TO-5

Last updated
Operational amplifier in a TO-5 package, viewed from above. 741 op-amp in TO-5 metal can package close-up.jpg
Operational amplifier in a TO-5 package, viewed from above.
Gear-shaped heat sinks for TO-5 packages. TO-5 Heatsinks.jpg
Gear-shaped heat sinks for TO-5 packages.

In electronics, TO-5 is a designation for a standardized metal semiconductor package used for transistors and some integrated circuits. The TO element stands for "transistor outline" and refers to a series of technical drawings produced by JEDEC. [1]

A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers before being diced into die, tested, and packaged. The package provides a means for connecting the package to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader. There are thousands of package types in use. Some are defined by international, national, or industry standards, while others are particular to an individual manufacturer.

JEDEC standards organization

The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body.

The typical TO-5 package has a base diameter of 8.9 mm (0.35 in), a cap diameter of 8.1 mm (0.32 in), a cap height of 6.3 mm (0.25 in) [2] . There exist variants with from 2 up to 10 pins. The pins are isolated from the package by individual glass-metal seals, or by a single resin potting. Sometimes one pin is connected directly to the metal case.

There are multiple variants that differ from the regular 3-pin configuration. The H06C variant with 6 pins has its marker between pin 1 and 6, and H08A has 8 pins with the marker on the last one. The counting order is clockwise from the bottom perspective. [3]

Related Research Articles

Integrated circuit electronic circuit manufactured by lithography; set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon

An integrated circuit or monolithic integrated circuit is a set of electronic circuits on one small flat piece of semiconductor material that is normally silicon. The integration of large numbers of tiny transistors into a small chip results in circuits that are orders of magnitude smaller, cheaper, and faster than those constructed of discrete electronic components. The IC's mass production capability, reliability and building-block approach to circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs.

Transistor semiconductor device used to amplify and switch electronic signals and electrical power

A transistor is a semiconductor device used to amplify or switch electronic signals and electrical power. It is composed of semiconductor material usually with at least three terminals for connection to an external circuit. A voltage or current applied to one pair of the transistor's terminals controls the current through another pair of terminals. Because the controlled (output) power can be higher than the controlling (input) power, a transistor can amplify a signal. Today, some transistors are packaged individually, but many more are found embedded in integrated circuits.

Dual in-line package

In microelectronics, a dual in-line package, or dual in-line pin package (DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads ; eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density packages. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages.

DIMM computer memory module that have separate electrical contacts on each side of the module and a 64-bit data path

A DIMM or dual in-line memory module comprises a series of dynamic random-access memory integrated circuits. These modules are mounted on a printed circuit board and designed for use in personal computers, workstations and servers. DIMMs began to replace SIMMs as the predominant type of memory module as Intel P5-based Pentium processors began to gain market share.

Surface-mount technology method for producing electronic circuits

Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In industry, it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board, with the through-hole technology used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.

555 timer IC

The 555 timer IC is an integrated circuit (chip) used in a variety of timer, pulse generation, and oscillator applications. The 555 can be used to provide time delays, as an oscillator, and as a flip-flop element. Derivatives provide two (556) or four (558) timing circuits in one package.

SO-DIMM

A SO-DIMM, SODIMM, or small outline dual in-line memory module, is a type of computer memory built using integrated circuits. SO-DIMMs are a smaller alternative to a DIMM, being roughly half the size of regular DIMMs.

Tube socket Electrical connection part of electronic tubes

Tube sockets are electrical sockets into which vacuum tubes can be plugged, holding them in place and providing terminals, which can be soldered into the circuit, for each of the pins. Sockets are designed to allow tubes to be inserted in only one orientation. They were used in most tube electronic equipment to allow easy removal and replacement. When tube equipment was common, retailers such as drug stores had vacuum tube testers, and sold replacement tubes. Some Nixie tubes were also designed to use sockets.

Small Outline Integrated Circuit

A Small Outline Integrated Circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins. For example, a 14-pin 4011 would be housed in an SOIC-14 or SO-14 package.

TO-92

The TO-92 is a widely used style of semiconductor package mainly used for transistors. The case is often made of epoxy or plastic, and offers compact size at a very low cost.

TO-220

The TO-220 is a style of electronic package used for high-powered, through-hole components. The "TO" designation stands for "transistor outline". TO-220 packages have three leads. Similar packages with two, four, five or seven leads are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink, allowing the component to dissipate more heat than one constructed in a TO-92 case. Common TO-220-packaged components include discrete semiconductors such as transistors and silicon-controlled rectifiers, as well as integrated circuits.

TO-3

In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits. TO stands for "Transistor Outline" and relates to a series of technical drawings produced by JEDEC.

2N2222

The 2N2222 is a common NPN bipolar junction transistor (BJT) used for general purpose low-power amplifying or switching applications. It is designed for low to medium current, low power, medium voltage, and can operate at moderately high speeds. It was originally made in the TO-18 metal can as shown in the picture.

Double Data Rate 4 Synchronous Dynamic Random-Access Memory, officially abbreviated as DDR4 SDRAM, is a type of synchronous dynamic random-access memory with a high bandwidth interface.

BC548 general-purpose NPN bipolar junction transistor

The BC548 is a general-purpose NPN bipolar junction transistor commonly used in European and American electronic equipment. It is notably often the first type of bipolar transistor hobbyists encounter and is often featured in designs in hobby electronics magazines where a general-purpose transistor is required. The BC548 is low in cost and widely available.

In electronics, TO-18 is a designation for a style of transistor metal case. The case is more expensive than the similarly sized plastic TO-92 package. The name is from JEDEC, signifying Transistor Outline Package, Case Style 18.

Chip carrier one of several kinds of surface mount technology packages for integrated circuits

In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits. Connections are made on all four edges of a square package; Compared to the internal cavity for mounting the integrated circuit, the package overall size is large.

Small-outline transistor

A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. The most common SOT are SOT23 variations, also manufacturers offer the nearly identical thin small outline transistor (TSOT) package, where lower height is important.

TO-126

TO-126 is a type of semiconductor package for devices with three pins, such as transistors. The package is rectangular with a hole in the middle to allow for easy mounting to a board or a heat sink.

References

  1. "JEDEC TO-5 package specification" (PDF). JEDEC . Archived from the original (PDF) on June 18, 2017.
  2. TO-5 package at siliconfareast, retrieved 14 December 2013
  3. Metal Can Packages at ronja.twibright.com/datasheets/, retrieved 30 December 2013