TO-66

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GD241 PNP transistor in a TO-66 package. GD241 Transistor.jpg
GD241 PNP transistor in a TO-66 package.

TO-66 is a type of semiconductor package for devices with three pins, such as transistors. The shape is similar to the TO-3 package, but the size is smaller. [1] The TO-66 package is made entirely of metal and is commonly used by silicon controlled rectifiers and power transistors. [2]

A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers before being diced into die, tested, and packaged. The package provides a means for connecting the package to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader. There are thousands of package types in use. Some are defined by international, national, or industry standards, while others are particular to an individual manufacturer.

TO-3

In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits. TO stands for "Transistor Outline" and relates to a series of technical drawings produced by JEDEC.

Silicon controlled rectifier semiconductor electronic device with three p-n junctions, mainly used in devices where the control of high power is demanded

A silicon controlled rectifier or semiconductor controlled rectifier is a four-layer solid-state current-controlling device. The principle of four-layer p–n–p–n switching was developed by Moll, Tanenbaum, Goldey and Holonyak of Bell Laboratories in 1956. The practical demonstration of silicon controlled switching and detailed theoretical behavior of a device in agreement with the experimental results was presented by Dr Ian M. Mackintosh of Bell Laboratories in January 1958. The name "silicon controlled rectifier" is General Electric's trade name for a type of thyristor. The SCR was developed by a team of power engineers led by Gordon Hall and commercialized by Frank W. "Bill" Gutzwiller in 1957.

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Transistor Basic electronics component

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A power semiconductor device is a semiconductor device used as a switch or rectifier in power electronics. Such a device is also called a power device or, when used in an integrated circuit, a power IC.

TO-92

The TO-92 is a widely used style of semiconductor package mainly used for transistors. The case is often made of epoxy or plastic, and offers compact size at a very low cost.

TO-220

The TO-220 is a style of electronic package used for high-powered, through-hole components with 0.1 inches (2.54 mm) pin spacing. The "TO" designation stands for "transistor outline". TO-220 packages have three leads. Similar packages with two, four, five or seven leads are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink, allowing the component to dissipate more heat than one constructed in a TO-92 case. Common TO-220-packaged components include discrete semiconductors such as transistors and silicon-controlled rectifiers, as well as integrated circuits.

2N3055 bipolar power transistor

The 2N3055 is a silicon NPN power transistor intended for general purpose applications. It was introduced in the early 1960s by RCA using a hometaxial power transistor process, transitioned to an epitaxial base in the mid-1970s. Its numbering follows the JEDEC standard. It is a transistor type of enduring popularity.

Transistor count the number of transistors in a device

The transistor count is the number of transistors on an integrated circuit (IC). It typically refers to the number of MOSFETs on an IC chip, as all modern ICs use MOSFETs. It is the most common measure of IC complexity. The rate at which MOS transistor counts have increased generally follows Moore's law, which observed that the transistor count doubles approximately every two years.

Texas Instruments Power, known more popularly by its acronym TIP, is a series of bipolar junction transistors manufactured by Texas Instruments. The series was introduced in the 1960s, and still sees some use today due to their simplicity, their durability, and their ease of use. A Texas Instruments catalog in 1966 lists the TIP04 and TIP14 part numbers.

A diffused junction transistor is a transistor formed by diffusing dopants into a semiconductor substrate. The diffusion process was developed later than the alloy junction and grown junction processes for making BJTs.

TO-18 style of transistor metal case

In electronics, TO-18 is a designation for a style of transistor metal case. The case is more expensive than the similarly sized plastic TO-92 package. The name is from JEDEC, signifying Transistor Outline Package, Case Style 18.

TO-263

The D2PAK or DDPAK, standardized as TO-263, refers to a semiconductor package type intended for surface mounting on circuit boards. They are similar to the earlier TO-220-style packages intended for high power dissipation but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package. As with all SMT packages, the pins on a D2PAK are bent to lie against the PCB surface.

TO-5 designation for a standardized metal semiconductor package

In electronics, TO-5 is a designation for a standardized metal semiconductor package used for transistors and some integrated circuits. The TO element stands for "transistor outline" and refers to a series of technical drawings produced by JEDEC.

TO-126

TO-126 is a type of semiconductor package for devices with three pins, such as transistors. The package is rectangular with a hole in the middle to allow for easy mounting to a board or a heat sink.

References

  1. TO-66 package details (PDF), Central Semiconductor Corp., 2008, retrieved 2013-12-09
  2. "TO-66 Package". EESemi.com. Retrieved 8 February 2019.