The TO-92 is a widely used style of semiconductor package mainly used for transistors. The case is often made of epoxy or plastic, and offers compact size at a very low cost.
A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers before being diced into die, tested, and packaged. The package provides a means for connecting the package to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader. There are thousands of package types in use. Some are defined by international, national, or industry standards, while others are particular to an individual manufacturer.
A transistor is a semiconductor device used to amplify or switch electronic signals and electrical power. It is composed of semiconductor material usually with at least three terminals for connection to an external circuit. A voltage or current applied to one pair of the transistor's terminals controls the current through another pair of terminals. Because the controlled (output) power can be higher than the controlling (input) power, a transistor can amplify a signal. Today, some transistors are packaged individually, but many more are found embedded in integrated circuits.
Epoxy is either any of the basic components or the cured end products of epoxy resins, as well as a colloquial name for the epoxide functional group. Epoxy resins, also known as polyepoxides, are a class of reactive prepolymers and polymers which contain epoxide groups. Epoxy resins may be reacted (cross-linked) either with themselves through catalytic homopolymerisation, or with a wide range of co-reactants including polyfunctional amines, acids, phenols, alcohols and thiols. These co-reactants are often referred to as hardeners or curatives, and the cross-linking reaction is commonly referred to as curing. Reaction of polyepoxides with themselves or with polyfunctional hardeners forms a thermosetting polymer, often with favorable mechanical properties and high thermal and chemical resistance. Epoxy has a wide range of applications, including metal coatings, use in electronics/electrical components/LEDs, high tension electrical insulators, paint brush manufacturing, fiber-reinforced plastic materials and structural adhesives. Epoxy is sometimes used as a glue.
The JEDEC TO-92 descriptor is derived from the original full name for the package: Transistor Outline Package, Case Style 92.The package is also known by the designations SOT54 and JEITA SC-43A.
The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body.
The case is molded around the transistor elements in two parts; the face is flat, bearing a machine-printed part number. The back is semi-circularly-shaped. A line of moulding flash from the injection-moulding process can be seen around the case.
The leads protrude from the bottom of the case. When looking at the face of the transistor, the leads are commonly configured from left-to-right as the emitter, base, and collector for 2N series (JEDEC) transistors, however, other configurations are possible, such as emitter, collector, and base commonly used for 2S series (Japanese) transistors.
If the face has a part name made up of only one letter and a few numbers, it is usually assumed to be a Japanese part number (with the base on the end rather than in the center). Thus, "C1234" would likely be a 2SC1234 device.
The leads coming out of the case are spaced 0.05" (1.27 mm) apart. It is often convenient to bend them outward to a 0.10" (2.54 mm) spacing to make more room for wiring. Units with their leads pre-bent may be ordered to fit specific board layouts, depending on the application. Otherwise, the leads may be bent manually; however, care must be taken as they can break easily, as with any other device that is manually configured.
The physical dimensions of the TO-92 housing may vary sightly depending of the manufacturer, however, the 1.27mm lead spacing must be respected.
The main disadvantage of this style of case is the lack of heat sinking.
A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature at optimal levels. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.
The TO-220 is a style of electronic package used for high-powered, through-hole components. The "TO" designation stands for "transistor outline". TO-220 packages have three leads. Similar packages with two, four, five or seven leads are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink, allowing the component to dissipate more heat than one constructed in a TO-92 case. Common TO-220-packaged components include discrete semiconductors such as transistors and silicon-controlled rectifiers, as well as integrated circuits.
Although TO-92 devices are mainly used in low-voltage / low-current (<30 V; <1 A) applications, high-voltage (600 Volt Vce) and high-current (5 A Ic) devices are available. Nominal maximum power dissipation is less than one watt (600 mW).
A bipolar junction transistor is a type of transistor that uses both electron and hole charge carriers. In contrast, unipolar transistors, such as field-effect transistors, only use one kind of charge carrier. For their operation, BJTs use two junctions between two semiconductor types, n-type and p-type.
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In industry, it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board, with the through-hole technology used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.
TRIAC, from triode for alternating current, is a generic trademark for a three terminal electronic component that conducts current in either direction when triggered. Its formal name is bidirectional triode thyristor or bilateral triode thyristor. A thyristor is analogous to a relay in that a small voltage induced current can control a much larger voltage and current. The illustration on the right shows the circuit symbol for a TRIAC where A1 is Anode 1, A2 is Anode 2, and G is Gate. Anode 1 and Anode 2 are normally termed Main Terminal 1 (MT1) and Main Terminal 2 (MT2) respectively.
Pro Electron or EECA is the European type designation and registration system for active components.
Almost all integrated circuits (ICs) have at least two pins that connect to the power rails of the circuit in which they are installed. These are known as the power-supply pins. However, the labeling of the pins varies by IC family and manufacturer.
An electronic component is any basic discrete device or physical entity in an electronic system used to affect electrons or their associated fields. Electronic components are mostly industrial products, available in a singular form and are not to be confused with electrical elements, which are conceptual abstractions representing idealized electronic components.
Crossover distortion is a type of distortion which is caused by switching between devices driving a load, most often when the devices are matched. It is most commonly seen in complementary, or "push-pull", Class-B amplifier stages, although it is occasionally seen in other types of circuits as well.
The 2N3055 is a silicon NPN power transistor intended for general purpose applications. It was introduced in the early 1960s by RCA using a hometaxial power transistor process, transitioned to an epitaxial base in the mid-1970s. Its numbering follows the JEDEC standard. It is a transistor type of enduring popularity.
In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits. TO stands for "Transistor Outline" and relates to a series of technical drawings produced by JEDEC.
The 2N3904 is a common NPN bipolar junction transistor used for general-purpose low-power amplifying or switching applications. The type was registered by Motorola Semiconductor in the mid-1960s, together with the complementary PNP type 2N3906, and represented a significant performance/cost improvement, with the plastic TO-92 case replacing metal cans. It is designed for low current and power, medium voltage, and can operate at moderately high speeds. This transistor is low-cost, widely available and sufficiently robust to be of use by experimenters and electronics hobbyists. When looking at the flat side with the leads pointed downward, the three wires emerging from the bottom are connected to, from left to right, the emitter, the base and the collector. Some manufacturers mark "EBC" on the molded part, but all are required to have those connections for a part which is a "2N3904".
The 2N2222 is a common NPN bipolar junction transistor (BJT) used for general purpose low-power amplifying or switching applications. It is designed for low to medium current, low power, medium voltage, and can operate at moderately high speeds. It was originally made in the TO-18 metal can as shown in the picture.
The 2N2907 is a commonly available PNP bipolar junction transistor used for general purpose low-power amplifying or switching applications. It is designed for low to medium current, low power, medium voltage, and can operate at moderately high speeds. This transistor was made by several manufacturers; Texas Instruments released a data sheet for their version of this part dated March 1973. An "A" suffix indicates a slightly higher breakdown voltage. These transistors have an enduring popularity with electronics hobbyists.
The 2N7000 and BS170 are two different N-channel, enhancement-mode MOSFETs used for low-power switching applications, with different lead arrangements and current ratings. They are sometimes listed together on the same datasheet with other variants 2N7002, VQ1000J, and VQ1000P.
The BC548 is a general-purpose NPN bipolar junction transistor commonly used in European and American electronic equipment. It is notably often the first type of bipolar transistor hobbyists encounter and is often featured in designs in hobby electronics magazines where a general-purpose transistor is required. The BC548 is low in cost and widely available.
In electronics, TO-18 is a designation for a style of transistor metal case. The case is more expensive than the similarly sized plastic TO-92 package. The name is from JEDEC, signifying Transistor Outline Package, Case Style 18.
A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. The most common SOT are SOT23 variations, also manufacturers offer the nearly identical thin small outline transistor (TSOT) package, where lower height is important.
The field-effect transistor (FET) is an electronic device which uses an electric field to control the flow of current. This is achieved by the application of a voltage to the gate terminal, which in turn alters the conductivity between the drain and source terminals.
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