Small Outline Diode

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SOD-123 package SOD-123 diode.jpg
SOD-123 package

Small Outline Diode (SOD) is a designation for a group of semiconductor packages for surface mounted diodes. The standard includes multiple variants such as SOD-123, SOD-323, SOD-523 and SOD-923. [1] SOD-123 is the largest, SOD-923 is the smallest.

A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers before being diced into die, tested, and packaged. The package provides a means for connecting the package to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader. There are thousands of package types in use. Some are defined by international, national, or industry standards, while others are particular to an individual manufacturer.

Surface-mount technology method for producing electronic circuits

Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In industry, it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board, with the through-hole technology used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.

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Sod is grass and the part of the soil beneath it held together by the roots.

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DO-214 is a standard that specifies a group of semiconductor packages for surface mounted diodes.


  1. "Package Outline Dimensions—Suggested Pad Layout" (PDF). Diodes Incorporated. pp. 171–177. Archived from the original (PDF) on 24 April 2015. Retrieved 13 June 2016.