TO-252

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Power MOSFET (Advanced Power Electronics 9870GH) Cisco EPC3212 - Advanced Power Electronics 9870GH-8781.jpg
Power MOSFET (Advanced Power Electronics 9870GH)

TO-252, also known as DPAK [1] or Decawat Package, is a semiconductor package for surface mounting on circuit boards [2] . It represents a surface-mount [3] variant of TO-251 package, and smaller variant of the D2PAK package. It is often used for high-power MOSFETs and voltage regulators.

A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers before being diced into die, tested, and packaged. The package provides a means for connecting the package to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader. There are thousands of package types in use. Some are defined by international, national, or industry standards, while others are particular to an individual manufacturer.

Surface-mount technology method for producing electronic circuits

Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In industry, it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board, with the through-hole technology used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.

Printed circuit board board to support and connect electronic components

A printed circuit board (PCB) mechanically supports and electrically connects electronic components or electrical components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.

Contents

Variants

Variant with 5 pins: a dual input dropout regulator (Globaltech GS1581D) Yakumo Notebook 536S - Globaltech GS1581D-7142.jpg
Variant with 5 pins: a dual input dropout regulator (Globaltech GS1581D)

Package can have 3 pins with 90 mils (2.3 mm) pitch or 5 pins with 45 mils (1.1 mm) pitch.

A thousandth of an inch is a derived unit of length in an inch-based system of units. Equal to ​11000 of an inch, it is normally referred to as a thou, a thousandth, or a mil.

See also

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Dual in-line package

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TO-220

The TO-220 is a style of electronic package used for high-powered, through-hole components. The "TO" designation stands for "transistor outline". TO-220 packages have three leads. Similar packages with two, four, five or seven leads are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink, allowing the component to dissipate more heat than one constructed in a TO-92 case. Common TO-220-packaged components include discrete semiconductors such as transistors and silicon-controlled rectifiers, as well as integrated circuits.

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TO-263

The D2PAK or DDPAK, standardized as TO-263, refers to a semiconductor package type intended for surface mounting on circuit boards. They are similar to the earlier TO-220-style packages intended for high power dissipation but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package. As with all SMT packages, the pins on a D2PAK are bent to lie against the PCB surface.

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References

  1. Prasad, Ray (2013-11-27). Surface Mount Technology: Principles and Practice. Springer Science & Business Media. pp. 113–. ISBN   9781461540847 . Retrieved 23 June 2017.
  2. "DPAK – Discrete or Decawatt Package". eesemi.com. Retrieved 15 May 2017.
  3. Hinch, Stephen W. (1988-01-01). Handbook of Surface Mount Technology. Longman Scientific & Technical. ISBN   9780470210949 . Retrieved 23 June 2017.
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Amkor Technology a semiconductor product packaging and test services provider

Amkor Technology, Inc. is a semiconductor product packaging and test services provider. The company has been headquartered in Tempe, Arizona, since 2005, when it was moved from West Chester, Pennsylvania, United States. The company was founded in 1969 and, as of 2017, had approximately 29,300 employees worldwide and a reported $4.19 billion in sales.