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Double Data Rate Synchronous Dynamic Random-Access Memory is a double data rate (DDR) synchronous dynamic random-access memory (SDRAM) class of memory integrated circuits used in computers. DDR SDRAM, also retroactively called DDR1 SDRAM, has been superseded by DDR2 SDRAM, DDR3 SDRAM, DDR4 SDRAM and DDR5 SDRAM. None of its successors are forward or backward compatible with DDR1 SDRAM, meaning DDR2, DDR3, DDR4 and DDR5 memory modules will not work on DDR1-equipped motherboards, and vice versa.
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Synchronous dynamic random-access memory is any DRAM where the operation of its external pin interface is coordinated by an externally supplied clock signal.
Rambus DRAM (RDRAM), and its successors Concurrent Rambus DRAM (CRDRAM) and Direct Rambus DRAM (DRDRAM), are types of synchronous dynamic random-access memory (SDRAM) developed by Rambus from the 1990s through to the early 2000s. The third-generation of Rambus DRAM, DRDRAM was replaced by XDR DRAM. Rambus DRAM was developed for high-bandwidth applications and was positioned by Rambus as replacement for various types of contemporary memories, such as SDRAM.
Double Data Rate 2 Synchronous Dynamic Random-Access Memory is a double data rate (DDR) synchronous dynamic random-access memory (SDRAM) interface. It is a JEDEC standard (JESD79-2); first published in September 2003. DDR2 succeeded the original DDR SDRAM specification, and was itself succeeded by DDR3 SDRAM in 2007. DDR2 DIMMs are neither forward compatible with DDR3 nor backward compatible with DDR.
Rambus Inc. is an American technology company that designs, develops and licenses chip interface technologies and architectures that are used in digital electronics products. The company, founded in 1990, is well known for inventing RDRAM and for its intellectual property-based litigation following the introduction of DDR-SDRAM memory.
Double Data Rate 3 Synchronous Dynamic Random-Access Memory is a type of synchronous dynamic random-access memory (SDRAM) with a high bandwidth interface, and has been in use since 2007. It is the higher-speed successor to DDR and DDR2 and predecessor to DDR4 synchronous dynamic random-access memory (SDRAM) chips. DDR3 SDRAM is neither forward nor backward compatible with any earlier type of random-access memory (RAM) because of different signaling voltages, timings, and other factors.
GDDR4 SDRAM, an abbreviation for Graphics Double Data Rate 4 Synchronous Dynamic Random-Access Memory, is a type of graphics card memory (SGRAM) specified by the JEDEC Semiconductor Memory Standard. It is a rival medium to Rambus's XDR DRAM. GDDR4 is based on DDR3 SDRAM technology and was intended to replace the DDR2-based GDDR3, but it ended up being replaced by GDDR5 within a year.
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Graphics DDR SDRAM is a type of synchronous dynamic random-access memory (SDRAM) specifically designed for applications requiring high bandwidth, e.g. graphics processing units (GPUs). GDDR SDRAM is distinct from the more widely known types of DDR SDRAM, such as DDR4 and DDR5, although they share some of the same features—including double data rate (DDR) data transfers. As of 2023, GDDR SDRAM has been succeeded by GDDR2, GDDR3, GDDR4, GDDR5, GDDR5X, GDDR6, GDDR6X and GDDR6W.
Double Data Rate 4 Synchronous Dynamic Random-Access Memory is a type of synchronous dynamic random-access memory with a high bandwidth interface.
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GDDR3 SDRAM is a type of DDR SDRAM specialized for graphics processing units (GPUs) offering less access latency and greater device bandwidths. Its specification was developed by ATI Technologies in collaboration with DRAM vendors including Elpida Memory, Hynix Semiconductor, Infineon and Micron. It was later adopted as a JEDEC standard.
Double Data Rate 5 Synchronous Dynamic Random-Access Memory is a type of synchronous dynamic random-access memory. Compared to its predecessor DDR4 SDRAM, DDR5 was planned to reduce power consumption, while doubling bandwidth. The standard, originally targeted for 2018, was released on July 14, 2020.
High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix. It is used in conjunction with high-performance graphics accelerators, network devices, high-performance datacenter AI ASICs, as on-package cache in CPUs and on-package RAM in upcoming CPUs, and FPGAs and in some supercomputers. The first HBM memory chip was produced by SK Hynix in 2013, and the first devices to use HBM were the AMD Fiji GPUs in 2015.
Graphics Double Data Rate 6 Synchronous Dynamic Random-Access Memory is a type of synchronous graphics random-access memory (SGRAM) with a high bandwidth, "double data rate" interface, designed for use in graphics cards, game consoles, and high-performance computing. It is a type of GDDR SDRAM, and is the successor to GDDR5. Just like GDDR5X it uses QDR in reference to the write command clock (WCK) and ODR in reference to the command clock (CK).
References
- ↑ "Samsung announces 36 Gbps GDDR7 memory standard, aims to release V-NAND storage solutions with 1000 layers by 2030". Notebookcheck. 2022-10-06. Retrieved 2023-06-30.
- ↑ Discuss, btarunr (2022-12-05). "Samsung Reveals GDDR7 Memory Uses PAM3 Signalling to Achieve 36 Gbps Data-Rate". TechPowerUp. Retrieved 2023-06-30.
- ↑ "Cadence announces first GDDR7 verification solution". VideoCardz.com. Retrieved 2023-06-30.
- ↑ "Micron could introduce GDDR7 memory chips in early 2024". TechSpot. 2023-06-30. Retrieved 2023-06-30.
- ↑ "Samsung develops industry's first GDDR7 DRAM with 1.5 TBps bandwidth". Notebookcheck. 2023-07-19. Retrieved 2023-07-31.
- ↑ Memory Technology 2021: Trends & Challenges (PDF), 2021, retrieved 2023-07-31
- ↑ Smith, Ryan. "Samsung Completes Initial GDDR7 Development: First Parts to Reach Up to 32Gbps/pin". www.anandtech.com. Retrieved 2023-07-31.
- ↑ "JEDEC Publishes GDDR7 Graphics Memory Standard | JEDEC". www.jedec.org. Retrieved 2024-03-05.
- ↑ Anton Shilov (2023-07-19). "GDDR7 Arrives: Samsung Outs World's First Chip, 32 GT/s for Next-Gen GPUs". Tom's Hardware . Retrieved 2023-10-06.
- 1 2 Shilov, Anton. "Micron's GDDR7 Chip Smiles for the Camera as Micron Aims to Seize Larger Share of HBM Market". www.anandtech.com. Retrieved 2024-06-09.
- ↑ Smith, Anton Shilov, Ryan. "JEDEC Publishes GDDR7 Memory Spec: Next-Gen Graphics Memory Adds Faster PAM3 Signaling & On-Die ECC". www.anandtech.com. Retrieved 2024-06-09.
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