General information | |
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Launched | June 20, 2017 |
Marketed by | AMD |
Designed by | AMD |
Common manufacturer(s) | |
Performance | |
Max. CPU clock rate | 2.7 GHz to 4.4 GHz |
Architecture and classification | |
Technology node | 14 nm to 5 nm |
Microarchitecture | |
Instruction set | x86-64 |
Extensions | |
Physical specifications | |
Cores |
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Memory (RAM) |
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Socket(s) | |
Products, models, variants | |
Core name(s) |
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Brand name(s) |
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History | |
Predecessor(s) | Opteron |
Epyc (stylized as EPYC) is a brand of multi-core x86-64 microprocessors designed and sold by AMD, based on the company's Zen microarchitecture. Introduced in June 2017, they are specifically targeted for the server and embedded system markets. [1]
Epyc processors share the same microarchitecture as their regular desktop-grade counterparts, but have enterprise-grade features such as higher core counts, more PCI Express lanes, support for larger amounts of RAM, and larger cache memory. They also support multi-chip and dual-socket system configurations by using the Infinity Fabric interconnect.
In March 2017, AMD announced plans to re-enter the server market with a platform based on the Zen microarchitecture, codenamed Naples, and officially revealed it under the brand name Epyc in May. [2] That June AMD officially launched Epyc 7001 series processors, offering up to 32 cores per socket, and enabling performance that allowed Epyc to be competitive with the competing Intel Xeon Scalable product line. [3] Two years later, in August 2019, the Epyc 7002 "Rome" series processors, based on the Zen 2 microarchitecture, launched, doubling the core count per socket to 64, and increasing per-core performance dramatically over the last generation architecture.
In March 2021, AMD launched the Epyc 7003 "Milan" series, based on the Zen 3 microarchitecture. [4] Epyc Milan brought the same 64 cores as Epyc Rome, but with much higher per-core performance, with the Epyc 7763 beating the Epyc 7702 by up to 22 percent despite having the same number of cores and threads. [5] A refresh of the Epyc 7003 "Milan" series with 3D V-Cache, named Milan-X, launched on March 21, 2022, using the same cores as Epyc Milan, but with an additional 512 MB of cache stacked onto the compute dies, bringing the total amount of cache per CPU to 768 MB. [6]
In September 2021, Oak Ridge National Laboratory partnered with AMD and HPE Cray to build Frontier, a supercomputer with 9,472 Epyc 7453 CPUs and 37,888 Instinct MI250X GPUs, becoming operational by May 2022. As of November 2023, it is the most powerful supercomputer in the world according to the TOP500, with a peak performance of over 1.6 exaFLOPS.
In November 2021, AMD detailed the upcoming generations of Epyc, also unveiling the new LGA-6096 SP5 socket that would support the new generations of Epyc chips. Codenamed Genoa, the first Zen 4 based Epyc CPUs is built on TSMC's N5 node and supports up to 96 cores and 192 threads per socket, alongside 12 channels of DDR5, [7] 128 PCIe 5.0 lanes, and Compute Express Link 1.1. [8] AMD also shared information regarding the sister chip of Genoa, codenamed Bergamo. Bergamo is be based on a modified Zen 4 microarchitecture named Zen 4c, designed to allow for much higher core counts and efficiency at the cost of lower single-core performance, targeting cloud providers and workloads, compared to traditional high performance computing workloads. [9] It is compatible with Socket SP5, and supports up to 128 cores and 256 threads per socket. [10]
In November 2022, AMD launched their 4th generation Epyc lineup, codenamed Genoa. Some tech reviewers and customers had already received hardware for testing and benchmarking, and third party benchmarks of Genoa parts were immediately available. The flagship part, the 96 core Epyc 9654, set records for multi-core performance, and showed up to 4× performance compared to Intel's flagship part, the Xeon 8380. High memory bandwidth and extensive PCIe connectivity removed many bottlenecks, allowing all 96 cores to be utilized in workloads where previous generation Milan chips would have been I/O-bound. Genoa was also the first x86 server CPU to support CXL, allowing for further expansion of memory and other devices with a high bandwidth interface built on PCIe 5.0.
In June 2023, AMD began shipping the 3D-Vcache enabled Genoa-X lineup, a refresh of Genoa that uses the same 3D die stacking technology as Milan-X to enable up to 1152 MB of L3 cache, a 50% increase over Milan-X, which had a maximum of 768 MB of L3 cache. [11] On the same day, AMD also announced the release of their cloud optimized Zen 4c SKUs, codenamed Bergamo, offering up to 128 cores per socket, utilizing a modified version of the Zen 4 core that was optimized for power efficiency and to reduce die space. Zen 4c cores do not have any instructions removed compared to standard Zen 4 cores, instead, the amount of cache per core is reduced from 4 MB to 2 MB, and the frequency of the cores is reduced. [12] Bergamo is socket compatible with Genoa, using the same SP5 socket and supporting the same CXL, PCIe, and DDR5 capacity as Genoa. [13]
In September 2023, AMD launched their low power and embedded 8004 series of CPUs, codenamed Siena. Siena utilizes a new socket, called SP6, which has a smaller footprint and pin count than the SP5 socket of its contemporary Genoa processors. Siena utilizes the same Zen 4c core architecture as Bergamo cloud native processors, allowing up to 64 cores per processor, and the same 6 nm I/O die as Bergamo and Genoa, although certain features have been cut down, such as reducing the memory support from 12 channels of DDR5 to only 6, and removing dual socket support. [14]
AMD Epyc CPU codenames follow the naming scheme of Italian cities, including Milan, Rome, Naples, Genoa, Bergamo, Siena, and Turin.
Gen | Year | Codename | Product line | Cores | Socket | Memory |
---|---|---|---|---|---|---|
Server | ||||||
1st | 2017 | Naples | 7001 series | 32 × Zen | SP3 (LGA) | DDR4 |
2nd | 2019 | Rome | 7002 series | 64 × Zen 2 | ||
3rd | 2021 | Milan | 7003 series | 64 × Zen 3 | ||
2022 | Milan-X | |||||
4th | Genoa | 9004 series | 96 × Zen 4 | SP5 (LGA) | DDR5 | |
2023 | Genoa-X | |||||
Bergamo | 128 × Zen 4c | |||||
Siena | 8004 series | 64 × Zen 4c | SP6 (LGA) | |||
5th | 2025 | Turin | 9005 series | 192 × Zen 5 | SP5 (LGA) | |
6th | TBA | Venice | TBA | TBA | SP7 (LGA) | TBA |
Embedded | ||||||
1st | 2018 | Snowy Owl | Embedded 3001 series | 16 × Zen | SP4 (BGA) | DDR4 |
2nd | 2019 | Naples | Embedded 7001 series | 32 × Zen | SP3 (BGA) | |
3rd | 2021 | Rome | Embedded 7002 series | 64 × Zen 2 | ||
4th | 2023 | Genoa | Embedded 9004 series | 96 × Zen 4 | SP5 (BGA) | DDR5 |
Epyc CPUs use a multi-chip module design to enable higher yields for a CPU than traditional monolithic dies. First generation Epyc CPUs are composed of four 14 nm compute dies, each with up to 8 cores. [20] [21] Cores are symmetrically disabled on dies to create lower binned products with fewer cores but the same I/O and memory footprint. Second and Third gen Epyc CPUs are composed of eight compute dies built on a 7 nm process node, and a large input/output (I/O) die built on a 14 nm process node. [22] Third gen Milan-X CPUs use advanced through-silicon-vias to stack an additional die on top of each of the 8 compute dies, adding 64 MB of L3 cache per die. [23]
Epyc CPUs supports both single socket and dual socket operation. In a dual socket configuration, 64 PCIe lanes from each CPU are allocated to AMD's proprietary Infinity Fabric interconnect to allow for full bandwidth between both CPUs. [24] Thus, a dual socket configuration has the same number of usable PCIe lanes as a single socket configuration. First generation Epyc CPUs had 128 PCIe 3.0 lanes, while second and third generation had 128 PCIe 4.0 lanes. All current Epyc CPUs are equipped with up to eight channels of DDR4 at varying speeds, though next gen Genoa CPUs are confirmed by AMD to support up to twelve channels of DDR5. [7] [25]
Unlike Opteron, Intel equivalents and AMD's desktop processors (excluding Socket AM1), Epyc processors are chipset-free - also known as system on a chip. That means most features required to make servers fully functional (such as memory, PCI Express, SATA controllers, etc.) are fully integrated into the processor, eliminating the need for a chipset to be placed on the mainboard. Some features may require the use of additional controller chips to utilize.
Initial reception to Epyc was generally positive. [25] Epyc was generally found to outperform Intel CPUs in cases where the cores could work independently, such as in high-performance computing and big-data applications. First generation Epyc fell behind in database tasks compared to Intel's Xeon parts due to higher cache latency. [25] In 2021 Meta Platforms selected Epyc chips for its metaverse data centers. [26]
Epyc Genoa was well received, as it offered improved performance and efficiency compared to previous offerings, though received some criticism for not having 2 DIMMs per channel configurations validating, with some reviewers calling it an "incomplete platform". [27]
The following table lists the devices using the first generation design.
A "P" suffix denotes support for only a single socket configuration. Non-P models use 64 PCIe lanes from each processor for the communication between processors.
Common features of EPYC 7001 series CPUs:
Model [lower-roman 1] | Cores (threads) | Clock rate (GHz) | L3 cache (total) | TDP | Chiplets | Core config [lower-roman 2] | Release | Embedded options [lower-roman 3] | |||
---|---|---|---|---|---|---|---|---|---|---|---|
Base | Boost | Date | Price (USD) | ||||||||
All–core | Max | ||||||||||
7251 [28] [29] | 8 (16) | 2.1 | 2.9 | 2.9 | 32 MB | 120 W | 4 × CCD | 8 × 1 | Jun 2017 [30] | $475 | Yes |
7261 [28] [31] | 2.5 | 64 MB | 155/170 W | Jun 2018 [32] | $570 | Yes | |||||
7281 [28] [29] | 16 (32) | 2.1 | 2.7 | 2.7 | 32 MB | 8 × 2 | Jun 2017 [30] | $650 | Yes | ||
7301 [28] [29] | 2.2 | 64 MB | $800 | Yes | |||||||
7351P [28] [29] | 2.4 | 2.9 | 2.9 | $750 | 735P | ||||||
7351 [28] [29] | $1,100 | Yes | |||||||||
7371 [28] [33] | 3.1 | 3.6 | 3.8 | 200 W | Nov 2018 [34] | $1,550 | Yes | ||||
7401P [28] [29] | 24 (48) | 2.0 | 2.8 | 3.0 | 155/170 W | 8 × 3 | Jun 2017 [30] | $1,075 | 740P | ||
7401 [28] [29] | $1,850 | Yes | |||||||||
7451 [28] [29] | 2.3 | 2.9 | 3.2 | 180 W | $2,400 | Yes | |||||
7501 [28] [29] | 32 (64) | 2.0 | 2.6 | 3.0 | 155/170 W | 8 × 4 | $3,400 | Yes | |||
7551P [28] [29] | 2.55 | 180 W | $2,100 | 755P | |||||||
7551 [28] [29] | $3,400 | Yes | |||||||||
7571 [35] [36] | 2.2 | 3.0 | 200 W | Nov 2018 | OEM/AWS | Unknown | |||||
7601 [28] [29] | 2.7 | 3.2 | 180 W | Jun 2017 [30] | $4,200 | Yes |
In November 2018, AMD announced Epyc 2 at their Next Horizon event, the second generation of Epyc processors codenamed "Rome" and based on the Zen 2 microarchitecture. [37] The processors feature up to eight 7 nm-based "chiplet" processors with a 14 nm-based IO chip providing 128 PCIe 4.0 lanes in the center interconnected via Infinity Fabric. The processors support up to 8 channels of DDR4 RAM up to 4 TB, and introduce support for PCIe 4.0. These processors have up to 64 cores with 128 SMT threads per socket. [38] The 7 nm "Rome" is manufactured by TSMC. [22] It was released on August 7, 2019. [39] It has 39.5 billion transistors. [40]
In April 2020, AMD launched three new SKUs using Epyc’s 7nm Rome platform. The three processors introduced were the eight-core Epyc 7F32, the 16-core 7F52 and the 24-core 7F72, featuring base clocks up to 3.7 GHz (up to 3.9 GHz with boost) within a TDP range of 180 to 240 watts. The launch was supported by Dell EMC, Hewlett Packard Enterprise, Lenovo, Supermicro, and Nutanix. [41]
Common features of these CPUs:
Model | Release date | Price (USD) | Fab | Chiplets | Cores (threads) | Core config [lower-roman 1] | Clock rate (GHz) | Cache | Socket & Scaling | TDP | |||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Base | Boost | L1 | L2 | L3 | |||||||||
7232P | August 7, 2019 | $450 | TSMC 7FF | 2 × CCD 1 × I/OD | 8 (16) | 4 × 2 | 3.1 | 3.2 | 32 KB inst. 32 KB data (per core) | 512 KB (per core) | 32 MB (8 MB per CCX) | SP3 1P | 120 W |
7302P | $825 | 4 × CCD 1 × I/OD | 16 (32) | 8 × 2 | 3 | 3.3 | 128 MB (16 MB per CCX) | 155 W | |||||
7402P | $1250 | 24 (48) | 8 × 3 | 2.8 | 3.35 | 180 W | |||||||
7502P | $2300 | 32 (64) | 8 × 4 | 2.5 | 3.35 | ||||||||
7702P | $4425 | 8 × CCD 1 × I/OD | 64 (128) | 16 × 4 | 2 | 3.35 | 256 MB (16 MB per CCX) | 200 W | |||||
7252 | $475 | 2 × CCD 1 × I/OD | 8 (16) | 4 × 2 | 3.1 | 3.2 | 64 MB (16 MB per CCX) | SP3 (up to) 2P | 120 W | ||||
7262 | $575 | 4 × CCD 1 × I/OD | 8 × 1 | 3.2 | 3.4 | 128 MB (16 MB per CCX) | 155 W | ||||||
7272 | $625 | 2 × CCD 1 × I/OD | 12 (24) | 4 × 3 | 2.9 | 3.2 | 64 MB (16 MB per CCX) | 120 W | |||||
7282 | $650 | 16 (32) | 4 × 4 | 2.8 | 3.2 | ||||||||
7302 | $978 | 4 × CCD 1 × I/OD | 8 × 2 | 3 | 3.3 | 128 MB (16 MB per CCX) | 155 W | ||||||
7352 | $1350 | 24 (48) | 8 × 3 | 2.3 | 3.2 | ||||||||
7402 | $1783 | 8 × 3 | 2.8 | 3.35 | 180 W | ||||||||
7452 | $2025 | 32 (64) | 8 × 4 | 2.35 | 3.35 | 155 W | |||||||
7502 | $2600 | 8 × 4 | 2.5 | 3.35 | 180 W | ||||||||
7532 | $3350 | 8 × CCD 1 × I/OD | 16 × 2 | 2.4 | 3.3 | 256 MB (16 MB per CCX) | 200 W | ||||||
7542 | $3400 | 4 × CCD 1 × I/OD | 8 × 4 | 2.9 | 3.4 | 128 MB (16 MB per CCX) | 225 W | ||||||
7552 | $4025 | 6 × CCD 1 × I/OD | 48 (96) | 12 × 4 | 2.2 | 3.3 | 192 MB (16 MB per CCX) | 200 W | |||||
7642 | $4775 | 8 × CCD 1 × I/OD | 16 × 3 | 2.3 | 3.3 | 256 MB (16 MB per CCX) | 225 W | ||||||
7662 | $6150 | 64 (128) | 16 × 4 | 2 | 3.3 | 225 W | |||||||
7702 | $6450 | 2 | 3.35 | 200 W | |||||||||
7742 | $6950 | 2.25 | 3.4 | 225 W | |||||||||
7H12 | September 18, 2019 | 2.6 | 3.3 | 280 W | |||||||||
7F32 | April 14, 2020 [42] | $2100 | 4 × CCD 1 × I/OD | 8 (16) | 8 × 1 | 3.7 | 3.9 | 128 MB (16 MB per CCX) | 180 W | ||||
7F52 | $3100 | 8 × CCD 1 × I/OD | 16 (32) | 16 × 1 | 3.5 | 3.9 | 256 MB (16 MB per CCX) | 240 W | |||||
7F72 | $2450 | 6 × CCD 1 × I/OD | 24 (48) | 12 × 2 | 3.2 | 3.7 | 192 MB (16 MB per CCX) | 240 W |
At the HPC-AI Advisory Council in the United Kingdom in October 2019, AMD stated specifications for Milan, Epyc chips based on the Zen 3 microarchitecture. [43] Milan chips will use Socket SP3, with up to 64 cores on package, and support eight-channel DDR4 RAM and 128 PCIe 4.0 lanes. [43] It also announced plans for the subsequent generation of chips, codenamed Genoa, that will be based on the Zen 4 microarchitecture and use Socket SP5. [43]
Milan CPUs were launched by AMD on March 15, 2021. [44]
Milan-X CPUs were launched March 21, 2022. [6] They use 3D V-Cache technology to increase the maximum L3 cache per socket capacity from 256 MB to 768 MB. [45] [46] [47]
Model | Price (USD) | Fab | Chiplets | Cores (threads) | Core config [lower-roman 1] | Clock rate (GHz) | Cache | Socket & Scaling | TDP | |||
---|---|---|---|---|---|---|---|---|---|---|---|---|
Base | Boost | L1 | L2 | L3 | ||||||||
7773X | $8800 | TSMC 7FF | 8 × CCD 1 × I/OD | 64 (128) | 8 × 8 | 2.20 | 3.50 | 32 KB inst. 32 KB data (per core) | 512 KB (per core) | 768 MB (96 MB per CCX) | SP3 (up to) 2P | 280 W |
7763 | $7890 | 2.45 | 3.40 | 256 MB 32 MB per CCX | SP3 (up to) 2P | 280 W | ||||||
7713 | $7060 | 2.00 | 3.675 | 225 W | ||||||||
7713P | $5010 | SP3 1P | ||||||||||
7663 | $6366 | 56 (112) | 8 × 7 | 2.00 | 3.50 | SP3 (up to) 2P | 240 W | |||||
7663P | $3139 | SP3 1P | ||||||||||
7643 | $4995 | 48 (96) | 8 × 6 | 2.30 | 3.60 | SP3 (up to) 2P | 225 W | |||||
7643P | $2722 | SP3 1P | ||||||||||
7573X | $5590 | 32 (64) | 8 × 4 | 2.80 | 3.60 | 768 MB (96 MB per CCX) | SP3 (up to) 2P | 280 W | ||||
75F3 | $4860 | 2.95 | 4.00 | 256 MB (32 MB per CCX) | ||||||||
7543 | $3761 | 2.80 | 3.70 | 225 W | ||||||||
7543P | $2730 | 256 MB (32 MB per CCX) | SP3 1P | |||||||||
7513 | $2840 | 2.60 | 3.65 | 128 MB (16 MB per CCX) | SP3 (up to) 2P | 200 W | ||||||
7453 | $1570 | 4 × CCD 1 × I/OD | 28 (56) | 4 × 7 | 2.75 | 3.45 | 64 MB (16 MB per CCX) | 225 W | ||||
7473X | $3900 | 8 × CCD 1 × I/OD | 24 (48) | 8 × 3 | 2.80 | 3.70 | 768 MB (96 MB per CCX) | 240 W | ||||
74F3 | $2900 | 3.20 | 4.00 | 256 MB (32 MB per CCX) | ||||||||
7443 | $2010 | 4 × CCD 1 × I/OD | 4 × 6 | 2.85 | 4.00 | 128 MB (32 MB per CCX) | 200 W | |||||
7443P | $1337 | SP3 1P | ||||||||||
7413 | $1825 | 2.65 | 3.60 | SP3 (up to) 2P | 180 W | |||||||
7373X | $4185 | 8 × CCD 1 × I/OD | 16 (32) | 8 × 2 | 3.05 | 3.80 | 768 MB (96 MB per CCX) | 240 W | ||||
73F3 | $3521 | 3.50 | 4.00 | 256 MB (32 MB per CCX) | ||||||||
7343 | $1565 | 4 × CCD 1 × I/OD | 4 × 4 | 3.20 | 3.90 | 128 MB (32 MB per CCX) | 190 W | |||||
7313 | $1083 | 3.00 | 3.70 | 155 W | ||||||||
7313P | $913 | SP3 1P | ||||||||||
7303 | $604 | 2 × CCD 1 × I/OD | 2 x 8 | 2.40 | 3.40 | 64 MB (32 MB per CCX) | SP3 (up to) 2P | 130 W | ||||
7303P | $594 | SP3 1P | ||||||||||
72F3 | $2468 | 8 × CCD 1 × I/OD | 8 (16) | 8 × 1 | 3.70 | 4.10 | 256 MB (32 MB per CCX) | SP3 (up to) 2P | 180 W | |||
7203 | $348 | 2 × CCD 1 × I/OD | 2 x 4 | 2.80 | 3.40 | 64 MB (32 MB per CCX) | 120 W | |||||
7203P | $338 | SP3 1P |
On November 10, 2022, AMD launched the fourth generation of Epyc server and data center processors based on the Zen 4 microarchitecture, codenamed Genoa. [48] At their launch event, AMD announced that Microsoft and Google would be some of Genoa's customers. [49] Genoa features between 16 and 96 cores with support for PCIe 5.0 and DDR5. There was also an emphasis by AMD on Genoa's energy efficiency, which according to AMD CEO Lisa Su, means "lower total cost of ownership" for enterprise and cloud datacenter clients. [50] Genoa uses AMD's new SP5 (LGA 6096) socket. [51]
On June 13, 2023, AMD introduced Genoa-X with 3D V-Cache technology for technical computing performance and Bergamo (9734, 9754 and 9754S) for cloud native computing. [52]
On September 18, 2023, AMD introduced the low power Siena lineup of processors, based on the Zen 4c microarchitecture. Siena supports up to 64 cores on the new SP6 socket, which is currently only used by Siena processors. Siena uses the same I/O die as Bergamo, however certain features, such as dual socket support, are removed, and other features are reduced, such as the change from 12 channel memory support to 6 channel memory support. [53]
Model | Fab | Cores (Threads) | Chiplets | Core config [lower-roman 1] | Clock rate (GHz) | Cache (MB) | Socket | Socket count | PCIe 5.0 lanes | Memory support | TDP | Release date | Price (USD) | |||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Base | Boost | L1 | L2 | L3 | DDR5 ECC | |||||||||||
Low Power & Edge (Zen 4c cores) | ||||||||||||||||
8024P | TSMC N5 | 8 (16) | 4 × CCD 1 × I/OD | 4 × 2 | 2.45 | 3.0 | 0.5 | 8 | 32 | SP6 | 1P | 96 | DDR5-4800 six-channel | 90 W | Sep 18, 2023 | $409 |
8024PN | 2.05 | 80 W | $525 | |||||||||||||
8124P | 16 (32) | 4 × 4 | 2.9 | 1 | 16 | 64 | 125 W | $639 | ||||||||
8124PN | 2.0 | 100 W | $790 | |||||||||||||
8224P | 24 (48) | 4 × 6 | 2.55 | 1.5 | 24 | 160 W | $855 | |||||||||
8224PN | 2.0 | 120 W | $1,015 | |||||||||||||
8324P | 32 (64) | 4 × 8 | 2.65 | 2 | 32 | 128 | 180 W | $1,895 | ||||||||
8324PN | 2.05 | 130 W | $2,125 | |||||||||||||
8434P | 48 (96) | 4 × 12 | 2.5 | 3.1 | 3 | 48 | 200 W | $2,700 | ||||||||
8434PN | 2.0 | 3.0 | 155 W | $3,150 | ||||||||||||
8534P | 64 (128) | 4 × 16 | 2.3 | 3.1 | 4 | 64 | 200 W | $4,950 | ||||||||
8534PN | 2.0 | 155 W | $5,450 | |||||||||||||
Mainstream Enterprise (Zen 4 cores) | ||||||||||||||||
9124 | TSMC N5 | 16 (32) | 4 × CCD 1 × I/OD | 4 × 4 | 3.0 | 3.7 | 1 | 16 | 64 | SP5 | 1P/2P | 128 | DDR5-4800 twelve-channel | 200 W | Nov 10, 2022 | $1,083 |
9224 | 24 (48) | 4 × 6 | 2.5 | 3.7 | 1.5 | 24 | 200 W | $1,825 | ||||||||
9254 | 4 × 6 | 2.9 | 4.15 | 128 | 220 W | $2,299 | ||||||||||
9334 | 32 (64) | 4 × 8 | 2.7 | 3.9 | 2 | 32 | 210 W | $2,990 | ||||||||
9354 | 8 × CCD 1 × I/OD | 8 × 4 | 3.25 | 3.75 | 256 | 280 W | $3,420 | |||||||||
9354P | 1P | $2,730 | ||||||||||||||
Performance Enterprise (Zen 4 cores) | ||||||||||||||||
9174F | TSMC N5 | 16 (32) | 8 × CCD 1 × I/OD | 8 × 2 | 4.1 | 4.4 | 1 | 16 | 256 | SP5 | 1P/2P | 128 | DDR5-4800 twelve-channel | 320 W | Nov 10, 2022 | $3,850 |
9184X | 3.55 | 4.2 | 768 | Jun 13, 2023 | $4,928 | |||||||||||
9274F | 24 (48) | 8 × 3 | 4.05 | 4.3 | 1.5 | 24 | 256 | Nov 10, 2022 | $3,060 | |||||||
9374F | 32 (64) | 8 × 4 | 3.85 | 4.3 | 2 | 32 | $4,860 | |||||||||
9384X | 3.1 | 3.9 | 768 | Jun 13, 2023 | $5,529 | |||||||||||
9474F | 48 (96) | 8 × 6 | 3.6 | 4.1 | 3 | 48 | 256 | 360 W | Nov 10, 2022 | $6,780 | ||||||
High Performance Computing (Zen 4 cores) | ||||||||||||||||
9454 | TSMC N5 | 48 (96) | 8 × CCD 1 × I/OD | 8 × 6 | 2.75 | 3.8 | 3 | 48 | 256 | SP5 | 1P/2P | 128 | DDR5-4800 twelve-channel | 290 W | Nov 10, 2022 | $5,225 |
9454P | 1P | $4,598 | ||||||||||||||
9534 | 64 (128) | 8 × 8 | 2.45 | 3.7 | 4 | 64 | 1P/2P | 280 W | $8,803 | |||||||
9554 | 3.1 | 3.75 | 360 W | $9,087 | ||||||||||||
9554P | 1P | $7,104 | ||||||||||||||
9634 | 84 (168) | 12 × CCD 1 × I/OD | 12 × 7 | 2.25 | 3.7 | 5.25 | 84 | 384 | 1P/2P | 290 W | $10,304 | |||||
9654 | 96 (192) | 12 × 8 | 2.4 | 3.7 | 6 | 96 | 360 W | $11,805 | ||||||||
9654P | 1P | $10,625 | ||||||||||||||
9684X | 2.55 | 3.7 | 1152 | 1P/2P | 400 W | Jun 13, 2023 | $14,756 | |||||||||
Cloud (Zen 4c cores) | ||||||||||||||||
9734 | TSMC N5 | 112 (224) | 8 × CCD 1 × I/OD | 8 x 14 | 2.2 | 3.0 | 7 | 112 | 256 | SP5 | 1P/2P | 128 | DDR5-4800 twelve-channel | 340 W | Jun 13, 2023 | $9,600 |
9754S | 128 (128) | 8 x 16 | 2.25 | 3.1 | 8 | 128 | 360 W | $10,200 | ||||||||
9754 | 128 (256) | $11,900 |
In February 2018, AMD also announced the Epyc 3000 series of embedded Zen CPUs. [54]
Common features of EPYC Embedded 3000 series CPUs:
Model | Cores (threads) | Clock rate (GHz) | L3 cache (total) | TDP | Chiplets | Core config [lower-roman 1] | Release date | ||
---|---|---|---|---|---|---|---|---|---|
Base | Boost | ||||||||
All-core | Max | ||||||||
3101 [55] | 4 (4) | 2.1 | 2.9 | 2.9 | 8 MB | 35 W | 1 x CCD | 1 × 4 | Feb 2018 |
3151 [55] | 4 (8) | 2.7 | 16 MB | 45 W | 2 × 2 | ||||
3201 [55] | 8 (8) | 1.5 | 3.1 | 3.1 | 30 W | 2 × 4 | |||
3251 [55] | 8 (16) | 2.5 | 55 W | ||||||
3255 [56] | 25–55 W | Dec 2018 | |||||||
3301 [55] | 12 (12) | 2.0 | 2.15 | 3.0 | 32 MB | 65 W | 2 x CCD | 4 × 3 | Feb 2018 |
3351 [55] | 12 (24) | 1.9 | 2.75 | 60–80 W | |||||
3401 [55] | 16 (16) | 1.85 | 2.25 | 85 W | 4 × 4 | ||||
3451 [55] | 16 (32) | 2.15 | 2.45 | 80–100 W |
A variant created for the Chinese server market by Hygon Information Technology is the Hygon Dhyana system on a chip. [57] [58] It is noted to be a variant of the AMD Epyc, and is so similar that "there is little to no differentiation between the chips". [57] It has been noted that there is "less than 200 lines of new kernel code" for Linux kernel support, and that the Dhyana is "mostly a re-branded Zen CPU for the Chinese server market". [58] Later Benchmarks showed that certain floating point instructions are performing worse, probably to comply with US export restrictions. [59] AES and other western cryptography algorithms are replaced by Chinese variants throughout the design. [59]
AMD Accelerated Processing Unit (APU), formerly known as Fusion, is a series of 64-bit microprocessors from Advanced Micro Devices (AMD), combining a general-purpose AMD64 central processing unit (CPU) and 3D integrated graphics processing unit (IGPU) on a single die.
Intel Core is a line of multi-core central processing units (CPUs) for midrange, embedded, workstation, high-end and enthusiast computer markets marketed by Intel Corporation. These processors displaced the existing mid- to high-end Pentium processors at the time of their introduction, moving the Pentium to the entry level. Identical or more capable versions of Core processors are also sold as Xeon processors for the server and workstation markets.
Double Data Rate 5 Synchronous Dynamic Random-Access Memory is a type of synchronous dynamic random-access memory. Compared to its predecessor DDR4 SDRAM, DDR5 was planned to reduce power consumption, while doubling bandwidth. The standard, originally targeted for 2018, was released on July 14, 2020.
Zen is the codename for a family of computer processor microarchitectures from AMD, first launched in February 2017 with the first generation of its Ryzen CPUs. It is used in Ryzen, Ryzen Threadripper, and Epyc (server).
Zen is the codename for the first iteration in a family of computer processor microarchitectures of the same name from AMD. It was first used with their Ryzen series of CPUs in February 2017. The first Zen-based preview system was demonstrated at E3 2016, and first substantially detailed at an event hosted a block away from the Intel Developer Forum 2016. The first Zen-based CPUs, codenamed "Summit Ridge", reached the market in early March 2017, Zen-derived Epyc server processors launched in June 2017 and Zen-based APUs arrived in November 2017.
Zen 2 is a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nm MOSFET node from TSMC. The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips, Ryzen 4000U/H and Ryzen 5000U for mobile applications, as Threadripper 3000 for high-end desktop systems, and as Ryzen 4000G for accelerated processing units (APUs). The Ryzen 3000 series CPUs were released on 7 July 2019, while the Zen 2-based Epyc server CPUs were released on 7 August 2019. An additional chip, the Ryzen 9 3950X, was released in November 2019.
Ryzen is a brand of multi-core x86-64 microprocessors designed and marketed by Advanced Micro Devices (AMD) for desktop, mobile, server, and embedded platforms based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream, enthusiast, server, and workstation segments and accelerated processing units (APUs) marketed for mainstream and entry-level segments and embedded systems applications.
Zen+ is the codename for a computer processor microarchitecture by AMD. It is the successor to the first gen Zen microarchitecture, and was first released in April 2018, powering the second generation of Ryzen processors, known as Ryzen 2000 for mainstream desktop systems, Threadripper 2000 for high-end desktop setups and Ryzen 3000G for accelerated processing units (APUs).
The Radeon RX Vega series is a series of graphics processors developed by AMD. These GPUs use the Graphics Core Next (GCN) 5th generation architecture, codenamed Vega, and are manufactured on 14 nm FinFET technology, developed by Samsung Electronics and licensed to GlobalFoundries. The series consists of desktop graphics cards and APUs aimed at desktops, mobile devices, and embedded applications.
Sapphire Rapids is a codename for Intel's server and workstation processors based on the Golden Cove microarchitecture and produced using Intel 7. Featuring up to 60 cores and an array of accelerators, it is the first generation of Intel server and workstation processors to use a chiplet design.
Zen 4 is the codename for a CPU microarchitecture designed by AMD, released on September 27, 2022. It is the successor to Zen 3 and uses TSMC's N6 process for I/O dies, N5 process for CCDs, and N4 process for APUs. Zen 4 powers Ryzen 7000 performance desktop processors, Ryzen 8000G series mainstream desktop APUs, and Ryzen Threadripper 7000 series HEDT and workstation processors. It is also used in extreme mobile processors, thin & light mobile processors, as well as EPYC 8004/9004 server processors.
Zen 3 is the codename for a CPU microarchitecture by AMD, released on November 5, 2020. It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. Zen 3 powers Ryzen 5000 mainstream desktop processors and Epyc server processors. Zen 3 is supported on motherboards with 500 series chipsets; 400 series boards also saw support on select B450 / X470 motherboards with certain BIOSes. Zen 3 is the last microarchitecture before AMD switched to DDR5 memory and new sockets, which are AM5 for the desktop "Ryzen" chips alongside SP5 and SP6 for the EPYC server platform and sTRX8. According to AMD, Zen 3 has a 19% higher instructions per cycle (IPC) on average than Zen 2.
Sierra Forest is a codename for Intel's first generation E-core based Xeon server processors. It is fabricated using Intel's Intel 3 process and compatible with the LGA 7529 socket.
Socket SP5 is a zero insertion force land grid array CPU socket designed by AMD supporting its Zen 4-based Epyc server processors codenamed Genoa that launched on November 10, 2022.
Socket SP6 is a zero insertion force land grid array CPU socket designed by AMD supporting its Zen 4c-based Epyc Siena server processors that launched on September 18, 2023. It is designed for server systems targeting infrastructure and edge computing segments.