The Pentium III brand refers to Intel's 32-bit x86 desktop and mobile CPUs based on the sixth-generation P6 microarchitecture introduced on February 28, 1999. The brand's initial processors were very similar to the earlier Pentium II-branded processors. The most notable differences were the addition of the Streaming SIMD Extensions (SSE) instruction set, and the introduction of a controversial serial number embedded in the chip during manufacturing.
In computing, overclocking is the practice of increasing the clock rate of a computer to exceed that certified by the manufacturer. Commonly, operating voltage is also increased to maintain a component's operational stability at accelerated speeds. Semiconductor devices operated at higher frequencies and voltages increase power consumption and heat. An overclocked device may be unreliable or fail completely if the additional heat load is not removed or power delivery components cannot meet increased power demands. Many device warranties state that overclocking or over-specification voids any warranty, but some manufacturers allow overclocking as long as it is done (relatively) safely.
Processor power dissipation or processing unit power dissipation is the process in which computer processors consume electrical energy, and dissipate this energy in the form of heat due to the resistance in the electronic circuits.
A quiet, silent or fanless PC is a personal computer that makes very little or no noise. Common uses for quiet PCs include video editing, sound mixing and home theater PCs, but noise reduction techniques can also be used to greatly reduce the noise from servers. There is currently no standard definition for a "quiet PC", and the term is generally not used in a business context, but by individuals and the businesses catering to them.
A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with other high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.
Thermal paste is a thermally conductive chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of a thermal interface material.
A heat pipe is a heat-transfer device that employs phase transition to transfer heat between two solid interfaces.
Socket A is a zero insertion force pin grid array (PGA) CPU socket used for AMD processors ranging from the Athlon Thunderbird to the Athlon XP/MP 3200+, and AMD budget processors including the Duron and Sempron. Socket A also supports AMD Geode NX embedded processors. It compliments the prior Slot A CPU interface used in some Athlon Thunderbird processors. The front-side bus frequencies supported for the AMD Athlon XP and Sempron are 133 MHz, 166 MHz, and 200 MHz. Socket A supports 32-bit CPUs only.
Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets, graphics cards, hard disk drives, and solid state drives.
Galinstan is a brand name for an alloy composed of gallium, indium, and tin which melts at −19 °C (−2 °F) and is thus liquid at room temperature. In scientific literature, galinstan is also used to denote the eutectic alloy of gallium, indium, and tin, which melts at around +11 °C (52 °F). The commercial product Galinstan is not a eutectic alloy, but a near eutectic alloy. Additionally, it likely has added flux to improve flowability, to reduce melting temperature, and to reduce surface tension.
Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component can generate and that its cooling system is designed to dissipate during normal operation.
A thermal interface material is any material that is inserted between two components in order to enhance the thermal coupling between them. A common use is heat dissipation, in which the TIM is inserted between a heat-producing device and a heat-dissipating device. There are intensive studies in developing several kinds of TIM with different target applications. At each interface, a thermal resistance exists and impedes heat dissipation. In addition, the electronic performance and device lifetime can degrade dramatically under continuous overheating and large thermal stress at the interfaces.
Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste or as a double-sided tape.
Arctic Silver Inc. is a privately owned engineering corporation which develops and manufactures thermally conductive compounds and thermal adhesives for the application of heat sinks to high-powered electronic components such as processors, LEDs, chipsets and other electronic devices. Founded in 1999, the company's facilities are located in Visalia, California, US.
A computer fan is any fan inside, or attached to, a computer case used for active cooling. Fans are used to draw cooler air into the case from the outside, expel warm air from inside and move air across a heat sink to cool a particular component. Both axial and sometimes centrifugal (blower/squirrel-cage) fans are used in computers. Computer fans commonly come in standard sizes, such as 92 mm, 120 mm, 140 mm, and even 200–220 mm. Computer fans are powered and controlled using 3-pin or 4-pin fan connectors.
All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.
In physics, thermal contact conductance is the study of heat conduction between solid or liquid bodies in thermal contact. The thermal contact conductance coefficient, , is a property indicating the thermal conductivity, or ability to conduct heat, between two bodies in contact. The inverse of this property is termed thermal contact resistance.
High power light-emitting diodes (LEDs) can use 350 milliwatts or more in a single LED. Most of the electricity in an LED becomes heat rather than light. If this heat is not removed, the LEDs run at high temperatures, which not only lowers their efficiency, but also makes the LED less reliable. Thus, thermal management of high power LEDs is a crucial area of research and development. It is necessary to limit both the junction and the phosphor particles temperatures to a value that will guarantee the desired LED lifetime.
A heat spreader transfers energy as heat from a hotter source to a colder heat sink or heat exchanger. There are two thermodynamic types, passive and active. The most common sort of passive heat spreader is a plate or block of material having high thermal conductivity, such as copper, aluminum, or diamond. An active heat spreader speeds up heat transfer with expenditure of energy as work supplied by an external source.
Decapping (decapsulation) or delidding of an integrated circuit (IC) is the process of removing the protective cover or integrated heat spreader (IHS) of an integrated circuit so that the contained die is revealed for visual inspection of the micro circuitry imprinted on the die. This process is typically done in order to debug a manufacturing problem with the chip, or possibly to copy information from the device, to check for counterfeit chips or to reverse engineer it. Companies such as TechInsights and ChipRebel decap, take die shots of, and reverse engineer chips for customers. Modern integrated circuits can be encapsulated in plastic, ceramic, or epoxy packages.
