Company type | Public |
---|---|
ISIN | US0316521006 |
Industry | Semiconductors & Related Devices |
Founded | 1968 |
Founder | Hyang-Soo Kim |
Headquarters | Tempe, Arizona, U.S. |
Number of locations | 12 |
Key people |
|
Revenue | US$6.50 billion (2023) |
US$470 million (2023) | |
US$362 million (2023) | |
Total assets | US$6.77 billion (2023) |
Total equity | US$3.96 billion (2023) |
Number of employees | 28,700 (2023) |
Website | amkor |
Footnotes /references [3] [4] |
Amkor Technology, Inc. is a semiconductor product packaging and test services provider. The company has been headquartered in Arizona, since 2005, when it was moved from West Chester, Pennsylvania, also in the United States. [5] The company's Arizona headquarters was originally in Chandler, [6] then later moved to Tempe. The company was founded in 1968 and, as of 2022 [update] , has approximately 31,000 employees worldwide and a reported $7.1 billion in sales.
With factories in China, Japan, Korea, Malaysia, Philippines, Portugal, Taiwan and Vietnam, Amkor is a major player in the semiconductor industry. It designs, packages and tests integrated circuits (ICs) for chip manufacturers.
Amkor self-publishes that the name "Amkor" is a portmanteau of the words "America" and "Korea". [7]
Amkor's origins can be traced back to ANAM Industries, a business in Seoul dealing with imported Japanese goods, including bicycles, and founded by Hyang-Soo Kim in 1935. In March 1968, ANAM Industries underwent a transformation into ANAM Industrial Co. Ltd., becoming South Korea's first semiconductor business. One month later, his son Joo-Jin (James) Kim founded Amkor Electronics, Inc. and inaugurated its sales office in Philadelphia. Its semiconductor production and export began in 1970. In 1998, Amkor began publicly trading on Nasdaq. [7]
In 2000, Amkor acquired Integra Technologies, an Outsourced Semiconductor Assembly And Test (OSAT) provider in United States. [8] In 2005, Amkor spun off Integra Technologies. [9]
In February 2016, Amkor fully acquired J-Devices Corp, the largest Outsourced Semiconductor Assembly And Test (OSAT) provider in Japan. [10]
In June 2017, Amkor Technology was recognized as Supplier of the Year for 2016 by Qualcomm Technologies for a second consecutive year. [11]
Amkor Technology has competitiveness for chip assembly by thermal compression as well as wafer level packaging. In September 2018, Amkor Technology opened a manufacturing and test plant at Longtan Science Park in Taiwan. [12]
In 2019, Amkor Technology was ranked 2nd in overall revenue in the OSAT (Outsourced Semiconductor Assembly and Test) market.
A $2 billion factory for advanced packaging of chips from TSMC in Arizona was announced in November 2023. [13]
Taiwan Semiconductor Manufacturing Company Limited is a Taiwanese multinational semiconductor contract manufacturing and design company. It is the world's second-most valuable semiconductor company, the world's largest dedicated independent ("pure-play") semiconductor foundry, and its country's largest company, with headquarters and main operations located in the Hsinchu Science Park in Hsinchu, Taiwan. The majority of TSMC is owned by foreign investors, and the central government of Taiwan is the largest shareholder. In 2023, the company was ranked 44th in the Forbes Global 2000.
The semiconductor industry is the aggregate of companies engaged in the design and fabrication of semiconductors and semiconductor devices, such as transistors and integrated circuits. It formed around 1960, once the fabrication of semiconductor devices became a viable business. The industry's annual semiconductor sales revenue has since grown to over $481 billion, as of 2018.
Fabless manufacturing is the design and sale of hardware devices and semiconductor chips while outsourcing their fabrication to a specialized manufacturer called a semiconductor foundry. These foundries are typically, but not exclusively, located in the United States, China, and Taiwan. Fabless companies can benefit from lower capital costs while concentrating their research and development resources on the end market. Some fabless companies and pure play foundries may offer integrated-circuit design services to third parties.
Teradyne, Inc., is an American automatic test equipment (ATE) designer and manufacturer based in North Reading, Massachusetts. Teradyne's high-profile customers include Samsung, Qualcomm, Intel, Analog Devices, Texas Instruments and IBM.
An integrated device manufacturer (IDM) is a semiconductor company which designs, manufactures, and sells integrated circuit (IC) products.
KLA Corporation is an American capital equipment company based in Milpitas, California. It supplies process control and yield management systems for the semiconductor industry and other related nanoelectronics industries. The company's products and services are intended for all phases of wafer, reticle, integrated circuit (IC) and packaging production, from research and development to final volume manufacturing.
NXP Semiconductors N.V. (NXP) is a Dutch semiconductor designer and manufacturer with headquarters in Eindhoven, Netherlands. The company employs approximately 34,000 people in more than 30 countries. NXP reported revenue of $13.3 billion in 2023.
Micron Memory Japan, K.K.(Japanese: マイクロンメモリジャパン株式会社, Micron Memory Japan Kabushiki-gaisha ) is a Japanese subsidiary of Micron Technology. It was formerly known as Elpida Memory, Inc. established in 1999 that developed, designed, manufactured and sold dynamic random-access memory (DRAM) products. It was also a semiconductor foundry. With headquarters in Yaesu, Chūō, Tokyo, Japan, it was initially formed under the name NEC Hitachi Memory in 1999 by the merger of the Hitachi and NEC DRAM businesses. In the following year it took on the name Elpida. In 2003, Elpida took over the Mitsubishi DRAM business. In 2004, it listed its shares in the first section of the Tokyo Stock Exchange. In 2012, those shares were delisted as a result of its bankruptcy. In 2013, Elpida was acquired by Micron Technology. On February 28, 2014, Elpida changed its name to Micron Memory Japan and Elpida Akita changed its name to Micron Akita, Inc.
United Test and Assembly Center Ltd is one of the largest providers of test and assembly services for a wide range of semiconductor devices, including memory, mixed-signal/RF and logic integrated circuits. Founded in 1997 by Inderjit Singh and commencing full operations in 1999, the company started out by acquiring the semiconductor test operations of Fujitsu Microelectronics Asia Pte. Ltd.
ASM is a Dutch headquartered multinational corporation that specializes in the design, manufacturing, sales and service of semiconductor wafer processing equipment for the fabrication of semiconductor devices. ASM's products are used by semiconductor manufacturers in front-end wafer processing in their semiconductor fabrication plants. ASM's technologies include atomic layer deposition, epitaxy, chemical vapor deposition and diffusion.
Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer. This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components are attached.
Semiconductor consolidation is the trend of semiconductor companies collaborating in order to come to a practical synergy with the goal of being able to operate in a business model that can sustain profitability.
Tokyo Electron Limited, or TEL, is a Japanese electronics and semiconductor company headquartered in Akasaka, Minato-ku, Tokyo, Japan. The company was founded as Tokyo Electron Laboratories, Inc. in 1963. TEL is best known as a supplier of equipment to fabricate integrated circuits (IC), flat panel displays (FPD), and photovoltaic cells (PV). Tokyo Electron Device, or TED, is a subsidiary of TEL specializing in semiconductor devices, electronic components, and networking devices. As of 2011, TEL was the largest manufacturer of IC and FPD production equipment. Listed on the Nikkei 225, in 2024, Tokyo Electron had a market cap of US$114.6 billion, making it the third-most valuable company in Japan in terms of market cap, and the 12th ranked semiconductor-related company worldwide.
Advanced Semiconductor Engineering, Inc., previously known as ASE Group, is a leading provider of independent semiconductor packaging and test manufacturing services, with its headquarters in Kaohsiung, Taiwan.
The semiconductor industry, including Integrated Circuit (IC) manufacturing, design, and packaging, forms a major part of Taiwan's IT industry. Due to its strong capabilities in OEM wafer manufacturing and a complete industry supply chain, Taiwan has been able to distinguish itself as a leading microchip manufacturer and dominate the global marketplace. Taiwan’s semiconductor sector accounted for US$115 billion, around 20 percent of the global semiconductor industry. In sectors such as foundry operations, Taiwanese companies account for 50 percent of the world market, with Taiwan Semiconductor Manufacturing Company (TSMC) the biggest player in the foundry market.
JCET Group is a public company headquartered in Jiangyin on China's eastern coast. It is the largest Outsourced Semiconductor Assembly and Test (OSAT) company in mainland China and the third-largest globally. JCET was formed in 1972, when Jiangyin converted a local factory to produce transistors. JCET went public on the Shanghai Stock Exchange in 2003 and continued to grow over time. JCET provides a range of semiconductor packaging, assembly, manufacturing, and testing products and services.
The Chinese semiconductor industry, including integrated circuit design and manufacturing, forms a major part of mainland China's information technology industry.
The CHIPS and Science Act is a U.S. federal statute enacted by the 117th United States Congress and signed into law by President Joe Biden on August 9, 2022. The act authorizes roughly $280 billion in new funding to boost domestic research and manufacturing of semiconductors in the United States, for which it appropriates $52.7 billion. The act includes $39 billion in subsidies for chip manufacturing on U.S. soil along with 25% investment tax credits for costs of manufacturing equipment, and $13 billion for semiconductor research and workforce training, with the dual aim of strengthening American supply chain resilience and countering China. It also invests $174 billion in the overall ecosystem of public sector research in science and technology, advancing human spaceflight, quantum computing, materials science, biotechnology, experimental physics, research security, social and ethical considerations, workforce development and diversity, equity, and inclusion efforts at NASA, NSF, DOE, EDA, and NIST.
Integra Technologies is an Outsourced Semiconductor Assembly And Test (OSAT) post processing provider headquartered in Wichita, Kansas, United States. Its current facilities are located in Wichita and Milpitas, California. Their service converts final semiconductor wafers into useable packaged integrated circuits.
DB HiTek Co., Ltd., formerly Dongbu HiTek, is a semiconductor contract manufacturing and design company headquartered in Bucheon, Gyeonggi-do, South Korea. DB HiTek is one of the major contract chip manufacturers, alongside TSMC, Samsung Electronics, GlobalFoundries, and UMC. It is also the second-largest foundry company in South Korea, behind Samsung Electronics.