM / US $6500
	5975WX	32 (64)	3.6		128 MB		4 × CCD 1 × I/OD	4 × 8	Mar 8, 2022 (OEM) / ? (retail)	OEM / US $3300
	5965WX	24 (48)	3.8		128 MB		4 × CCD 1 × I/OD	4 × 6	Mar 8, 2022 (OEM) / ? (retail)	OEM / US $2400
	5955WX	16 (32)	4.0		64 MB		2 × CCD 1 × I/OD	2 × 8	Mar 8, 2022	OEM
	5945WX	12 (24)	4.1		64 MB		2 × CCD 1 × I/OD	2 × 6	Mar 8, 2022	OEM

↑ Core Complexes (CCX) × cores per CCX

Ryzen 7000 series

Raphael (7000 series, Zen 4/RDNA2 based)

Common features of Ryzen 7000 desktop CPUs:

Socket: AM5.
All the CPUs support DDR5-5200 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 1 MB per core.
All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost)^{[lower-roman 1]}. Models with "F" suffixes are without iGPUs.
Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).

Branding and model		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Thermal solution	Chiplets	Core config^{[lower-roman 2]}	TDP	Release date	MSRP
Branding and model		Cores (threads)	Base	Boost	L3 cache (total)	Thermal solution	Chiplets	Core config^{[lower-roman 2]}	TDP	Release date	MSRP
Ryzen 9	7950X3D	16 (32)	4.2	5.7	128 MB^{[lower-roman 3]}	—	2 × CCD 1 × I/OD	2 × 8	120 W	Feb 28, 2023	US $699
	7950X	16 (32)	4.5	5.7	64 MB			2 × 8	170 W	Sep 27, 2022	US $699
	7900X3D	12 (24)	4.4	5.6	128 MB^{[lower-roman 3]}			2 × 6	120 W	Feb 28, 2023	US $599
	7900X		4.7	5.6	64 MB				170 W	Sep 27, 2022	US $549
	7900		3.7	5.4		Wraith Prism			65 W	Jan 10, 2023	US $429^[32]
	PRO 7945		3.7	5.4		Wraith Spire			65 W	Jun 13, 2023	OEM
Ryzen 7	7800X3D	8 (16)	4.2	5.0	96 MB	—	1 × CCD 1 × I/OD	1 × 8	120 W	Apr 6, 2023	US $449
	7700X		4.5	5.4	32 MB	—			105 W	Sep 27, 2022	US $399
	7700		3.8	5.3		Wraith Prism			65 W	Jan 10, 2023	US $329^[32]
	PRO 7745		3.8			Wraith Spire			65 W	Jun 13, 2023	OEM
Ryzen 5	7600X	6 (12)	4.7			—		1 × 6	105 W	Sep 27, 2022	US $299
	7600		3.8	5.1		Wraith Stealth			65 W	Jan 10, 2023	US $229^[32]
	PRO 7645		3.8	5.1		Wraith Spire				Jun 13, 2023	OEM
	7500F		3.7	5.0		Wraith Stealth				Jul 22, 2023	US $179^[33]

↑ Self identifies as "AMD Radeon Graphics". See RDNA 2 § Integrated graphics processors (iGPs).
↑ Core Complexes (CCX) × cores per CCX
1 2 Only one of the two CCXes has additional 64 MB 3D V-Cache.^[30] Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.^[31]

Storm Peak (Threadripper 7000 series, Zen 4 based)

Common features of Ryzen 7000 HEDT/workstation CPUs:

Socket: sTR5.
Threadripper CPUs support DDR5-5200 in quad-channel mode while Threadripper PRO CPUs support DDR5-5200 in octa-channel mode with ECC support.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 1 MB per core.
Threadripper CPUs support 48 PCIe 5.0 and 24 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 5.0 lanes. In addition, all processor models have 4 PCIe 4.0 lanes reserved as link to the chipset.
No integrated graphics.
Fabrication process: TSMC 5FF.

Branding and model		Cores (threads)	Clock rate (GHz)		L3 cache (total)	TDP	Chiplets	Core config^{[lower-roman 1]}	Release date	MSRP
Branding and model		Cores (threads)	Base	Boost	L3 cache (total)	TDP	Chiplets	Core config^{[lower-roman 1]}	Release date	MSRP
Ryzen Threadripper PRO	7995WX	96 (192)	2.5	5.1	384 MB	350 W	12 × CCD 1 × I/OD	12 × 8	Nov 21, 2023^[34]	US $9999
	7985WX	64 (128)	3.2	5.1	256 MB		8 × CCD 1 × I/OD	8 × 8		US $7349
	7975WX	32 (64)	4.0	5.3	128 MB		4 × CCD 1 × I/OD	4 × 8		US $3899
	7965WX	24 (48)	4.2		128 MB		4 × CCD 1 × I/OD	4 × 6		US $2649
	7955WX	16 (32)	4.5		64 MB		2 × CCD 1 × I/OD	2 × 8		US $1899
	7945WX	12 (24)	4.7		64 MB		2 × CCD 1 × I/OD	2 × 6		US $1399
Ryzen Threadripper	7980X	64 (128)	3.2	5.1	256 MB		8 × CCD 1 × I/OD	8 × 8		US $4999
	7970X	32 (64)	4.0	5.3	128 MB		4 × CCD 1 × I/OD	4 × 8		US $2499
	7960X	24 (48)	4.2	5.3	128 MB		4 × CCD 1 × I/OD	4 × 6		US $1499

↑ Core Complexes (CCXs) × cores per CCX

Ryzen 8000 series

Phoenix (8000 series, Zen 4 based)

Common features of Ryzen 8000 desktop CPUs:

Socket: AM5.
All the CPUs support DDR5-5200 RAM in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 1 MB per core.
All the CPUs support 20 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
No integrated graphics.
Fabrication process: TSMC 4 nm FinFET.

Branding and model		Cores (threads)	Clock rate (GHz)		L3 cache (total)	NPU	Thermal solution	TDP	Core config^{[lower-alpha 1]}	Release date	MSRP
Branding and model		Cores (threads)	Base	Boost	L3 cache (total)	NPU	Thermal solution	TDP	Core config^{[lower-alpha 1]}	Release date	MSRP
Ryzen 7	8700F	8 (16)	4.1	5.0	16 MB	Partial^{[lower-alpha 2]}	Wraith Stealth	65 W	1 × 8	April 1, 2024^[35]
Ryzen 5	8400F	6 (12)	4.2	4.7	16 MB	No	Wraith Stealth	65 W	1 × 6	April 1, 2024^[35]

↑ Core Complexes (CCX) × cores per CCX, or Zen 4 + Zen 4c cores
↑ Ryzen AI is only available when paired with a Radeon RX 7000 series graphics card as they feature AI acceleration

Phoenix (8000 series with Radeon Graphics, Zen 4/RDNA3/XDNA based)

Common features of Ryzen 8000G desktop APUs:

Socket: AM5.
All the CPUs support DDR5-5200 RAM in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 1 MB per core.
Models with Zen 4c cores (codenamed Phoenix 2) support 14 PCIe 4.0 lanes, while models without them support 20 lanes. 4 of the lanes are reserved as link to the chipset.
Includes integrated RDNA 3 GPU.
Includes XDNA AI Engine (Ryzen AI) on upper end models as indicated in table below.
Fabrication process: TSMC 4 nm FinFET.

Branding and model		CPU							GPU			NPU	Thermal solution	TDP	Release date	MSRP
		Cores (threads)			Clock rate (GHz)		L3 cache (total)	Core config^{[lower-alpha 1]}	Model	Core config^{[lower-alpha 2]}^{[lower-alpha 3]}	Clock (GHz)
		Total	Zen 4	Zen 4c	Base	Boost	L3 cache (total)	Core config^{[lower-alpha 1]}	Model	Core config^{[lower-alpha 2]}^{[lower-alpha 3]}	Clock (GHz)
Ryzen 7	8700G	8 (16)	8 (16)	—	4.2	5.1	16 MB	1 × 8	780M	12 CUs 768:48:24:12	2.9	Ryzen AI Up to 16 TOPS	Wraith Spire	65 W	Jan 31, 2024^[36]	US $329
Ryzen 5	8600G	6 (12)	6 (12)	—	4.3	5.0		1 × 6	760M	8 CUs 512:32:16:8	2.8	Ryzen AI Up to 16 TOPS	Wraith Stealth			US $229
Ryzen 5	8500G	6 (12)	2 (4)	4 (8)	4.1 / 3.2^{[lower-alpha 4]}	5.0 / 3.7^{[lower-alpha 5]}		2 + 4	740M	4 CUs 256:16:8:4	2.8	No				US $179
Ryzen 3	8300G	4 (8)	1 (2)	3 (6)	4.0 / 3.2^{[lower-alpha 4]}	4.9 / 3.6^{[lower-alpha 5]}	8 MB	1 + 3	740M	4 CUs 256:16:8:4	2.6	No			Jan 2024 (OEM) / Q1 2024 (retail)	OEM / TBA

↑ Core Complexes (CCX) × cores per CCX, or Zen 4 + Zen 4c cores
↑ Unified shaders : Texture mapping units : Render output units : Ray accelerators : AI accelerators and Compute units (CU)
↑ GPUs based on RDNA 3 have dual-issue stream processors so that up to two shader instructions can be executed per clock cycle under certain parallelism conditions.
1 2 Zen 4 cores' base frequency / Zen 4c cores' base frequency
1 2 Zen 4 cores' boost frequency / Zen 4c cores' boost frequency

Mobile processors

Ryzen 2000 series

Raven Ridge (Zen/GCN5 based)

Common features of Ryzen 2000 notebook APUs:

Socket: FP5.
The U-series CPUs support DDR4-2400 in dual-channel mode, while the H-series CPUs support it at DDR4-3200 speeds.
L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 12 PCIe 3.0 lanes.
Includes integrated GCN 5th generation GPU.
Fabrication process: GlobalFoundries 14LP.

Branding and Model		CPU					GPU				TDP	Release date
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config^{[lower-roman 1]}	Model^{[lower-alpha 1]}	Clock (GHz)	Config^{[lower-roman 2]}	Processing power (GFLOPS)^{[lower-roman 3]}
		Cores (threads)	Base	Boost	L3 cache (total)	Core config^{[lower-roman 1]}	Model^{[lower-alpha 1]}	Clock (GHz)	Config^{[lower-roman 2]}	Processing power (GFLOPS)^{[lower-roman 3]}
Ryzen 7	2800H	4 (8)	3.3	3.8	4 MB	1 × 4	RX Vega 11	1.3	704:44:16 11 CUs	1830.4	35–54 W	Sep 10, 2018
Ryzen 7	2700U ^{[lower-alpha 2]}		2.2	3.8			RX Vega 10	1.3	640:40:16 10 CUs	1664	12–25 W	Oct 26, 2017
Ryzen 5	2600H		3.2	3.6			Vega 8	1.1	512:32:16 8 CUs	1126.4	35–54 W	Sep 10, 2018
Ryzen 5	2500U ^{[lower-alpha 2]}		2.0	3.6			Vega 8		512:32:16 8 CUs	1126.4	12–25 W	Oct 26, 2017
Ryzen 3	2300U ^{[lower-alpha 2]}	4 (4)	2.0	3.4			Vega 6		384:24:8 6 CUs	844.8		Jan 8, 2018
Ryzen 3	2200U	2 (4)	2.5	3.4		1 × 2	Vega 3		192:12:4 3 CUs	422.4		Jan 8, 2018

↑ Core Complexes (CCX) × cores per CCX
↑ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

↑ Branded as Radeon Vega instead of Radeon RX Vega on the PRO CPUs.
1 2 3 Model also available as PRO version as 2300U, 2500U, 2700U, released on May 15, 2018.

Ryzen 3000 series

Dalí (Zen/GCN5 based)

Common features of Ryzen 3000 notebook APUs:

Socket: FP5.
All the CPUs support DDR4-2400 in dual-channel mode.
L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 12 PCIe 3.0 lanes.
Includes integrated GCN 5th generation GPU.
Fabrication process: GlobalFoundries 14LP.

Branding and Model		CPU					GPU				TDP	Release date
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config^{[lower-roman 1]}	Model	Clock (GHz)	Config^{[lower-roman 2]}	Processing power (GFLOPS)^{[lower-roman 3]}
		Cores (threads)	Base	Boost	L3 cache (total)	Core config^{[lower-roman 1]}	Model	Clock (GHz)	Config^{[lower-roman 2]}	Processing power (GFLOPS)^{[lower-roman 3]}
Ryzen 3	3250U	2 (4)	2.6	3.5	4 MB	1 × 2	Vega 3	1.2	192:12:4 3 CUs	460.8	12–25 W	Jan 6, 2020
	3250C											Sep 22, 2020
	3200U											Jan 6, 2019

↑ Core Complexes (CCX) × cores per CCX
↑ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Picasso (Zen+/GCN5 based)

Common features of Ryzen 3000 notebook APUs:

Socket: FP5.
All the CPUs support DDR4-2400 in dual-channel mode.
L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 16 PCIe 3.0 lanes.
Includes integrated GCN 5th generation GPU.
Fabrication process: GlobalFoundries 12LP (14LP+).

Branding and Model		CPU					GPU				TDP	Release date
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config^{[lower-roman 1]}	Model	Clock (GHz)	Config^{[lower-roman 2]}	Processing power (GFLOPS)^{[lower-roman 3]}
		Cores (threads)	Base	Boost	L3 cache (total)	Core config^{[lower-roman 1]}	Model	Clock (GHz)	Config^{[lower-roman 2]}	Processing power (GFLOPS)^{[lower-roman 3]}
Ryzen 7	3780U^[37]	4 (8)	2.3	4.0	4 MB	1 × 4	RX Vega 11	1.4	704:44:16 11 CU	1971.2	15 W	Oct 2019
	3750H^[38]						RX Vega 10		640:40:16 10 CU^[39]	1792.0	35 W	Jan 6, 2019
	3700C^[40]										15 W	Sep 22, 2020
	3700U^{[lower-alpha 1]}^[41]											Jan 6, 2019
Ryzen 5	3580U^[42]		2.1	3.7			Vega 9	1.3	576:36:16 9 CU	1497.6		Oct 2019
	3550H^[43]						Vega 8	1.2	512:32:16 8 CU^[44]	1228.8	35 W	Jan 6, 2019
	3500C^[45]										15 W	Sep 22, 2020
	3500U^{[lower-alpha 1]}^[46]											Jan 6, 2019
	3450U^[47]			3.5								Jun 2020
Ryzen 3	3350U^[48]	4 (4)					Vega 6		384:24:8 6 CU^[49]	921.6		Jan 6, 2019
Ryzen 3	3300U^{[lower-alpha 1]}^[50]	4 (4)					Vega 6		384:24:8 6 CU^[49]	921.6		Jan 6, 2019

↑ Core Complexes (CCX) × cores per CCX
↑ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

1 2 3 Model also available as PRO version^{[lower-alpha 2]}^{[lower-alpha 3]}^{[lower-alpha 4]}, released April 8, 2019.
"AMD Ryzen 3 PRO 3300U Mobile Processor with Radeon Vega 6 Graphics".
"AMD Ryzen 5 PRO 3500U Mobile Processor with Radeon Vega 8 Graphics".
"AMD Ryzen 7 PRO 3700U Mobile Processor with Radeon Vega 10 Graphics".

Ryzen 4000 series

Renoir (Zen 2/GCN5 based)

Common features of Ryzen 4000 notebook APUs:

Socket: FP6.
All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 16 PCIe 3.0 lanes.
Includes integrated GCN 5th generation GPU.
Fabrication process: TSMC 7FF.

Branding and Model		CPU					GPU				TDP	Release date
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config^{[lower-roman 1]}	Model	Clock (GHz)	Config^{[lower-roman 2]}	Processing power (GFLOPS)^{[lower-roman 3]}
		Cores (threads)	Base	Boost	L3 cache (total)	Core config^{[lower-roman 1]}	Model	Clock (GHz)	Config^{[lower-roman 2]}	Processing power (GFLOPS)^{[lower-roman 3]}
Ryzen 9	4900H	8 (16)	3.3	4.4	8 MB	2 × 4	Radeon Graphics ^{[lower-alpha 1]}	1.75	512:32:8 8 CU	1792	35–54 W	Mar 16, 2020
Ryzen 9	4900HS		3.0	4.3				1.75	512:32:8 8 CU	1792	35 W
Ryzen 7	4800H ^[51]		2.9	4.2				1.6	448:28:8 7 CU	1433.6	35–54 W
	4800HS		2.9	4.2				1.6	448:28:8 7 CU	1433.6	35 W
	4980U ^{[lower-alpha 2]}		2.0	4.4				1.95	512:32:8 8 CU	1996.8	10–25 W	Apr 13, 2021
	4800U		1.8	4.2				1.75	512:32:8 8 CU	1792		Mar 16, 2020
	4700U ^{[lower-alpha 3]}	8 (8)	2.0	4.1				1.6	448:28:8 7 CU	1433.6
Ryzen 5	4600H ^[52]	6 (12)	3.0	4.0		2 × 3		1.5	384:24:8 6 CU	1152	35–54 W
	4600HS^[53]		3.0						384:24:8 6 CU	1152	35 W
	4680U ^{[lower-alpha 2]}		2.1						448:28:8 7 CU	1344	10–25 W	Apr 13, 2021
	4600U ^{[lower-alpha 3]}		2.1						384:24:8 6 CU	1152		Mar 16, 2020
	4500U	6 (6)	2.3						384:24:8 6 CU	1152
Ryzen 3	4300U ^{[lower-alpha 3]}	4 (4)	2.7	3.7	4 MB	1 × 4		1.4	320:20:8 5 CU	896

↑ Core Complexes (CCX) × cores per CCX
↑ Unified shaders : texture mapping units : render output units and compute units (CU)
↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

↑ All of the iGPUs are branded as AMD Radeon Graphics.
1 2 Only found on the Microsoft Surface Laptop 4.
1 2 3 Model also available as PRO version as 4450U,^{[lower-alpha 4]} 4650U,^{[lower-alpha 5]} 4750U,^{[lower-alpha 6]} released May 7, 2020.
"AMD Ryzen 3 PRO 4450U". AMD.
"AMD Ryzen 5 PRO 4650U". AMD.
"AMD Ryzen 7 PRO 4750U". AMD.

Ryzen 5000 series

Lucienne (Zen 2/GCN5 based)

Common features of Ryzen 5000 notebook APUs:

Socket: FP6.
All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 16 PCIe 3.0 lanes.
Includes integrated GCN 5th generation GPU.
Fabrication process: TSMC 7FF.

Branding and Model		CPU					GPU				TDP	Release date
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config^{[lower-roman 1]}	Model	Clock (GHz)	Config^{[lower-roman 2]}	Processing power (GFLOPS)^{[lower-roman 3]}
		Cores (threads)	Base	Boost	L3 cache (total)	Core config^{[lower-roman 1]}	Model	Clock (GHz)	Config^{[lower-roman 2]}	Processing power (GFLOPS)^{[lower-roman 3]}
Ryzen 7	5700U	8 (16)	1.8	4.3	8 MB	2 × 4	Radeon Graphics ^{[lower-alpha 1]}	1.9	512:32:8 8 CU	1945.6	10–25 W	Jan 12, 2021
Ryzen 5	5500U ^[54]	6 (12)	2.1	4.0	8 MB	2 × 3		1.8	448:28:8 7 CU	1612.8
Ryzen 3	5300U	4 (8)	2.6	3.8	4 MB	1 × 4		1.5	384:24:8 6 CU	1152

↑ Core Complexes (CCX) × cores per CCX
↑ Unified shaders : texture mapping units : render output units and compute units (CU)
↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

↑ All of the iGPUs are branded as AMD Radeon Graphics.

Cezanne and Barceló (Zen 3/GCN5 based)

Cezanne (2021 models), Barceló (2022 models). Common features of Ryzen 5000 notebook APUs:

Socket: FP6.
All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 16 PCIe 3.0 lanes.
Includes integrated GCN 5th generation GPU.
Fabrication process: TSMC 7FF.

Branding and model		CPU					GPU				TDP	Release date
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config^{[lower-roman 1]}	Model	Clock (GHz)	Config^{[lower-roman 2]}	Processing power (GFLOPS)^{[lower-roman 3]}
		Cores (threads)	Base	Boost	L3 cache (total)	Core config^{[lower-roman 1]}	Model	Clock (GHz)	Config^{[lower-roman 2]}	Processing power (GFLOPS)^{[lower-roman 3]}
Ryzen 9	5980HX	8 (16)	3.3	4.8	16 MB	1 × 8	Radeon Graphics^{[lower-alpha 1]}	2.1	512:32:8 8 CUs	2150.4	35–54 W	Jan 12, 2021
	5980HS		3.0	4.8							35 W
	5900HX		3.3	4.6							35–54 W
	5900HS		3.0	4.6							35 W
Ryzen 7	5800H ^[55]		3.2	4.4				2.0		2048	35–54 W
	5800HS		2.8	4.4							35 W
	5825U ^{[lower-alpha 2]}^{[lower-alpha 3]}		2.0	4.5							15 W	Jan 4, 2022
	5800U ^{[lower-alpha 2]}		1.9	4.4							10–25 W	Jan 12, 2021
Ryzen 5	5600H ^[65]	6 (12)	3.3	4.2		1 × 6		1.8	448:28:8 7 CUs	1612.8	35–54 W
	5600HS		3.0	4.2							35 W
	5625U ^{[lower-alpha 2]}^{[lower-alpha 3]}		2.3	4.3							15 W	Jan 4, 2022
	5600U ^{[lower-alpha 2]}			4.2							10–25 W	Jan 12, 2021
	5560U			4.0	8 MB			1.6	384:24:8 6 CUs	1228.8	10–25 W	Jan 12, 2021
	5500H	4 (8)	3.3	4.2		1 × 4		1.8		1382.4	35–54 W	Jun 23, 2023
Ryzen 3	5425U ^{[lower-alpha 2]}^{[lower-alpha 3]}		2.3	4.3				1.6		1228.8	15 W	Jan 4, 2022
	5400U ^{[lower-alpha 2]}^[66]		2.7	4.1				1.6		1228.8	10–25 W	Jan 12, 2021
	5125C	2 (4)	3.0	—		1 × 2		1.2	192:12:8 3 CUs	460.8	15 W	May 5, 2022

↑ Core Complexes (CCX) × cores per CCX
↑ Unified shaders : texture mapping units : render output units and compute units (CU)
↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

↑ All of the iGPUs are branded as AMD Radeon Graphics.
1 2 3 4 5 6 Model also available as PRO version as 5450U,^[56] 5650U,^[57] 5850U,^[58] released on March 16, 2021 and as 5475U,^[59] 5675U,^[60] 5875U,^[61] released on April 19, 2022.
1 2 3 Model also available as Chromebook optimized version as 5425C,^[62] 5625C,^[63] 5825C,^[64] released on May 5, 2022.

Ryzen 6000 series

Rembrandt (Zen 3+/RDNA2 based)

Common features of Ryzen 6000 notebook APUs:

Socket: FP7, FP7r2.
All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 16 PCIe 4.0 lanes.
Includes integrated RDNA 2 GPU.
Fabrication process: TSMC 6 nm FinFET.

Branding and model		CPU					GPU				TDP	Release date
		Cores (threads)	Clock (GHz)		L3 cache (total)	Core config^{[lower-roman 1]}	Model	Clock (GHz)	Config^{[lower-roman 2]}	Processing power (GFLOPS)^{[lower-roman 3]}
		Cores (threads)	Base	Boost	L3 cache (total)	Core config^{[lower-roman 1]}	Model	Clock (GHz)	Config^{[lower-roman 2]}	Processing power (GFLOPS)^{[lower-roman 3]}
Ryzen 9	6980HX	8 (16)	3.3	5.0	16 MB	1 × 8	680M	2.4	768:48:8 12 CUs	3686.4	45 W	Jan 4, 2022 ^[67]
	6980HS			5.0							35 W
	6900HX ^{[lower-alpha 1]}			4.9							45 W
	6900HS ^{[lower-alpha 1]}			4.9							35 W
Ryzen 7	6800H ^{[lower-alpha 1]}		3.2	4.7				2.2		3379.2	45 W
	6800HS ^{[lower-alpha 1]}		3.2								35 W
	6800U ^{[lower-alpha 1]}		2.7								15–28 W
Ryzen 5	6600H ^{[lower-alpha 1]}	6 (12)	3.3	4.5		1 × 6	660M	1.9	384:24:8 6 CUs	1459.2	45 W
	6600HS ^{[lower-alpha 1]}		3.3								35 W
	6600U ^{[lower-alpha 1]}		2.9								15–28 W

↑ Core Complexes (CCX) × cores per CCX
↑ Unified shaders : texture mapping units : render output units and compute units (CU)
↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

1 2 3 4 5 6 7 8 Model also available as PRO version (6650U^{[lower-alpha 2]}, 6650H^{[lower-alpha 3]}, 6650HS^{[lower-alpha 4]}, 6850U^{[lower-alpha 5]}, 6850H^{[lower-alpha 6]}, 6850HS^{[lower-alpha 7]}, 6950H^{[lower-alpha 8]}, 6950HS^{[lower-alpha 9]}), released on April 19, 2022.
"AMD Ryzen 5 PRO 6650U". AMD.
"AMD Ryzen 5 PRO 6650H". AMD.
"AMD Ryzen 5 PRO 6650HS". AMD.
"AMD Ryzen 7 PRO 6850U". AMD.
"AMD Ryzen 7 PRO 6850H". AMD.
"AMD Ryzen 7 PRO 6850HS". AMD.
"AMD Ryzen 9 PRO 6950H". AMD.
"AMD Ryzen 9 PRO 6950HS". AMD.

New naming scheme for future mobile processors

The table below denotes the naming scheme for AMD's mobile CPU lineups starting with the 7000 series.^[68]

Portfolio model number	Market segment	Architecture	Feature isolation (if needed)	Form factor/TDP
7xxx -> 2023 8xxx -> 2024 9xxx -> 2025 etc.	x1xx -> Athlon Silver x2xx -> Athlon Gold x3xx -> Ryzen 3 x4xx -> Ryzen 3 x5xx -> Ryzen 5 x6xx -> Ryzen 5 x7xx -> Ryzen 7 x8xx -> Ryzen 7/9 x9xx -> Ryzen 9 There are some exceptions, such as the Ryzen 5 7235HS	xx1x -> Zen 1/1+ xx2x -> Zen 2 xx3x -> Zen 3/3+ xx4x -> Zen 4 xx5x -> Zen 5 etc.	xxx0 -> Lower model within segment (variants may use 1-4) xxx5 -> Upper model within segment (variants may use 6-9)	HX -> 55W+ (Max Performance) HS -> ~35W+ (Thin Gaming/Creator) U -> 15-28W (Premium Ultrathin) C -> 15-28W (Chromebook) e -> 9W (Fanless variant of "U")

Ryzen 7000 series

Mendocino (7020 series, Zen 2/RDNA2 based)

Common features of Ryzen 7020 notebook APUs:

Socket: FT6
All the CPUs support LPDDR5-5500 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 4 PCIe 3.0 lanes.
Includes integrated RDNA 2 GPU.
Fabrication process: TSMC 6 nm FinFET.

Branding and Model		CPU					GPU			TDP	Release date
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config^{[lower-roman 1]}	Model	Clock (GHz)	Processing power^{[lower-roman 2]} (GFLOPS)
		Cores (threads)	Base	Boost	L3 cache (total)	Core config^{[lower-roman 1]}	Model	Clock (GHz)	Processing power^{[lower-roman 2]} (GFLOPS)
Ryzen 5	7520U ^{[lower-roman 3]}	4 (8)	2.8	4.3	4 MB	1 × 4	610M 2 CU	1.9	486.4	15 W	September 20, 2022^[69]
Ryzen 3	7320U ^{[lower-roman 3]}	4 (8)	2.4	4.1	4 MB	1 × 4	610M 2 CU	1.9	486.4	15 W	September 20, 2022^[69]

↑ Core Complexes (CCX) × cores per CCX
↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
1 2 Model also available as Chromebook optimized version as 7520C^{[lower-roman 4]} and 7320C^{[lower-roman 5]} released on May 23, 2023
"AMD Ryzen 5 7520C". AMD.
"AMD Ryzen 3 7320C". AMD.

Barcelo-R (7030 series, Zen 3/GCN5 based)

Common features of Ryzen 7030 notebook APUs:

Socket: FP6.
All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 16 PCIe 3.0 lanes.
Includes integrated GCN 5th generation GPU.
Fabrication process: TSMC 7nm FinFET.

Branding and Model		CPU					GPU			TDP	Release date
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config^{[lower-alpha 1]}	Model	Clock (GHz)	Processing power^{[lower-alpha 2]} (GFLOPS)
		Cores (threads)	Base	Boost	L3 cache (total)	Core config^{[lower-alpha 1]}	Model	Clock (GHz)	Processing power^{[lower-alpha 2]} (GFLOPS)
Ryzen 7	(PRO) 7730U	8 (16)	2.0	4.5	16 MB	1 × 8	Vega 8 CU	2.0	2048	15 W	January 4, 2023 ^[70]
Ryzen 5	(PRO) 7530U	6 (12)	2.0	4.5	16 MB	1 × 6	Vega 7 CU	2.0	1792
Ryzen 3	(PRO) 7330U	4 (8)	2.3	4.3	8 MB	1 × 4	Vega 6 CU	1.8	1382.4

↑ Core Complexes (CCX) × cores per CCX
↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Rembrandt-R (7035 series, Zen 3+/RDNA2 based)

Common features of Ryzen 7035 notebook APUs:

Socket: FP7, FP7r2.
All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 16 PCIe 4.0 lanes.
Includes integrated RDNA 2 GPU.
Fabrication process: TSMC 6 nm FinFET.

Branding and model		CPU					GPU			TDP	Release date^[71]
		Cores (threads)	Clock (GHz)		L3 cache (total)	Core config^{[lower-alpha 1]}	Model	Clock (GHz)	Processing power^{[lower-alpha 2]} (GFLOPS)
		Cores (threads)	Base	Boost	L3 cache (total)	Core config^{[lower-alpha 1]}	Model	Clock (GHz)	Processing power^{[lower-alpha 2]} (GFLOPS)
Ryzen 7	7735HS	8 (16)	3.2	4.75	16 MB	1 × 8	680M 12 CU	2.2	3379.2	35–54 W	April 30, 2023
	7735H		3.2	4.75						35–54 W	April 30, 2023
	7736U		2.7	4.7						15–28 W	January 4, 2023
	7735U		2.7	4.75						15–30 W	January 4, 2023
	7435HS		3.1	4.5			—			35–54 W	2024^[72]
	7435H		3.1	4.5			—				2024^[72]
Ryzen 5	7535HS	6 (12)	3.3	4.55		1 × 6	660M 6 CU	1.9	1459.2		April 30, 2023
	7535H		3.3								April 30, 2023
	7535U		2.9							15–30 W	January 4, 2023
	7235HS	4 (8)	3.2	4.2	8 MB	1 × 4	—			35–53 W	2024^[73]
	7235H		3.2	4.2			—			35–53 W	2024^[73]
Ryzen 3	7335U		3.0	4.3			660M 4 CU	1.8	921.6	15–30 W	January 4, 2023

↑ Core Complexes (CCX) × cores per CCX
↑ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Phoenix (7040 series, Zen 4/RDNA3/XDNA based)

Common features of Ryzen 7040 notebook APUs:

Socket: FP7, FP7r2, FP8.
All the CPUs support DDR5-5600 (with the FP7r2 socket) or LPDDR5X-7500 (with the FP7 and FP8 sockets) in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 1 MB per core.
All the CPUs support 20 PCIe 4.0 lanes.
Includes integrated RDNA 3 GPU.
Includes XDNA AI Engine (Ryzen AI).
Fabrication process: TSMC 4 nm FinFET.

Branding and model		CPU					GPU		NPU	TDP	Release date^[74]
		Cores (threads)	Clock (GHz)		L3 cache (total)	Core config^{[lower-alpha 1]}	Model	Clock (GHz)
		Cores (threads)	Base	Boost	L3 cache (total)	Core config^{[lower-alpha 1]}	Model	Clock (GHz)
Ryzen 9	(PRO) 7940HS	8 (16)	4.0	5.2	16 MB	1 × 8	780M 12 CU	2.8	Ryzen AI Up to 10 TOPS	35–54 W	April 30, 2023^{[lower-alpha 2]}
Ryzen 9	7940H ^{[lower-alpha 3]}		4.0	5.2				2.8
Ryzen 7	(PRO) 7840HS		3.8	5.1				2.7
	7840H ^{[lower-alpha 3]}		3.8
	(PRO) 7840U		3.3							15–30 W	May 3, 2023^{[lower-alpha 2]}
Ryzen 5	(PRO) 7640HS	6 (12)	4.3	5.0		1 × 6	760M 8 CU	2.6		35–54 W	April 30, 2023^{[lower-alpha 2]}
	7640H ^{[lower-alpha 3]}		4.3	5.0						35–54 W	April 30, 2023^{[lower-alpha 2]}
	(PRO) 7640U		3.5	4.9						15–30 W	May 3, 2023^{[lower-alpha 2]}
	(PRO) 7545U		3.2			2 + 4	740M 4 CU	2.8	No		November 2, 2023
	(PRO) 7540U		3.2			1 × 6		2.5			May 3, 2023^{[lower-alpha 2]}
Ryzen 3	7440U	4 (8)	3.0	4.7	8 MB	1 + 3		2.5			November 2, 2023

↑ Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
1 2 3 4 5 PRO versions launched on 13 June 2023.
1 2 3 China-only version of the HS SKU that lacks support for AMD EXPO and FreeSync technologies.

Dragon Range (7045 series, Zen 4/RDNA2 based)

Common features of Ryzen 7045 notebook CPUs:

Socket: FL1.
All the CPUs support DDR5-5200 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 1 MB per core.
All the CPUs support 28 PCIe 5.0 lanes.
Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost)^{[lower-roman 1]}.
Fabrication process: TSMC 5 nm FinFET (6 nm FinFET for the I/O and graphics die).

Branding and model		Cores (threads)	Clock (GHz)		L3 cache (total)	Chiplets	Core config^{[lower-alpha 1]}	TDP	Release date
Branding and model		Cores (threads)	Base	Boost	L3 cache (total)	Chiplets	Core config^{[lower-alpha 1]}	TDP	Release date
Ryzen 9	7945HX3D	16 (32)	2.3	5.4	128 MB^{[lower-roman 2]}	2 × CCD 1 × I/OD	2 × 8	55–75 W	July 27, 2023
	7945HX	16 (32)	2.5	5.4	64 MB		2 × 8	55–75 W	February 28, 2023 ^[75]
	7845HX	12 (24)	3.0	5.2	64 MB		2 × 6	45–75 W
Ryzen 7	7745HX	8 (16)	3.6	5.1	32 MB	1 × CCD 1 × I/OD	1 × 8
Ryzen 5	7645HX	6 (12)	4.0	5.0	32 MB	1 × CCD 1 × I/OD	1 × 6

↑ Core Complexes (CCX) × cores per CCX

↑ Self identifies as "AMD Radeon 610M". See RDNA 2 § Integrated graphics processors (iGPs).
↑ Only one of the two CCXes has additional 64 MB of 3D V-Cache. Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.

Ryzen 8000 series

Hawk Point (8040 series, Zen 4/RDNA3/XDNA based)

Common features of Ryzen 8040 notebook APUs:

Socket: FP7, FP7r2, FP8.
All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 1 MB per core.
All the CPUs support 20 PCIe 4.0 lanes.
Includes integrated RDNA 3 GPU.
Includes XDNA AI Engine (Ryzen AI).
Fabrication process: TSMC 4 nm FinFET.

Branding and model		CPU					GPU		NPU	TDP	Release date
		Cores (threads)	Clock (GHz)		L3 cache (total)	Core config^{[lower-alpha 1]}	Model	Clock (GHz)
		Cores (threads)	Base	Boost	L3 cache (total)	Core config^{[lower-alpha 1]}	Model	Clock (GHz)
Ryzen 9	8945HS	8 (16)	4.0	5.2	16 MB	1 × 8	780M 12 CU	2.8	Ryzen AI Up to 16 TOPS	35–54 W	December 6, 2023^[76]
Ryzen 7	8845HS		3.8	5.1				2.7		35–54 W
	8840HS		3.3							20–30 W
	8840U		3.3							15–30 W
Ryzen 5	8645HS	6 (12)	4.3	5.0		1 × 6	760M 8 CU	2.6		35–54 W
	8640HS		3.5	4.9						20–30 W
	8640U		3.5							15–30 W
	8540U		3.2			2 + 4	740M 4 CU	2.8	No
Ryzen 3	8440U	4 (8)	3.0	4.7	8 MB	1 + 3	740M 4 CU	2.5	No

↑ Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores

Handheld gaming PC processors

Ryzen Z1 series (Zen 4/RDNA3 based)

Common features of Ryzen Z1 handheld APUs:

Socket: FP7, FP7r2, FP8.
All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 1 MB per core.
All the CPUs support 20 PCIe 4.0 lanes.
Includes integrated RDNA 3 GPU.
Fabrication process: TSMC 4 nm FinFET.

Branding and model		CPU					GPU		TDP	Release date
		Cores (threads)	Clock (GHz)		L3 cache (total)	Core config^{[lower-alpha 1]}	Model	Clock (GHz)
		Cores (threads)	Base	Boost	L3 cache (total)	Core config^{[lower-alpha 1]}	Model	Clock (GHz)
Ryzen	Z1 Extreme	8 (16)	3.3	5.1	16 MB	1 × 8	780M 12 CU	2.7	9–30 W	May 2023^[77]
Ryzen	Z1	6 (12)	3.2	4.9	16 MB	2 + 4	740M 4 CU	2.5	9–30 W	May 2023^[77]

↑ Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores

Embedded processors

1000 series

Great Horned Owl (V1000 series, Zen/GCN5 based)

Model	Release date	Fab	CPU						GPU				Memory support	TDP	Junction temp. range (°C)
			Cores (threads)	Clock rate (GHz)		Cache			Model	Config^{[lower-roman 1]}	Clock (GHz)	Processing power (GFLOPS)^{[lower-roman 2]}
			Cores (threads)	Base	Boost	L1	L2	L3	Model	Config^{[lower-roman 1]}	Clock (GHz)	Processing power (GFLOPS)^{[lower-roman 2]}
V1202B	February 2018	GloFo 14LP	2 (4)	2.3	3.2	64 KB inst. 32 KB data per core	512 KB per core	4 MB	Vega 3	192:12:16 3 CU	1.0	384	DDR4-2400 dual-channel	12–25 W	0–105
V1404I	December 2018		4 (8)	2.0	3.6				Vega 8	512:32:16 8 CU	1.1	1126.4			-40–105
V1500B	December 2018			2.2	—				—						0–105
V1605B	February 2018			2.0	3.6				Vega 8	512:32:16 8 CU	1.1	1126.4
V1756B	February 2018			3.25					Vega 8	512:32:16 8 CU	1.1	1126.4	DDR4-3200 dual-channel	35–54 W
V1780B	December 2018			3.35					—
V1807B	February 2018			3.35	3.8				Vega 11	704:44:16 11 CU	1.3	1830.4

↑ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
↑ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Banded Kestrel (R1000 series, Zen/GCN5 based)

Model	Release date	Fab	CPU						GPU				Memory support	TDP
			Cores (threads)	Clock rate (GHz)		Cache			Model	Config^{[lower-roman 1]}	Clock (GHz)	Processing power (GFLOPS)^{[lower-roman 2]}
			Cores (threads)	Base	Boost	L1	L2	L3	Model	Config^{[lower-roman 1]}	Clock (GHz)	Processing power (GFLOPS)^{[lower-roman 2]}
R1102G	February 25, 2020	GloFo 14LP	2 (2)	1.2	2.6	64 KB inst. 32 KB data per core	512 KB per core	4 MB	Vega 3	192:12:4 3 CU	1.0	384	DDR4-2400 single-channel	6 W
R1305G	February 25, 2020		2 (4)	1.5	2.8								DDR4-2400 dual-channel	8-10 W
R1505G	April 16, 2019			2.4	3.3									12–25 W
R1606G	April 16, 2019			2.6	3.5						1.2	460.8		12–25 W

↑ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
↑ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

2000 series

Grey Hawk (V2000 series, Zen 2/GCN5 based)

Model	Release date	Fab	CPU						GPU				Socket	PCIe support	Memory support	TDP
			Cores (threads)	Clock rate (GHz)		Cache			Archi- tecture	Config^{[lower-roman 1]}	Clock (GHz)	Processing power^{[lower-roman 2]} (GFLOPS)
			Cores (threads)	Base	Boost	L1	L2	L3	Archi- tecture	Config^{[lower-roman 1]}	Clock (GHz)	Processing power^{[lower-roman 2]} (GFLOPS)
V2516 ^[78]	November 10, 2020^[79]	TSMC 7FF	6 (12)	2.1	3.95	32 KB inst. 32 KB data per core	512 KB per core	8 MB	GCN 5	384:24:8 6 CU	1.5	1152	FP6	20 (8+4+4+4) PCIe 3.0	DDR4-3200 dual-channel LPDDR4X-4266 quad-channel	10–25 W
V2546 ^[78]			6 (12)	3.0	3.95					384:24:8 6 CU	1.5	1152				35–54 W
V2718 ^[78]			8 (16)	1.7	4.15					448:28:8 7 CU	1.6	1433.6				10–25 W
V2748 ^[78]			8 (16)	2.9	4.25					448:28:8 7 CU	1.6	1433.6				35–54 W

↑ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
↑ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

River Hawk (R2000 series, Zen+ based)

3000 series

(V3000 series, Zen 3+ based)

Model	Release date	Fab	CPU						Socket	PCIe support	Memory support	TDP
			Cores (threads)	Clock rate (GHz)		Cache
			Cores (threads)	Base	Boost	L1	L2	L3
V3C14^[80]^[81]	September 27, 2022^[82]	TSMC 7FF	4 (8)	2.3	3.8	32 KB inst. 32 KB data per core	512 KB per core	8 MB	FP7r2	20 (8+4+4+4) PCIe 4.0	DDR5-4800 dual-channel	15 W
V3C44^[80]^[81]			4 (8)	3.5	3.8			8 MB				45 W
V3C16^[80]^[81]			6 (12)	2.0	3.8			16 MB				15 W
V3C18I^[80]^[81]			8 (16)	1.9	3.8							15 W
V3C48^[80]^[81]			8 (16)	3.3	3.8							45 W

7000 series

(Ryzen Embedded 7000 series, Zen 4/RDNA2 based)

Common features of Ryzen Embedded 7000 series CPUs:

Socket: AM5.
All the CPUs support ECC DDR5-5200 dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 1 MB per core.
All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
Includes integrated RDNA 2 GPU with 2 CUs and boost clock speeds of 2200 MHz.
Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).

Processor branding	Model	Cores (threads)	Clock rate (GHz)		L3 cache (total)	Chiplets	Core config^{[lower-roman 1]}	TDP	Release date
Processor branding	Model	Cores (threads)	Base	Boost	L3 cache (total)	Chiplets	Core config^{[lower-roman 1]}	TDP	Release date
Ryzen Embedded	7945	12 (24)	3.7	5.4	64 MB	2 × CCD 1 × I/OD	2 × 6	65 W	Nov 14, 2023^[83]
	7745	8 (16)	3.8	5.3	32 MB	1 × CCD 1 × I/OD	1 × 8	65 W
	7700X	8 (16)	4.5	5.4			1 × 8	105 W
	7645	6 (12)	3.8	5.1			1 × 6	65 W
	7600X	6 (12)	4.7	5.3			1 × 6	105 W

↑ Core Complexes (CCX) × cores per CCX

References

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1 2 Alcorn, Paul (November 14, 2019). "Tom's Hardware Ryzen 9 3950X review". Tom's Hardware. Retrieved May 12, 2020.
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1 2 WhyCry (July 31, 2023). "AMD 4800S Desktop Kit, a PC repurposed APU from Xbox Series X has been tested". VideoCardz. Retrieved September 20, 2023.
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↑ Shvets, Gennadiy (September 23, 2022). "New AMD Ryzen PRO processors released". CPU-World. Retrieved June 30, 2023.
↑ Wallossek, Igor (8 January 2024). "CES: And it goes on - even more Ryzen 5000 CPUs for the AM4 socket". igor´sLAB. Retrieved 9 January 2024.
↑ Ganti, Anil (July 1, 2023). "AMD Ryzen 5 5600X3D price and availability officially confirmed". NotebookCheck.net. Retrieved July 1, 2023.
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↑ Bonshor, Gavin (July 12, 2023). "AMD Quietly Introduces Ryzen 3 5100 Quad-Core Processor For AM4". AnandTech. Retrieved July 12, 2023.
↑ Liu, Zhiye (July 4, 2023). "Ryzen 3 5100 Budget CPU Could Excel On The Retail Market". Tom's Hardware. Retrieved January 15, 2024.
↑ Mujtaba, Mujtaba (July 5, 2023). "AMD Ryzen 7 5700 8 Core & Ryzen 3 5100 4 Core Budget CPUs For AM4 Platform Confirmed". Wccftech. Retrieved January 15, 2024.
1 2 Wallossek, Igor (8 January 2024). "CES: And it goes on - even more Ryzen 5000 CPUs for the AM4 socket". igor´sLAB. Retrieved 9 January 2024.
↑ "AMD Confirms Ryzen 9 7950X3D and 7900X3D Feature 3DV Cache on Only One of the Two Chiplets". TechPowerUp. Retrieved January 5, 2023.
↑ AMD Provides More Ryzen 9 7950X3D Details. PC World . January 5, 2023 – via YouTube.
1 2 3 "AMD Extends its Leadership with the Introduction of its Broadest Portfolio of High-Performance PC Products for Mobile and Desktop". AMD (Press release). January 4, 2023. Retrieved January 5, 2023.
↑ WhyCry (July 23, 2023). "AMD Ryzen 5 7500F reviews are out, CPU to launch globally at $179". VideoCardz.com. Retrieved July 23, 2023.
↑ Bonshor, Gavin (October 19, 2023). "AMD Unveils Ryzen Threadripper 7000 Family: 96 Core Zen 4 for Workstations and HEDT". www.anandtech.com. Retrieved 22 October 2023.
↑ Bonshor, Gavin (11 April 2024). "AMD Quietly Launches Ryzen 7 8700F and Ryzen 5 8400F Processors". www.anandtech.com. Retrieved 12 April 2024.
↑ Bonshor, Gavin (8 January 2024). "AMD Unveils Ryzen 8000G Series Processors: Zen 4 APUs For Desktop with Ryzen AI". www.anandtech.com. Retrieved 9 January 2024.
↑ "AMD Ryzen 7 3780U Microsoft Surface® Edition".
↑ "AMD Ryzen 7 3750H Mobile Processor with Radeon RX Vega 10 Graphics".
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↑ "AMD Ryzen 7 3700C".
↑ "AMD Ryzen 7 3700U Mobile Processor with Radeon RX Vega 10 Graphics".
↑ "AMD Ryzen 5 3580U Microsoft Surface® Edition".
↑ "AMD Ryzen 5 3550H Mobile Processor with Radeon Vega 8 Graphics" . Retrieved 8 January 2018.
↑ "AMD Radeon Vega 8 Specs | TechPowerUp GPU Database". Techpowerup.com.
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↑ "AMD Ryzen 5 4600HS". AMD.^{[ dead link ]}
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[1] Core Complexes (CCX) × cores per CCX

[3] Core Complexes (CCX) × cores per CCX

[stability-4] Processor package actually contains two additional inactive dies to provide structural support to the integrated heat spreader.

[gpuconfig-5] Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)

[FLOPS-6] Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

[PRO-7] 1 2 3 4 Model also available as PRO version; 2200GE, 2200G, 2400GE, 2400G, released on May 14, 2018 for OEM only.^{[lower-alpha 2]}

[10] "World's Largest Commercial PC Manufacturers Introduce AMD Ryzen PRO Mobile and Desktop APU Powered Systems". AMD (Press release). May 14, 2018. Retrieved April 8, 2023.

[11] Core Complexes (CCX) × cores per CCX

[PRO-12] 1 2 3 Model also available as PRO version as 2600^[4], 2700^[5], 2700X^[6], released on September 19, 2018.

[AF-16] 1 2 AF models are 12 nm Zen+ refresh of 14 nm Zen models (1200^{[lower-alpha 3]} and 1600^{[lower-alpha 4]} with "AF" suffixes).

[18] "AMD Ryzen 3 1200". AMD. Retrieved October 9, 2022.

[19] "AMD Ryzen 5 1600". AMD. Retrieved October 9, 2022.

[20] Core Complexes (CCX) × cores per CCX

[gpuconfig-25] Unified shaders : Texture mapping units : Render output units and Compute units (CU)

[SFLOPS-26] Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

[28] Core Complexes (CCXs) × cores per CCX

[tdp3900x-30] Ryzen 9 3900X and Ryzen 9 3950X may consume over 145 W under load.^[13]

[tdp3700x-32] Ryzen 7 3700X may consume over 90 W under load.^[13]

[pro3000-31] 1 2 3 Model also available as PRO 3600, PRO 3700, PRO 3900, released on September 30, 2019 for OEMs.

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List of AMD Ryzen processors

Contents

Desktop processors

Ryzen 1000 series

Summit Ridge (1000 series, Zen based)

Whitehaven (Threadripper 1000 series, Zen based)

Ryzen 2000 series

Raven Ridge (2000 series with Radeon Graphics, Zen/GCN5 based)

Pinnacle Ridge (2000 series, Zen+ based)

Colfax (Threadripper 2000 series, Zen+ based)

Ryzen 3000 series

Picasso (3000 series with Radeon Graphics, Zen+/GCN5 based)

Matisse (3000 series, Zen 2 based)

Castle Peak (Threadripper 3000 series, Zen 2 based)

Ryzen 4000 series

Renoir (4000 series, Zen 2 based)

Renoir (4000 series with Radeon Graphics, Zen 2/GCN5 based)

Ryzen 5000 series

Vermeer (5000 series, Zen 3 based)

Cezanne (5000 series, Zen 3 based)

Cezanne (5000 series with Radeon Graphics, Zen 3/GCN5 based)

Chagall (Threadripper 5000 series, Zen 3 based)

Ryzen 7000 series

Raphael (7000 series, Zen 4/RDNA2 based)

Storm Peak (Threadripper 7000 series, Zen 4 based)

Ryzen 8000 series

Phoenix (8000 series, Zen 4 based)

Phoenix (8000 series with Radeon Graphics, Zen 4/RDNA3/XDNA based)

Mobile processors

Ryzen 2000 series

Raven Ridge (Zen/GCN5 based)

Ryzen 3000 series

Dalí (Zen/GCN5 based)

Picasso (Zen+/GCN5 based)

Ryzen 4000 series

Renoir (Zen 2/GCN5 based)

Ryzen 5000 series

Lucienne (Zen 2/GCN5 based)

Cezanne and Barceló (Zen 3/GCN5 based)

Ryzen 6000 series

Rembrandt (Zen 3+/RDNA2 based)

New naming scheme for future mobile processors

Ryzen 7000 series

Mendocino (7020 series, Zen 2/RDNA2 based)

Barcelo-R (7030 series, Zen 3/GCN5 based)

Rembrandt-R (7035 series, Zen 3+/RDNA2 based)

Phoenix (7040 series, Zen 4/RDNA3/XDNA based)

Dragon Range (7045 series, Zen 4/RDNA2 based)

Ryzen 8000 series

Hawk Point (8040 series, Zen 4/RDNA3/XDNA based)

Handheld gaming PC processors

Ryzen Z1 series (Zen 4/RDNA3 based)

Embedded processors

1000 series

Great Horned Owl (V1000 series, Zen/GCN5 based)

Banded Kestrel (R1000 series, Zen/GCN5 based)

2000 series

Grey Hawk (V2000 series, Zen 2/GCN5 based)

River Hawk (R2000 series, Zen+ based)

3000 series

(V3000 series, Zen 3+ based)

7000 series

(Ryzen Embedded 7000 series, Zen 4/RDNA2 based)

See also

Related Research Articles

References