Pin grid array

Last updated • 4 min readFrom Wikipedia, The Free Encyclopedia
Closeup of the pins of a pin grid array AMD Phenom II X6 1090T (HDT90ZFBK6DGR) CPU-pins PNrdeg0295.jpg
Closeup of the pins of a pin grid array
The pin grid array at the bottom of prototype Motorola 68020 microprocessor XC68020 bottom p1160085.jpg
The pin grid array at the bottom of prototype Motorola 68020 microprocessor
The pin grid array on the bottom of an AMD Phenom X4 9750 processor that uses the AMD AM2+ socket AMD Phenom X4 9750 (Underside).JPG
The pin grid array on the bottom of an AMD Phenom X4 9750 processor that uses the AMD AM2+ socket

A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, [1] and may or may not cover the entire underside of the package.

Contents

PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP).

Chip mounting

Underside of an 80486 with lid removed shows die and wire bonded connections. 80486 open.jpg
Underside of an 80486 with lid removed shows die and wire bonded connections.

The chip can be mounted either on the top or the bottom (the pinned side). Connections can be made either by wire bonding or through flip chip mounting. Typically, PGA packages use wire bonding when the chip is mounted on the pinned side, and flip chip construction when the chip is on the top side. Some PGA packages contain multiple dies, for example Zen 2 and Zen 3 Ryzen CPUs for the AM4 socket.

Flip chip

The underside of a FC-PGA package (The die is on the other side.) Ppga.jpg
The underside of a FC-PGA package (The die is on the other side.)

A flip-chip pin grid array (FC-PGA or FCPGA) is a form of pin grid array in which the die faces downwards on the top of the substrate with the back of the die exposed. This allows the die to have a more direct contact with the heatsink or other cooling mechanism.

FC-PGA CPUs were introduced by Intel in 1999, for Coppermine core Pentium III and Celeron [2] processors based on Socket 370, and were produced until Socket G3 in 2013. FC-PGA processors fit into zero insertion force (ZIF) motherboard sockets; similar packages were also used by AMD.

Material

Ceramic

A ceramic pin grid array (CPGA) is a type of packaging used by integrated circuits. This type of packaging uses a ceramic substrate with pins arranged in a pin grid array. Some CPUs that use CPGA packaging are the AMD Socket A Athlons and the Duron.

A CPGA was used by AMD for Athlon and Duron processors based on Socket A, as well as some AMD processors based on Socket AM2 and Socket AM2+. While similar form factors have been used by other manufacturers, they are not officially referred to as CPGA. This type of packaging uses a ceramic substrate with pins arranged in an array.

Organic

Demonstration of a PGA-ZIF socket (AMD 754)

An organic pin grid array (OPGA) is a type of connection for integrated circuits, and especially CPUs, where the silicon die is attached to a plate made out of an organic plastic which is pierced by an array of pins which make the requisite connections to the socket.

Plastic

The topside of a Celeron-400 in a PPGA packing UpSL3A2.JPG
The topside of a Celeron-400 in a PPGA packing

Plastic pin grid array (PPGA) packaging was used by Intel for late-model Mendocino core Celeron processors based on Socket 370. [3] Some pre-Socket 8 processors also used a similar form factor, although they were not officially referred to as PPGA.

Underside of a Pentium 4 in a PGA package Pentium 4 Underside Demonstrating PGA Socket.JPG
Underside of a Pentium 4 in a PGA package

Pin layout

Staggered pin

The staggered pin grid array (SPGA) is used by Intel processors based on Socket 5 and Socket 7. Socket 8 used a partial SPGA layout on half the processor.

An example of a socket for a staggered pin grid array package Socket 7.jpg
An example of a socket for a staggered pin grid array package
View of the socket 7 321-pin connectors of a CPU Cyrix IBM CPU 6x86MX PR200 bottom.jpg
View of the socket 7 321-pin connectors of a CPU

It consists of two square arrays of pins, offset in both directions by half the minimum distance between pins in one of the arrays. Put differently: within a square boundary the pins form a diagonal square lattice. There is generally a section in the center of the package without any pins. SPGA packages are usually used by devices that require a higher pin density than what a PGA can provide, such as microprocessors.

Stud

A stud grid array (SGA) is a short-pinned pin grid array chip scale package for use in surface-mount technology. The polymer stud grid array or plastic stud grid array was developed jointly by the Interuniversity Microelectronics Centre (IMEC) and Laboratory for Production Technology, Siemens AG. [4] [5]

rPGA

The reduced pin grid array was used by the socketed mobile variants of Intel's Core i3/5/7 processors and features a reduced pin pitch of 1 mm, [6] as opposed to the 1.27 mm pin pitch used by contemporary AMD processors and older Intel processors. It is used in the G1, G2, and G3 sockets.

See also

Related Research Articles

<span class="mw-page-title-main">Dual in-line package</span> Type of electronic component package

In microelectronics, a dual in-line package is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads ; eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages.

<span class="mw-page-title-main">Celeron</span> Line of discontinued microprocessors made by Intel

Celeron is a series of IA-32 and x86-64 computer microprocessors targeted at low-cost personal computers, manufactured by Intel from 1998 until 2023.

<span class="mw-page-title-main">Athlon 64</span> Series of CPUs by AMD

The Athlon 64 is a ninth-generation, AMD64-architecture microprocessor produced by Advanced Micro Devices (AMD), released on September 23, 2003. It is the third processor to bear the name Athlon, and the immediate successor to the Athlon XP. The Athlon 64 was the second processor to implement the AMD64 architecture and the first 64-bit processor targeted at the average consumer. Variants of the Athlon 64 have been produced for Socket 754, Socket 939, Socket 940, and Socket AM2. It was AMD's primary consumer CPU, and primarily competed with Intel's Pentium 4, especially the Prescott and Cedar Mill core revisions.

<span class="mw-page-title-main">Ball grid array</span> Surface-mount packaging that uses an array of solder balls

A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.

<span class="mw-page-title-main">Slot 1</span> Physical and electrical specification for the connector used by some Intel microprocessors

Slot 1 refers to the physical and electrical specification for the connector used by some of Intel's microprocessors, including the Pentium Pro, Celeron, Pentium II and the Pentium III. Both single and dual processor configurations were implemented.

<span class="mw-page-title-main">Integrated circuit packaging</span> Final stage of semiconductor device fabrication

Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board.

<span class="mw-page-title-main">CPU socket</span> Circuit board-microprocessor connection

In computer hardware, a CPU socket or CPU slot contains one or more mechanical components providing mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows for placing and replacing the central processing unit (CPU) without soldering.

<span class="mw-page-title-main">Socket 8</span>

The Socket 8 CPU socket was used exclusively with the Intel Pentium Pro and Pentium II Overdrive computer processors. Intel discontinued Socket 8 in favor of Slot 1 with the introduction of the Pentium II and Slot 2 with the release of the Pentium II Xeon in 1998.

<span class="mw-page-title-main">Socket 478</span> Processor socket made by Intel

Socket 478, also known as mPGA478 or mPGA478B, is a 478-contact CPU socket used for Intel's Pentium 4 and Celeron series CPUs.

<span class="mw-page-title-main">Socket A</span> CPU socket for old AMD CPUs

Socket A is a zero insertion force pin grid array (PGA) CPU socket used for AMD processors ranging from the Athlon Thunderbird to the Athlon XP/MP 3200+, and AMD budget processors including the Duron and Sempron. Socket A also supports AMD Geode NX embedded processors. It compliments the prior Slot A CPU interface used in some Athlon Thunderbird processors. The front-side bus frequencies supported for the AMD Athlon XP and Sempron are 133 MHz, 166 MHz, and 200 MHz. Socket A supports 32-bit CPUs only.

<span class="mw-page-title-main">Land grid array</span> Type of surface-mount packaging for integrated circuits

The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board.

<span class="mw-page-title-main">LGA 775</span> Intel desktop CPU socket

LGA 775, also known as Socket T, is an Intel desktop CPU socket. Unlike PGA CPU sockets, such as its predecessor Socket 478, LGA 775 has no socket holes; instead, it has 775 protruding pins which touch contact points on the underside of the processor (CPU).

<span class="mw-page-title-main">Quad flat package</span> Surface mount integrated circuit package with "gull wing" pins extending from all sides

A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP).

<span class="mw-page-title-main">Socket 479</span>

Socket 479 (mPGA479M) is a CPU socket used by some Intel microprocessors. It is the socket used by the Pentium M and Celeron M mobile processors normally used in laptops, but has also been used with Tualatin-M Pentium III processors. The official naming by Intel is μFCPGA and μPGA479M.

<span class="mw-page-title-main">Socket 5</span> CPU socket

Socket 5 was created for the second generation of Intel P5 Pentium processors operating at speeds from 75 to 133 MHz as well as certain Pentium OverDrive and Pentium MMX processors with core voltage 3.3 V. It superseded the earlier Socket 4. It was released in March 1994. Consisting of 320 pins, this was the first socket to use a staggered pin grid array, or SPGA, which allowed the chip's pins to be spaced closer together than earlier sockets. Socket 5 was replaced by Socket 7 in 1995.

<span class="mw-page-title-main">Socket 495</span>

Socket 495, also known as μPGA2, is a CPU socket used for the Intel Pentium III and Celeron mobile processors. This socket was also used in Microsoft's Xbox console for the Xbox CPU, albeit in a BGA format. It replaces Socket 615 (μPGA1), which was used in Pentium II and early Celeron mobile processors.

<span class="mw-page-title-main">Intel 850</span>

The Intel 850 chipset was the first chipset available for the Pentium 4 processor, and was simultaneously released in November 2000. It consists of an 82850 memory controller hub and an 82801BA I/O controller hub.

<span class="mw-page-title-main">Chip carrier</span> Surface mount technology package for integrated circuits

In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits. Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large.

Socket G3, also known as rPGA 946B/947 or FCPGA 946, is a socket for Intel microprocessors that supports Haswell-based mobile CPUs. Compatible SKUs have an 'M' suffix in the model number.

References

  1. ↑ Vijay Nath (24 March 2017). Proceedings of the International Conference on Nano-electronics, Circuits & Communication Systems. Springer. p. 304. ISBN   978-981-10-2999-8.
  2. ↑ "Intel Releases New Design for sub-$1,000 PCs". Philippine Daily Inquirer. April 24, 2000.{{cite web}}: Missing or empty |url= (help)
  3. ↑ Robert Bruce Thompson; Barbara Fritchman Thompson (24 July 2003). PC Hardware in a Nutshell: A Desktop Quick Reference. O'Reilly Media, Inc. p. 44. ISBN   978-0-596-55234-3.
  4. ↑ "BGA socket/BGA 소켓". Jsits.com. Retrieved 2015-06-05.
  5. ↑ link (in German) Archived October 1, 2011, at the Wayback Machine
  6. ↑ "Molex Sockets for Servers, Desktops and Notebooks Earn Intel® Validation". Archived from the original on 2019-12-09. Retrieved 2016-03-15.

Sources

This page is based on this Wikipedia article
Text is available under the CC BY-SA 4.0 license; additional terms may apply.
Images, videos and audio are available under their respective licenses.