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JEDEC Solid State Technology Association
JEDEC Logo.svg
Formation1958 (1944)
TypeStandards Organization
Legal statusActive
Official language

The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body.


JEDEC has over 300 members, including some of the world's largest computer companies. Its scope and past activities includes standardization of part numbers, defining an electrostatic discharge (ESD) standard, and leadership in the lead-free manufacturing transition. [1]

The origin of JEDEC traces back to 1944, when RMA (subsequently renamed EIA) and NEMA established the Joint Electron Tube Engineering Council (JETEC) to coordinate vacuum tube type numberings.

In 1958, with the advent of semiconductor technology, the joint JETEC-activity of EIA and NEMA was renamed into Joint Electron Device Engineering Council. [1] NEMA discontinued its involvement in 1979. In the fall of 1999, JEDEC became a separate trade association under the current name, but maintained an EIA alliance, until EIA ceased operations in 2011.


An early 1950s transistor using the precursor to the EIA/JEDEC part numbering system. Sylvania 2N34 Transistor.jpg
An early 1950s transistor using the precursor to the EIA/JEDEC part numbering system.

The origin of JEDEC can be traced back to 1944, when the Radio Manufacturers Association (RMA), and the National Electrical Manufacturers Association (NEMA) established the Joint Electron Tube Engineering Council ( JETEC ) to coordinate vacuum tube type numberings. The expansion of the radio industry caused JETEC to expand its scope to include solid state devices and develop standards for semiconductor devices. Eventually, the joint JETEC activity of EIA and NEMA was renamed into Joint Electron Device Engineering Council (JEDEC) in 1958. [2]

[1] NEMA discontinued its involvement in 1979.

The early work began as a part numbering system for devices which became popular in the 1960s. The first semiconductor devices, such as the 1N23 silicon point contact diode, were still designated in the old RMA tube designation system, where the "1" stood for "No filament/heater" and the "N" stood for "crystal rectifier". The first RMA digit thus was re-allocated from "heater power" to "p-n junction count" to form the new EIA/JEDEC EIA-370 standard; for example, the 1N4001 rectifier diode and 2N2222 transistor part numbers came from EIA-370. They are still popular today. In February 1982, JEDEC issued JESD370B, superseding the original EIA-370 and introducing a new letter symbol "C" that denotes the die version, as opposed to "N", now meaning the packaged version. The Japanese JIS semiconductor designation system employs a similar pattern. JEDEC later developed a numbering system for integrated circuits, but this did not gain acceptance in the semiconductor industry. The European Pro Electron semiconductor numbering system originated in a similar way from the older Mullard–Philips tube designation.

Earlier in the 20th century, the organization was known as JETEC, the Joint Electron Tube Engineering Council, and was responsible for assigning and coordinating RETMA tube designations to electron tubes (also called valves). The type 6L6, still to be found in electric-guitar amplifiers, typically has a type number that was assigned by JETEC.

In the fall of 1999, JEDEC became a separate trade association under the current name, but maintained an EIA alliance.

Test methods and product standards

This early work was followed by a number of test methods, JESD22, and product standards. For example, the ESD caution symbol, which is the hand with the line drawn through it, was published by JEDEC and is used worldwide. JEDEC also has a dictionary of semiconductor terms. All of JEDEC standards are free on the Web for downloading after a free registration.

JEDEC has issued widely used standards for device interfaces, such as the JEDEC memory standards for computer memory (RAM), including the DDR SDRAM standards.

Semiconductor package drawings

JEDEC also developed a number of popular package drawings for semiconductors such as TO-3, TO-5, etc. These are on the web under JEP-95. One hot issue is the development of lead-free packages that do not suffer from the tin whiskers problem that reappeared since the recent ban on lead content. JEDEC is working with iNemi on a joint interest group on lead-free issues.


As of 2019, JEDEC has 301 members in total. Among them are large companies, which include the following. [3]

Industry standards

JEDEC's adoption of open industry standards (i.e., standards that permit any and all interested companies to freely manufacture in compliance with adopted standards) serves several vital functions for the advancement of electronic technologies. First and foremost, such standards allow for interoperability between different electrical components. JEDEC standards do not protect members from normal patent obligations. The designated representatives of JEDEC member companies are required to disclose patents and patent applications of which they personally are aware (assuming that this information is not considered proprietary). JEDEC patent policy requires that standards found to contain patents whose owners will not sign a standard JEDEC patent letter be withdrawn. Thus the penalty for a failure to disclose patents is retraction of the standard. Typically, standards will not be adopted to cover technology that will be subject to patent protection. In rare circumstances, standards covered by a patent may be adopted, but only on the understanding that the patent owner will not enforce such patent rights or, at a minimum, that the patent owner will provide a reasonable and non-discriminatory license to the patented technology. [4]

Related Research Articles

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Transistor Basic electronics component

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Pro Electron or EECA is the European type designation and registration system for active components.

The Common Flash Memory Interface (CFI) is an open standard jointly developed by AMD, Intel, Sharp and Fujitsu. It is implementable by all flash memory vendors, and has been approved by the non-volatile-memory subcommittee of JEDEC. The goal of the specification is the interchangeability of flash memory devices offered by different vendors. The developer is able to use one driver for different flash products by reading identifying information from the flash chip.


The TO-220 is a style of electronic package used for high-powered, through-hole components with 0.1 inches (2.54 mm) pin spacing. The "TO" designation stands for "transistor outline". TO-220 packages have three leads. Similar packages with two, four, five or seven leads are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink, allowing the component to dissipate more heat than one constructed in a TO-92 case. Common TO-220-packaged components include discrete semiconductors such as transistors and silicon-controlled rectifiers, as well as integrated circuits.

Humidity indicator card

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In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits. TO stands for "Transistor Outline" and relates to a series of technical drawings produced by JEDEC.

The JEDEC memory standards are the specifications for semiconductor memory circuits and similar storage devices promulgated by the Joint Electron Device Engineering Council (JEDEC) Solid State Technology Association, a semiconductor trade and engineering standardization organization.

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LPDDR computer hardware

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A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers before being diced into die, tested, and packaged. The package provides a means for connecting the package to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader. There are thousands of package types in use. Some are defined by international, national, or industry standards, while others are particular to an individual manufacturer.

1N400x general-purpose diodes

The 1N400x series is a family of popular 1 A general-purpose silicon rectifier diodes commonly used in AC adapters for common household appliances. Its blocking voltage varies from 50 volts (1N4001) to 1000 volts (1N4007). This JEDEC device number series is available in the DO-41 axial package, and similar diodes are available in SMA and MELF surface mount packages.


DO-204 is a family of diode semiconductor packages defined by JEDEC. This family comprises lead-mounted axial devices with round leads. Generally a diode will have a line painted near the cathode end.

Vladimír Székely Hungarian physicist

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Japanese Industrial Standards (JIS) has standard JIS-C-7012 for semiconductor part numbers. The first digit denotes the p-n junction count ; then follows the letter "S", then:


  1. 1 2 3
  2. "JEDEC History". JEDEC. Retrieved 1 May 2017.
  3. "Member List | JEDEC". Retrieved 2019-05-21.
  4. "§8.2 of the JEDEC Manual of Organization and Procedure (JM21-M)" (PDF). JEDEC Solid State Technology Association. July 2002. Archived from the original (PDF) on 2006-03-08.