Zen is a family of computer processor microarchitectures from AMD, first launched in February 2017 with the first generation of its Ryzen CPUs. It is used in Ryzen (desktop and mobile), Ryzen Threadripper (workstation and high end desktop), and Epyc (server).
Microarchitecture | Zen [1] | Zen 2 [2] | Zen 3 [3] | Zen 4 [4] | Zen 5 [5] | |||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
Microarchitecture variants | Zen | Zen+ [6] | Zen 3 | Zen 3+ | Zen 4 | Zen 4c [7] | Zen 5 | Zen 5c | ||||
Fabrication process (nm) | 14 nm | 12 nm | 7 nm | 6 nm | 5 nm | 4 nm | 3 nm | |||||
Cache [8] | μop | 2K | 4K | 6.75K | ||||||||
L1 | Data | Size | 32 KB | 48 KB | ||||||||
Ways | 4 | 8 | ||||||||||
Latency | 4–8 | |||||||||||
Instruction | Size | 64 KB | 32 KB | |||||||||
Ways | 8 | |||||||||||
Latency | 4–8 | |||||||||||
TLB | 512-entry | 1024-entry | ||||||||||
L2 | Size | 512 KB/core | 1024 KB/core | |||||||||
Ways | 8 | |||||||||||
Latency | 17 | 12 | 14 | |||||||||
TLB | 1536-entry | 2048-entry | 3072-entry | |||||||||
L3 | Size (per CCX) | 8 MB | 16 MB | 32 MB | APU-only | 32 MB | 16 MB | 32 MB | 16 MB | |||
Ways | 16 [9] | |||||||||||
Latency | 35 | 40 | 46 | 50 | ||||||||
Max. CPU cores | 32 | 64 | 8 | 96 [10] | 128 [11] | 128 | 192 | |||||
Simultaneous multithreading (SMT) | ||||||||||||
OoO window (ROB) | 192 | 224 | 256 | 320 | ||||||||
Pipeline | stage | 19 | ||||||||||
Decode (ways) | 4 | 6 [12] | ||||||||||
Scheduler | Entries | |||||||||||
Dispatch | 6 | |||||||||||
Register file | Integer | 84 | 92 | 96 | 224 [13] | |||||||
Floating-point | 96 | 160 [13] | 192 [13] | |||||||||
Queue | Instruction | 72 | ||||||||||
Allocation | 44 | |||||||||||
AGUs | 2 | 3 |
The first generation Zen was launched with the Ryzen 1000 series of CPUs (codenamed Summit Ridge) in February 2017. [14] The first Zen-based preview system was demonstrated at E3 2016, and first substantially detailed at an event hosted a block away from the Intel Developer Forum 2016. The first Zen-based CPUs reached the market in early March 2017, and Zen-derived Epyc server processors (codenamed "Naples") launched in June 2017 [15] and Zen-based APUs (codenamed "Raven Ridge") arrived in November 2017. [16] This first iteration of Zen utilized GlobalFoundries' 14 nm manufacturing process. [17] Modified Zen-based processors for the Chinese market were also built under the AMD–Chinese joint venture.
Zen+ was first released in April 2018, [18] powering the second generation of Ryzen processors, known as Ryzen 2000 (codenamed "Pinnacle Ridge") for mainstream desktop systems, and Threadripper 2000 (codenamed "Colfax") for high-end desktop setups. Zen+ used GlobalFoundries' 12 nm process, an enhanced version of their 14 nm node. [19] [20]
The Ryzen 3000 series CPUs were released on July 7, 2019, [21] [22] while the Zen 2-based Epyc server CPUs (codename "Rome") were released on August 7, 2019. [23] Zen 2 Matisse products were the first consumer CPUs to use the 7 nm process node, from TSMC. [24] Zen 2 introduced the chiplet based architecture, where desktop, workstation, and server CPUs are all produced as multi-chip modules (MCMs); these Zen 2 products utilise the same core chiplets but are attached to different uncore silicon (different IO dies) in a hub and spoke topology. This approach differs from Zen 1 products, where the same die (Zeppelin) is used in a simple monolithic package for Summit Ridge products (Ryzen 1000 series) or used as interconnected building blocks in an MCM (up to four Zeppelin dies) for first generation Epyc and Threadripper products. [25] For earlier Zen 2 products the IO and uncore functions are performed within this separate IO die, [26] which contains the memory controllers, the fabric to enable core to core communication, and the bulk of uncore functions. The IO die used by Matisse processors is a small chip produced on GF 12 nm, [27] whereas the server IO die utilized for Threadripper and Epyc is far larger. [27] The server IO die is able to serve as a hub to connect up to eight 8-core chiplets, while the IO die for Matisse is able to connect up to two 8-core chiplets. These chiplets are linked by AMD's own second generation Infinity Fabric, [27] allowing a low-latency interconnect between the cores and to IO. The processing cores in the chiplets are organized in CCXs (Core Complexes) of four cores, linked together to form a single eight core CCD (Core Chiplet Die). [28]
Zen 2 also powers a line of mobile and desktop APUs marketed as Ryzen 4000, as well as fourth generation Xbox consoles and the PlayStation 5. The Zen 2 core microarchitecture is also used in the Mendocino APU, a 6 nm system on a chip aimed at mainstream mobile and other energy efficient low power computing products. [29]
Zen 3 was released on November 5, 2020, [30] using a more matured 7 nm manufacturing process, powering Ryzen 5000 series CPUs and APUs [30] (codename "Vermeer" (CPU) and "Cézanne" (APU)) and Epyc processors (codename "Milan"). Zen 3's main performance gain over Zen 2 is the introduction of a unified CCX, which means that each core chiplet is now composed of eight cores with access to 32 MB of L3 cache, instead of two sets of four cores with access to 16 MB of L3 cache each. [31]
On April 1, 2022, AMD released the new Ryzen 6000 series for the laptop, using an improved Zen 3+ architecture, bringing RDNA 2 graphics integrated in a APU to the PC for the first time. [32]
Zen 3 with 3D V-Cache was officially previewed on May 31, 2021. [33] It differs from Zen 3 in that it includes 3D-stacked L3 cache on top of the normal L3 cache in the CCD, providing a total of 96 MB. The first product that uses it, the Ryzen 7 5800X3D, was released on April 20, 2022. The added cache brings an approximately 15% performance increase in gaming applications on average. [34]
Zen 3 with 3D V-Cache for server, codenamed Milan-X, was announced in AMD's Accelerated Data Center Premiere Keynote on November 8, 2021. It brings a 50% increase in select datacenter applications over Zen 3's Milan CPUs while maintaining socket compatibility with them. [35] Milan-X was released on March 21, 2022. [36]
Epyc server CPUs with Zen 4, codenamed Genoa, were officially unveiled at AMD's Accelerated Data Center Premiere Keynote on November 8, 2021, [37] and released a year later in November 2022. [38] They have up to 96 Zen 4 cores and support both PCIe 5.0 and DDR5.
Furthermore, Zen 4 Cloud (a variant of Zen 4), abbreviated to Zen 4c, was also announced. Zen 4c is designed to have significantly greater density than standard Zen 4 while delivering greater power efficiency. This is achieved by redesigning Zen 4's core and cache to maximise density and compute throughput. It has 50% less L3 cache than Zen 4 and is not able to clock as high. Bergamo (Epyc 9704 series) has up to 128 Zen 4c cores and is socket-compatible with Genoa. It was released in June 2023. [39] Another server product line that uses Zen 4c cores is Siena (Epyc 8004 series), which has up to 64 cores, uses a different smaller socket and is intended for use cases that favour smaller size, cost, power and thermal footprints over high performance. [40]
Both Zen 4 and Zen 4 Cloud are manufactured on TSMC's 5 nm node. [39]
In addition to the Epyc 9004, 9704 and 8004 server processors (Genoa, Bergamo and Siena respectively), Zen 4 also powers Ryzen 7000 mainstream desktop processors (codenamed "Raphael"), [41] high-end mobile processors (codenamed "Dragon Range") and thin-and-light mobile processors (codenamed "Phoenix"). [42] It also powers the Ryzen 8000 G-series of desktop APUs. [43]
Zen 5 was shown on AMD's Zen roadmap in May 2022. [44] It is believed to use TSMC's 4 nm and 3 nm processes. [45] It will power Ryzen 9000 mainstream desktop processors (codenamed "Granite Ridge"), high-end mobile processors (codenamed "Strix Point"), and Epyc 9005 server processors (codenamed "Turin").
Zen 5c is a compact variant of the Zen 5 core, primarily targeted at hyperscale cloud compute server customers. [46]
On August 9, 2024 a vulnerability termed "Sinkclose" was announced affecting all Zen-based processors to that date. Sinkclose affects the System Management Mode (SMM). It can only be exploited by first compromising the operating system kernel. Once effected, it is possible to avoid detection by antivirus software and even compromise a system after the operating system has been re-installed. AMD followed up with patches to be released on August 20, 2024. [47] [48] [49]
Advanced Micro Devices, Inc. (AMD) is an American multinational corporation and fabless semiconductor company based in Santa Clara, California, that designs, develops and sells computer processors and related technologies for business and consumer markets.
Athlon is the brand name applied to a series of x86-compatible microprocessors designed and manufactured by AMD. The original Athlon was the first seventh-generation x86 processor and the first desktop processor to reach speeds of one gigahertz (GHz). It made its debut as AMD's high-end processor brand on June 23, 1999. Over the years AMD has used the Athlon name with the 64-bit Athlon 64 architecture, the Athlon II, and Accelerated Processing Unit (APU) chips targeting the Socket AM1 desktop SoC architecture, and Socket AM4 Zen (microarchitecture). The modern Zen-based Athlon with a Radeon Graphics processor was introduced in 2019 as AMD's highest-performance entry-level processor.
A multi-chip module (MCM) is generically an electronic assembly where multiple integrated circuits, semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach.
AMD Accelerated Processing Unit (APU), formerly known as Fusion, is a series of 64-bit microprocessors from Advanced Micro Devices (AMD), combining a general-purpose AMD64 central processing unit (CPU) and 3D integrated graphics processing unit (IGPU) on a single die.
AMD Steamroller Family 15h is a microarchitecture developed by AMD for AMD APUs, which succeeded Piledriver in the beginning of 2014 as the third-generation Bulldozer-based microarchitecture. Steamroller APUs continue to use two-core modules as their predecessors, while aiming at achieving greater levels of parallelism.
Zen is first iteration in the Zen family of computer processor microarchitectures from AMD. It was first used with their Ryzen series of CPUs in February 2017. The first Zen-based preview system was demonstrated at E3 2016, and first substantially detailed at an event hosted a block away from the Intel Developer Forum 2016. The first Zen-based CPUs, codenamed "Summit Ridge", reached the market in early March 2017, Zen-derived Epyc server processors launched in June 2017 and Zen-based APUs arrived in November 2017.
Zen 2 is a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nm MOSFET node from TSMC. The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips, Ryzen 4000U/H and Ryzen 5000U for mobile applications, as Threadripper 3000 for high-end desktop systems, and as Ryzen 4000G for accelerated processing units (APUs). The Ryzen 3000 series CPUs were released on 7 July 2019, while the Zen 2-based Epyc server CPUs were released on 7 August 2019. An additional chip, the Ryzen 9 3950X, was released in November 2019.
Ryzen is a brand of multi-core x86-64 microprocessors designed and marketed by Advanced Micro Devices (AMD) for desktop, mobile, server, and embedded platforms based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream, enthusiast, server, and workstation segments and accelerated processing units (APUs) marketed for mainstream and entry-level segments and embedded systems applications.
Zen+ is the name for a computer processor microarchitecture by AMD. It is the successor to the first gen Zen microarchitecture, and was first released in April 2018, powering the second generation of Ryzen processors, known as Ryzen 2000 for mainstream desktop systems, Threadripper 2000 for high-end desktop setups and Ryzen 3000G for accelerated processing units (APUs).
Epyc is a brand of multi-core x86-64 microprocessors designed and sold by AMD, based on the company's Zen microarchitecture. Introduced in June 2017, they are specifically targeted for the server and embedded system markets.
The Radeon RX Vega series is a series of graphics processors developed by AMD. These GPUs use the Graphics Core Next (GCN) 5th generation architecture, codenamed Vega, and are manufactured on 14 nm FinFET technology, developed by Samsung Electronics and licensed to GlobalFoundries. The series consists of desktop graphics cards and APUs aimed at desktops, mobile devices, and embedded applications.
RDNA is a graphics processing unit (GPU) microarchitecture and accompanying instruction set architecture developed by AMD. It is the successor to their Graphics Core Next (GCN) microarchitecture/instruction set. The first product lineup featuring RDNA was the Radeon RX 5000 series of video cards, launched on July 7, 2019. The architecture is also used in mobile products. It is manufactured and fabricated with TSMC's N7 FinFET graphics chips used in the Navi series of AMD Radeon graphics cards.
Zen 4 is the name for a CPU microarchitecture designed by AMD, released on September 27, 2022. It is the successor to Zen 3 and uses TSMC's N6 process for I/O dies, N5 process for CCDs, and N4 process for APUs. Zen 4 powers Ryzen 7000 performance desktop processors, Ryzen 8000G series mainstream desktop APUs, and Ryzen Threadripper 7000 series HEDT and workstation processors. It is also used in extreme mobile processors, thin & light mobile processors, as well as EPYC 8004/9004 server processors.
Zen 5 is the name for a CPU microarchitecture by AMD, shown on their roadmap in May 2022, launched for mobile in July 2024 and for desktop in August 2024. It is the successor to Zen 4 and is currently fabricated on TSMC's N4P process. Zen 5 is also planned to be fabricated on the N3E process in the future.
Zen 3 is the name for a CPU microarchitecture by AMD, released on November 5, 2020. It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. Zen 3 powers Ryzen 5000 mainstream desktop processors and Epyc server processors. Zen 3 is supported on motherboards with 500 series chipsets; 400 series boards also saw support on select B450 / X470 motherboards with certain BIOSes. Zen 3 is the last microarchitecture before AMD switched to DDR5 memory and new sockets, which are AM5 for the desktop "Ryzen" chips alongside SP5 and SP6 for the EPYC server platform and sTRX8. According to AMD, Zen 3 has a 19% higher instructions per cycle (IPC) on average than Zen 2.
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