Compression Attached Memory Module (CAMM) is a memory module form factor which uses a land grid array, and developed at Dell by engineer Tom Schnell as a replacement for DIMMs and SO-DIMMs which use edge connectors and had been in use for about 25 years. [1] The first SO-DIMMs were introduced by JEDEC in 1997. [2] [3] [4] [5]
CAMM was created to overcome technical limitations of traditional slotted DIMM. [6] The CAMM module allows for shorter traces on the motherboard PCB as compared to SO-DIMM, allowing the memory to be run with less power and at higher speeds. The memory module is pressed and held in place against a bar with land grid array pin contacts which connect to the motherboard.
Advantages of CAMM include lower thickness, allows for replaceable LPDDR modules, faster speeds above 6400 MT/s, higher capacities up to 128 GB per module and higher memory bandwidth. Disadvantages are that it cannot be mounted without tools and uses screws. Systems with CAMM memory already installed cannot be expanded through adding additional CAMM modules in the same way that 2 DIMMs can be added alongside 2 existing DIMMs to expand total system memory. Instead, the entire CAMM module must be replaced with one with a higher capacity. So CAMM may be of benefit for laptops and ITX systems.
The total number of interface contact points of CAMM is 616 (44 per row times 14 rows). [7]
In April 2022, Dell launched laptops in the Dell Precision 7000-series that used a custom form factor of CAMM for DDR5 SDRAM. [8]
In June 2023, ADATA demoed an updated design CAMM memory module, [9] which looks different (and more compact) than Dell's 2022 design.
The Compression Attached Memory Module specification was finalised and published by JEDEC as CAMM2 on December 5, 2023. [10]
The first computer, and laptop, to use CAMM2 memory modules is the Lenovo ThinkPad P1 Gen 7 released in April 2024. [11] [12] [13]
In May 2024, MSI announced the first desktop consumer motherboard with CAMM2 support, the Z790 Project Zero Plus. [14]
Double Data Rate Synchronous Dynamic Random-Access Memory is a double data rate (DDR) synchronous dynamic random-access memory (SDRAM) class of memory integrated circuits used in computers. DDR SDRAM, also retroactively called DDR1 SDRAM, has been superseded by DDR2 SDRAM, DDR3 SDRAM, DDR4 SDRAM and DDR5 SDRAM. None of its successors are forward or backward compatible with DDR1 SDRAM, meaning DDR2, DDR3, DDR4 and DDR5 memory modules will not work on DDR1-equipped motherboards, and vice versa.
A DIMM is a popular type of memory module used in computers. It is a printed circuit board with one or both sides holding DRAM chips and pins. The vast majority of DIMMs are manufactured in compliance with JEDEC memory standards, although there are proprietary DIMMs. DIMMs come in a variety of speeds and capacities, and are generally one of two lengths: PC, which are 133.35 mm (5.25 in), and laptop (SO-DIMM), which are about half the length at 67.60 mm (2.66 in).
A SIMM is a type of memory module used in computers from the early 1980s to the early 2000s. It is a printed circuit board on which has random-access memory attached to one or both sides. It differs from a dual in-line memory module (DIMM), the most predominant form of memory module since the late 1990s, in that the contacts on a SIMM are redundant on both sides of the module. SIMMs were standardised under the JEDEC JESD-21C standard.
Double Data Rate 2 Synchronous Dynamic Random-Access Memory is a double data rate (DDR) synchronous dynamic random-access memory (SDRAM) interface. It is a JEDEC standard (JESD79-2); first published in September 2003. DDR2 succeeded the original DDR SDRAM specification, and was itself succeeded by DDR3 SDRAM in 2007. DDR2 DIMMs are neither forward compatible with DDR3 nor backward compatible with DDR.
In computing, double data rate (DDR) describes a computer bus that transfers data on both the rising and falling edges of the clock signal and hence doubles the memory bandwidth by transferring data twice per clock cycle. This is also known as double pumped, dual-pumped, and double transition. The term toggle mode is used in the context of NAND flash memory.
In the fields of digital electronics and computer hardware, multi-channel memory architecture is a technology that increases the data transfer rate between the DRAM memory and the memory controller by adding more channels of communication between them. Theoretically, this multiplies the data rate by exactly the number of channels present. Dual-channel memory employs two channels. The technique goes back as far as the 1960s having been used in IBM System/360 Model 91 and in CDC 6600.
In computing, serial presence detect (SPD) is a standardized way to automatically access information about a memory module. Earlier 72-pin SIMMs included five pins that provided five bits of parallel presence detect (PPD) data, but the 168-pin DIMM standard changed to a serial presence detect to encode more information.
Double Data Rate 3 Synchronous Dynamic Random-Access Memory is a type of synchronous dynamic random-access memory (SDRAM) with a high bandwidth interface, and has been in use since 2007. It is the higher-speed successor to DDR and DDR2 and predecessor to DDR4 synchronous dynamic random-access memory (SDRAM) chips. DDR3 SDRAM is neither forward nor backward compatible with any earlier type of random-access memory (RAM) because of different signaling voltages, timings, and other factors.
In computing, a memory module or RAM stick is a printed circuit board on which memory integrated circuits are mounted.
Double Data Rate 4 Synchronous Dynamic Random-Access Memory is a type of synchronous dynamic random-access memory with a high bandwidth interface.
The ThinkPad T series is a line of notebook computers manufactured by Lenovo as part of the ThinkPad family. The T series is officially the flagship ThinkPad product, offering high-performance computers aimed at businesses and professionals. The ThinkPad X series was originally introduced in 2000 and was produced by IBM until 2005.
The ThinkPad W series laptops from Lenovo were described by the manufacturer as being "mobile workstations", and suit that description by being physically on the larger side of the laptop spectrum, with screens ranging from 15.6" to 17.3" in size. Most W series laptops offered high-end quad-core Intel Core processors with an integrated GPU as well as an Nvidia Quadro discrete GPU, utilizing Nvidia Optimus to switch between the two GPUs as required. Notable exceptions are the W500, which has ATI Mobility FireGL integrated workstation-class graphics, and the W550s, which is an Ultrabook-specification laptop with only a dual-core processor. The W series laptops offered independent software vendor (ISV) certifications from various vendors such as Adobe Systems and Autodesk for computer-aided design (CAD) and 3D modeling software.
A NVDIMM or non-volatile DIMM is a type of persistent random-access memory for computers using widely used DIMM form-factors. Non-volatile memory is memory that retains its contents even when electrical power is removed, for example from an unexpected power loss, system crash, or normal shutdown. Properly used, NVDIMMs can improve application performance and system crash recovery time. They enhance solid-state drive (SSD) endurance and reliability.
Double Data Rate 5 Synchronous Dynamic Random-Access Memory is a type of synchronous dynamic random-access memory. Compared to its predecessor DDR4 SDRAM, DDR5 was planned to reduce power consumption, while doubling bandwidth. The standard, originally targeted for 2018, was released on July 14, 2020.
UniDIMM is a specification for dual in-line memory modules (DIMMs), which are printed circuit boards (PCBs) designed to carry dynamic random-access memory (DRAM) chips. UniDIMMs can be populated with either DDR3 or DDR4 chips, with no support for any additional memory control logic; as a result, the computer's memory controller must support both DDR3 and DDR4 memory standards. The UniDIMM specification was created by Intel for its Skylake microarchitecture, whose integrated memory controller (IMC) supports both DDR3 and DDR4 memory technologies.
The ThinkPad P series line of workstation laptop computers produced by Lenovo as part of the ThinkPad product family. Originally introduced in 2015 as a successor to the previous ThinkPad W series, the P series are the most advanced ThinkPad products offered by Lenovo.
LGA 1700 is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake, which was first released in November 2021.
Granite Rapids is the codename for 6th generation Xeon Scalable server processors designed by Intel, launched on 24 September 2024. Featuring up to 128 P-cores, Granite Rapids is designed for high performance computing applications. The platform equivalent Sierra Forest processors with up to 288 E-cores launched in June 2024 before Granite Rapids.
Raptor Lake is Intel's codename for the 13th and 14th generations of Intel Core processors based on a hybrid architecture, utilizing Raptor Cove performance cores and Gracemont efficient cores. Like Alder Lake, Raptor Lake is fabricated using Intel's Intel 7 process. Raptor Lake features up to 24 cores and 32 threads and is socket compatible with Alder Lake systems. Like earlier generations, Raptor Lake processors also need accompanying chipsets. Raptor Lake CPUs have suffered issues with permanent damage from elevated voltage due to a vulnerable clock tree circuit, resulting in instability. Intel claims these issues have been since fixed in the latest microcode patches, which requires updating the motherboard's BIOS.
SO-DIMMs, which were first introduced almost 25 years ago, haven't changed much in all that time besides moving to newer and faster DRAM methods.