TO-252, also known as DPAKor Decawat Package, is a semiconductor package for surface mounting on circuit boards . It represents a surface-mount variant of TO-251 package, and smaller variant of the D2PAK package. It is often used for high-power MOSFETs and voltage regulators.
A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers before being diced into die, tested, and packaged. The package provides a means for connecting the package to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader. There are thousands of package types in use. Some are defined by international, national, or industry standards, while others are particular to an individual manufacturer.
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In industry, it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board, with the through-hole technology used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.
A printed circuit board (PCB) mechanically supports and electrically connects electronic components or electrical components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.
Package can have 3 pins with 90 mils (2.3 mm) pitch or 5 pins with 45 mils (1.1 mm) pitch.
A thousandth of an inch is a derived unit of length in an inch-based system of units. Equal to 1⁄1000 of an inch, it is normally referred to as a thou, a thousandth, or a mil.
An integrated circuit or monolithic integrated circuit is a set of electronic circuits on one small flat piece of semiconductor material that is normally silicon. The integration of large numbers of tiny transistors into a small chip results in circuits that are orders of magnitude smaller, cheaper, and faster than those constructed of discrete electronic components. The IC's mass production capability, reliability and building-block approach to circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs.
The MOS Technology 6502 is an 8-bit microprocessor that was designed by a small team led by Chuck Peddle for MOS Technology. When it was introduced in 1975, the 6502 was, by a considerable margin, the least expensive microprocessor on the market. It initially sold for less than one-sixth the cost of competing designs from larger companies, such as Motorola and Intel, and caused rapid decreases in pricing across the entire processor market. Along with the Zilog Z80, it sparked a series of projects that resulted in the home computer revolution of the early 1980s.
Semiconductor device fabrication is the process used to create the integrated circuits that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photolithographic and chemical processing steps during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
In microelectronics, a dual in-line package, or dual in-line pin package (DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads ; eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density packages. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages.
A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
A pin grid array, often abbreviated PGA, is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package.
The 7400 series of transistor–transistor logic (TTL) integrated circuits are the most popular family of TTL integrated circuit logic. Quickly replacing diode–transistor logic, it was used to build the mini and mainframe computers of the 1960s and 1970s. Several generations of pin-compatible descendants of the original family have since become de facto standard electronic components.
The 555 timer IC is an integrated circuit (chip) used in a variety of timer, pulse generation, and oscillator applications. The 555 can be used to provide time delays, as an oscillator, and as a flip-flop element. Derivatives provide two (556) or four (558) timing circuits in one package.
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board.
A QFP or Quad Flat Package is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP).
The LAV-25 is an eight-wheeled amphibious armored reconnaissance vehicle used by the United States Marine Corps, United States Army, and the Canadian Army. It was built by General Dynamics Land Systems Canada, developed from the Canadian built AVGP versions of the Swiss MOWAG Piranha 6x6 family of armored fighting vehicles.
A Small Outline Integrated Circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins. For example, a 14-pin 4011 would be housed in an SOIC-14 or SO-14 package.
The TO-220 is a style of electronic package used for high-powered, through-hole components. The "TO" designation stands for "transistor outline". TO-220 packages have three leads. Similar packages with two, four, five or seven leads are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink, allowing the component to dissipate more heat than one constructed in a TO-92 case. Common TO-220-packaged components include discrete semiconductors such as transistors and silicon-controlled rectifiers, as well as integrated circuits.
The U880 is an 8-bit microprocessor that was manufactured by VEB Mikroelektronik "Karl Marx" Erfurt in the German Democratic Republic. Production of the U880 started in 1980 at VEB Funkwerk Erfurt. The U880 is an unlicensed clone of the Zilog Z80 microprocessor. It is not, however, a direct copy of the Zilog's Z80. Differences include not setting the CY flag for the
OUTI command and a different behaviour of a hidden bus register seen through the undocumented F3 and F5 flags.
The D2PAK or DDPAK, standardized as TO-263, refers to a semiconductor package type intended for surface mounting on circuit boards. They are similar to the earlier TO-220-style packages intended for high power dissipation but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package. As with all SMT packages, the pins on a D2PAK are bent to lie against the PCB surface.
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits. Connections are made on all four edges of a square package; Compared to the internal cavity for mounting the integrated circuit, the package overall size is large.
In electronics, TO-5 is a designation for a standardized metal semiconductor package used for transistors and some integrated circuits. The TO element stands for "transistor outline" and refers to a series of technical drawings produced by JEDEC.
ON Semiconductor is a Fortune 500 semiconductors supplier company. Products include power and signal management, logic, discrete, and custom devices for automotive, communications, computing, consumer, industrial, LED lighting, medical, military/aerospace and power applications. ON Semiconductor runs a network of manufacturing facilities, sales offices and design centers in North America, Europe, and the Asia Pacific regions. Headquartered in Phoenix, Arizona, ON Semiconductor has revenues of $3.907 billion (2016), which puts it among the worldwide top 20 semiconductor sales leaders.
Amkor Technology, Inc. is a semiconductor product packaging and test services provider. The company has been headquartered in Tempe, Arizona, since 2005, when it was moved from West Chester, Pennsylvania, United States. The company was founded in 1969 and, as of 2017, had approximately 29,300 employees worldwide and a reported $4.19 billion in sales.