Related Research Articles
In materials science, a thermosetting polymer, often called a thermoset, is a polymer that is obtained by irreversibly hardening ("curing") a soft solid or viscous liquid prepolymer (resin). Curing is induced by heat or suitable radiation and may be promoted by high pressure or mixing with a catalyst. Heat is not necessarily applied externally, and is often generated by the reaction of the resin with a curing agent. Curing results in chemical reactions that create extensive cross-linking between polymer chains to produce an infusible and insoluble polymer network.
A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.
Thermal paste is a thermally conductive chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of a thermal interface material.
Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste or as a double-sided tape.
Hot-melt adhesive (HMA), also known as hot glue, is a form of thermoplastic adhesive that is commonly sold as solid cylindrical sticks of various diameters designed to be applied using a hot glue gun. The gun uses a continuous-duty heating element to melt the plastic glue, which the user pushes through the gun either with a mechanical trigger mechanism on the gun, or with direct finger pressure. The glue squeezed out of the heated nozzle is initially hot enough to burn and even blister skin. The glue is sticky when hot, and solidifies in a few seconds to one minute. Hot-melt adhesives can also be applied by dipping or spraying, and are popular with hobbyists and crafters both for affixing and as an inexpensive alternative to resin casting.
Arctic Silver Inc. is a privately owned engineering corporation which develops and manufactures thermally conductive compounds and thermal adhesives for the application of heat sinks to high-powered electronic components such as processors, LEDs, chipsets and other electronic devices. Founded in 1999, the company's facilities are located in Visalia, California, US.
Silicone rubber is an elastomer composed of silicone—itself a polymer—containing silicon together with carbon, hydrogen, and oxygen. Silicone rubbers are widely used in industry, and there are multiple formulations. Silicone rubbers are often one- or two-part polymers, and may contain fillers to improve properties or reduce cost. Silicone rubber is generally non-reactive, stable, and resistant to extreme environments and temperatures from −55 to 300 °C while still maintaining its useful properties. Due to these properties and its ease of manufacturing and shaping, silicone rubber can be found in a wide variety of products, including voltage line insulators; automotive applications; cooking, baking, and food storage products; apparel such as undergarments, sportswear, and footwear; electronics; medical devices and implants; and in home repair and hardware, in products such as silicone sealants.
A dental impression is a negative imprint of hard and soft tissues in the mouth from which a positive reproduction, such as a cast or model, can be formed. It is made by placing an appropriate material in a dental impression tray which is designed to roughly fit over the dental arches. The impression material is liquid or semi-solid when first mixed and placed in the mouth. It then sets to become an elastic solid, which usually takes a few minutes depending upon the material. This leaves an imprint of a person's dentition and surrounding structures of the oral cavity.
Conformal coating is a protective, breathable coating of thin polymeric film applied to printed circuit boards (PCBs). Conformal coatings are typically applied at 25–250 μm to the electronic circuitry and provide protection against moisture and other harsher conditions.
Sealant is a substance used to block the passage of fluids through openings in materials, a type of mechanical seal. In building construction sealant is sometimes synonymous with caulk and also serve the purposes of blocking dust, sound and heat transmission. Sealants may be weak or strong, flexible or rigid, permanent or temporary. Sealants are not adhesives but some have adhesive qualities and are called adhesive-sealants or structural sealants.
In computing and electronics, thermal pads are pre-formed rectangles of solid material commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled and into the heatsink. Thermal pads and thermal compound are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact; they would not be needed between perfectly flat and smooth surfaces. Thermal pads are relatively firm at room temperature, but become soft and are able to fill gaps at higher temperatures.
Adhesive bonding describes a wafer bonding technique with applying an intermediate layer to connect substrates of different types of materials. Those connections produced can be soluble or insoluble. The commercially available adhesive can be organic or inorganic and is deposited on one or both substrate surfaces. Adhesives, especially the well-established SU-8, and benzocyclobutene (BCB), are specialized for MEMS or electronic component production.
High power light-emitting diodes (LEDs) can use 350 milliwatts or more in a single LED. Most of the electricity in an LED becomes heat rather than light. If this heat is not removed, the LEDs run at high temperatures, which not only lowers their efficiency, but also makes the LED less reliable. Thus, thermal management of high power LEDs is a crucial area of research and development. It is necessary to limit both the junction and the phosphor particles temperatures to a value that will guarantee the desired LED lifetime.
There are a number of possible ways to measure thermal conductivity, each of them suitable for a limited range of materials, depending on the thermal properties and the medium temperature. Three classes of methods exist to measure the thermal conductivity of a sample: steady-state, time-domain, and frequency-domain methods.
Soldering is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint.
RTV silicone is a type of silicone rubber that cures at room temperature. It is available as a one-component product, or mixed from two components. Manufacturers provide it in a range of hardnesses from very soft to medium—usually from 15 to 40 Shore A. RTV silicones can be cured with a catalyst consisting of either platinum or a tin compound such as dibutyltin dilaurate. Applications include low-temperature over-molding, making molds for reproducing, and lens applications for some optically clear grades. It is also used widely in the automotive industry as an adhesive and sealant, for example to create gaskets in-place.
Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for surface micro-machined structures, e.g., accelerometers or gyroscopes. This technique utilizes low melting-point glass and therefore provides various advantages including that viscosity of glass decreases with an increase of temperature. The viscous flow of glass has effects to compensate and planarize surface irregularities, convenient for bonding wafers with a high roughness due to plasma etching or deposition. A low viscosity promotes hermetically sealed encapsulation of structures based on a better adaption of the structured shapes. Further, the coefficient of thermal expansion (CTE) of the glass material is adapted to silicon. This results in low stress in the bonded wafer pair. The glass has to flow and wet the soldered surfaces well below the temperature where deformation or degradation of either of the joined materials or nearby structures occurs. The usual temperature of achieving flowing and wetting is between 450 and 550 °C.
Aluminium alloys are often used due to their high strength-to-weight ratio, corrosion resistance, low cost, high thermal and electrical conductivity. There are a variety of techniques to join aluminium including mechanical fasteners, welding, adhesive bonding, brazing, soldering and friction stir welding (FSW), etc. Various techniques are used based on the cost and strength required for the joint. In addition, process combinations can be performed to provide means for difficult-to-join assemblies and to reduce certain process limitations.
Solvent bonding is one of several methods of adhesive bonding for joining plastics. Application of a solvent to a thermoplastic material softens the polymer, and with applied pressure this results in polymer chain interdiffusion at the bonding junction. When the solvent evaporates, this leaves a fully consolidated bond-line. An advantage to solvent bonding versus other polymer joining methods is that bonding generally occurs below the glass transition temperature of the polymer.
Adhesive bonding is a joining technique used in the manufacture and repair of a wide range of products. Along with welding and soldering, adhesive bonding is one of the basic joining processes. In this technique, components are bonded together using adhesives. The broad range of types of adhesives available allows numerous materials to be bonded together in products as diverse as vehicles, mobile phones, personal care products, buildings, computers and medical devices.
References
- ↑ Kearney, Andrew; Li, Li; Sanford, Sean (2009). "Interaction between TIM1 and TIM2 for mechanical robustness of integrated heat spreader". 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium. pp. 293–298. doi:10.1109/STHERM.2009.4810778. ISBN 978-1-4244-3664-4. S2CID 29501079.
- ↑ Liu, Johan; Michel, Bruno; Rencz, Marta; Tantolin, Christian; Sarno, Claude; Miessner, Ralf; Schuett, Klaus-Volker; Tang, Xinhe; Demoustier, Sebastien (2008). "Recent progress of thermal interface material research - an overview". 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems. pp. 156–162. doi:10.1109/THERMINIC.2008.4669900. ISBN 978-1-4244-3365-0. S2CID 40595787 . Retrieved 30 March 2023.
- ↑ Bartlett, Michael; Kazem, Navid; Powell-Palm, MAtthew; Huang, Xiaonan; Sun, Wenhuan; Malen, Jonathan; Majidi, Carmel (2017). "High thermal conductivity in soft elastomers with elongated liquid metal inclusions". Proceedings of the National Academy of Sciences. 114 (9): 2143–2148. Bibcode:2017PNAS..114.2143B. doi: 10.1073/pnas.1616377114 . PMC 5338550 . PMID 28193902.
- ↑ Jarrtett, Robert N.; Ross, Jordan P.; Berntson, Ross (September 2007). "Full Metal TIMs". Power Systems Design Europe.