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A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with other high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.
Thermal paste is a thermally conductive chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of a thermal interface material.
A coolant is a substance, typically liquid, that is used to reduce or regulate the temperature of a system. An ideal coolant has high thermal capacity, low viscosity, is low-cost, non-toxic, chemically inert and neither causes nor promotes corrosion of the cooling system. Some applications also require the coolant to be an electrical insulator.
In materials science, a metal foam is a material or structure consisting of a solid metal with gas-filled pores comprising a large portion of the volume. The pores can be sealed or interconnected. The defining characteristic of metal foams is a high porosity: typically only 5–25% of the volume is the base metal. The strength of the material is due to the square–cube law.
Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste or as a double-sided tape.
Hot-melt adhesive (HMA), also known as hot glue, is a form of thermoplastic adhesive that is commonly sold as solid cylindrical sticks of various diameters designed to be applied using a hot glue gun. The gun uses a continuous-duty heating element to melt the plastic glue, which the user pushes through the gun either with a mechanical trigger mechanism on the gun, or with direct finger pressure. The glue squeezed out of the heated nozzle is initially hot enough to burn and even blister skin. The glue is sticky when hot, and solidifies in a few seconds to one minute. Hot-melt adhesives can also be applied by dipping or spraying, and are popular with hobbyists and crafters both for affixing and as an inexpensive alternative to resin casting.
Arctic Silver Inc. is a privately owned engineering corporation which develops and manufactures thermally conductive compounds and thermal adhesives for the application of heat sinks to high-powered electronic components such as processors, LEDs, chipsets and other electronic devices. Founded in 1999, the company's facilities are located in Visalia, California, US.
Silicone rubber is an elastomer composed of silicone—itself a polymer—containing silicon together with carbon, hydrogen, and oxygen. Silicone rubbers are widely used in industry, and there are multiple formulations. Silicone rubbers are often one- or two-part polymers, and may contain fillers to improve properties or reduce cost. Silicone rubber is generally non-reactive, stable, and resistant to extreme environments and temperatures from −55 to 300 °C while still maintaining its useful properties. Due to these properties and its ease of manufacturing and shaping, silicone rubber can be found in a wide variety of products, including voltage line insulators; automotive applications; cooking, baking, and food storage products; apparel such as undergarments, sportswear, and footwear; electronics; medical devices and implants; and in home repair and hardware, in products such as silicone sealants.
All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.
Sealant is a substance used to block the passage of fluids through openings in materials, a type of mechanical seal. In building construction sealant is sometimes synonymous with caulk and also serve the purposes of blocking dust, sound and heat transmission. Sealants may be weak or strong, flexible or rigid, permanent or temporary. Sealants are not adhesives but some have adhesive qualities and are called adhesive-sealants or structural sealants.
In physics, thermal contact conductance is the study of heat conduction between solid or liquid bodies in thermal contact. The thermal contact conductance coefficient, , is a property indicating the thermal conductivity, or ability to conduct heat, between two bodies in contact. The inverse of this property is termed thermal contact resistance.
In computing and electronics, thermal pads are pre-formed rectangles of solid material commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled and into the heatsink. Thermal pads and thermal compound are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact; they would not be needed between perfectly flat and smooth surfaces. Thermal pads are relatively firm at room temperature, but become soft and are able to fill gaps at higher temperatures. Some, but not all, types of chip carriers include thermal pads in their design.
High power light-emitting diodes (LEDs) can use 350 milliwatts or more in a single LED. Most of the electricity in an LED becomes heat rather than light. If this heat is not removed, the LEDs run at high temperatures, which not only lowers their efficiency, but also makes the LED less reliable. Thus, thermal management of high power LEDs is a crucial area of research and development. It is necessary to limit both the junction and the phosphor particles temperatures to a value that will guarantee the desired LED lifetime.
Solid is one of the four fundamental states of matter along with liquid, gas, and plasma. The molecules in a solid are closely packed together and contain the least amount of kinetic energy. A solid is characterized by structural rigidity and resistance to a force applied to the surface. Unlike a liquid, a solid object does not flow to take on the shape of its container, nor does it expand to fill the entire available volume like a gas. The atoms in a solid are bound to each other, either in a regular geometric lattice, or irregularly. Solids cannot be compressed with little pressure whereas gases can be compressed with little pressure because the molecules in a gas are loosely packed.
Interfacial thermal resistance, also known as thermal boundary resistance, or Kapitza resistance, is a measure of resistance to thermal flow at the interface between two materials. While these terms may be used interchangeably, Kapitza resistance technically refers to an atomically perfect, flat interface whereas thermal boundary resistance is a more broad term. This thermal resistance differs from contact resistance because it exists even at atomically perfect interfaces. Owing to differences in electronic and vibrational properties in different materials, when an energy carrier attempts to traverse the interface, it will scatter at the interface. The probability of transmission after scattering will depend on the available energy states on side 1 and side 2 of the interface.
In heat transfer, thermal engineering, and thermodynamics, thermal conductance and thermal resistance are fundamental concepts that describe the ability of materials or systems to conduct heat and the opposition they offer to the heat current. The ability to manipulate these properties allows engineers to control temperature gradient, prevent thermal shock, and maximize the efficiency of thermal systems. Furthermore, these principles find applications in a multitude of fields, including materials science, mechanical engineering, electronics, and energy management. Knowledge of these principles is crucial in various scientific, engineering, and everyday applications, from designing efficient temperature control, thermal insulation, and thermal management in industrial processes to optimizing the performance of electronic devices.
RTV silicone is a type of silicone rubber that cures at room temperature. It is available as a one-component product, or mixed from two components. Manufacturers provide it in a range of hardnesses from very soft to medium—usually from 15 to 40 Shore A. RTV silicones can be cured with a catalyst consisting of either platinum or a tin compound such as dibutyltin dilaurate. Applications include low-temperature over-molding, making molds for reproducing, and lens applications for some optically clear grades. It is also used widely in the automotive industry as an adhesive and sealant, for example to create gaskets in place.
Liquid optically-clear adhesive (LOCA) is liquid-based bonding technology used in touch panels and display devices to bind the cover lens, plastic, or other optical materials to the main sensor unit or each other. These adhesives improve optical characteristics and durability. LOCA glue is often hardened using ultraviolet light.
Aluminium alloys are often used due to their high strength-to-weight ratio, corrosion resistance, low cost, high thermal and electrical conductivity. There are a variety of techniques to join aluminium including mechanical fasteners, welding, adhesive bonding, brazing, soldering and friction stir welding (FSW), etc. Various techniques are used based on the cost and strength required for the joint. In addition, process combinations can be performed to provide means for difficult-to-join assemblies and to reduce certain process limitations.
Adhesive bonding is a joining technique used in the manufacture and repair of a wide range of products. Along with welding and soldering, adhesive bonding is one of the basic joining processes. In this technique, components are bonded together using adhesives. The broad range of types of adhesives available allows numerous materials to be bonded together in products as diverse as vehicles, mobile phones, personal care products, buildings, computers and medical devices.
References
- 1 2 Cui, Y.; Li, M.; Hu, Y. (2020). "Emerging interface materials for electronics thermal management: experiments, modeling, and new opportunities". Journal of Materials Chemistry C. 8: 10568–10586. doi:10.1039/C9TC05415D.
- ↑ Kearney, Andrew; Li, Li; Sanford, Sean (2009). "Interaction between TIM1 and TIM2 for mechanical robustness of integrated heat spreader". 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium. pp. 293–298. doi:10.1109/STHERM.2009.4810778. ISBN 978-1-4244-3664-4. S2CID 29501079.
- ↑ Liu, Johan; Michel, Bruno; Rencz, Marta; Tantolin, Christian; Sarno, Claude; Miessner, Ralf; Schuett, Klaus-Volker; Tang, Xinhe; Demoustier, Sebastien (2008). "Recent progress of thermal interface material research - an overview". 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems. pp. 156–162. doi:10.1109/THERMINIC.2008.4669900. ISBN 978-1-4244-3365-0. S2CID 40595787 . Retrieved 30 March 2023.
- ↑ Bartlett, Michael; Kazem, Navid; Powell-Palm, MAtthew; Huang, Xiaonan; Sun, Wenhuan; Malen, Jonathan; Majidi, Carmel (2017). "High thermal conductivity in soft elastomers with elongated liquid metal inclusions". Proceedings of the National Academy of Sciences. 114 (9): 2143–2148. Bibcode:2017PNAS..114.2143B. doi: 10.1073/pnas.1616377114 . PMC 5338550 . PMID 28193902.
- ↑ Jarrtett, Robert N.; Ross, Jordan P.; Berntson, Ross (September 2007). "Full Metal TIMs". Power Systems Design Europe.