Onto Innovation

Last updated
Onto Innovation Inc.
Company type Public
Industry Semiconductor Equipment & Materials
Predecessors
  • Nanometrics Incorporated
  • Rudolph Technologies, Inc.
Headquarters Wilmington, Massachusetts, United States
Key people
Michael P. Plisinski (CEO)
ProductsSemiconductor wafer processing, Semiconductor final manufacturing, Data storage, Compound semiconductor manufacturing, Flat panel display, Micro-Electro-Mechanical Systems (MEMS) manufacturing, Research and development.
Revenue US$556.5 million (2020)
Number of employees
c.1,636 (December 31, 2022)
Website ontoinnovation.com

Onto Innovation Inc. is an American semiconductor company formed in 2019 from the merger of Rudolph Technologies, Inc. and Nanometrics Incorporated. It is a provider of process and process control equipment and software for microelectronic manufacturing industries (primarily semiconductor device manufacturing). The company's product offering includes automated defect inspection and metrology systems, probe card test and analysis systems, and lithography step-and-repeat systems. In addition, Onto Innovation provides a broad range of software products designed to improve yield, control processes and reduce manufacturing costs.

Contents

Onto Innovation is traded as NYSE :  ONTO on the New York Stock Exchange.

Onto Innovation is a supplier of wafer fab equipment (WFE). [1]

History

Rudolph Research: 1940–1995

Rudolph Technologies, Inc. (RTI) traces its origins to 1940, when Otto Curt Rudolph formed O.C. Rudolph & Sons, Inc. [2] Originally an importer of microscopes and scientific instruments, this RTI predecessor was renamed in October 1970 to Rudolph Research Corporation. The company designed optical equipment for laboratories and universities.

The company Otto Rudolph established continued to evolve, making breakthroughs in ellipsometry including the first production-oriented ellipsometer for thin, transparent film measurements. The company continued development of its metrology products, securing new patents along the way.

Nanometrics: 1975–2019

Nanometrics was founded in 1975 and was a pioneer and innovator in the field of optical metrology. In 1984, the company started publicly trading.

Formation of Rudolph Technologies: 1996–1999

In June 1996, Richard Spanier, Ph.D., chief executive officer of Rudolph Research, forged a partnership agreement with Boston-based Riverside Partners [3] and New York-based Liberty Partners [4] who, along with others, invested in the company. At that time, Dr. Spanier retired his active role in the company and semiconductor industry veteran Paul F. McLaughlin was named as CEO. In August 1999, the name of the company was changed to Rudolph Technologies, Inc.

In November 1999, RTI made its initial public offering of common stock. Revenues grew dramatically, reaching a record $38.1 million. A new facility opened early in the year, and the company launched a new product, the MetaPULSE® line of copper film measurement tools.

Rudolph Technologies: 2000–2019

In July 2002, RTI agreed to acquire the Richardson, Texas-based defect control company ISOA, Inc. A spin-off from Texas Tech University's International Center for Informatics Research, ISOA had been licensing technology to the semiconductor industry for about 16 years, offering defect detection software. The deal was completed in September, with ISOA becoming RTI's Yield Metrology Group.

Several months later, RTI expanded into China by establishing an office in Shanghai's Pudong industrial area. In subsequent years, the company established additional offices in all semiconductor manufacturing regions of the world including Japan, Europe, South Korea, Taiwan and Singapore.

In 2006, a merger was completed with Minnesota-based August Technology Corporation, growing Rudolph's workforce to 550 employees. This acquisition brought Rudolph into the ‘back-end’ of the manufacturing process.

In 2007, the company acquired the semiconductor business of Washington-based Applied Precision LLC, adding probe card test and analysis to the company's portfolio. The acquisition of RVSI Inspection LLC and its Wafer Scanner inspection system was announced in 2008. Adventa Control Technologies, Inc., a provider of process control software, was acquired in 2009, and an acquisition of MKS Instruments, Inc.’s Yield Dynamics business was completed in 2010. Rudolph announced two acquisitions in 2012. NanoPhotonics GmbH, Mainz, Germany (unpatterned wafer inspection); and Azores Corp., Wilmington, MA (Rudolph's entry into the advanced packaging and FPD lithography markets). In 2013 Rudolph announced the acquisition of selected assets of Tamar Technology, Newbury Park, CA, a supplier of 3D metrology technologies. Rudolph acquired the inspection technology of Stella Alliance in 2015, adding patents to enhance its inspection capability.

In November 2015, Rudolph announced the retirement of Paul F. McLaughlin and appointment of Michael P. Plisinski as CEO and Director. [5]

As of January 19, 2017, Rudolph Technologies Inc. had a market capitalization of about $713 million. [6]

In January 2017, Voce Capital Management LLC in a letter to investors, urged merging semiconductor-equipment makers Rudolph Technologies Inc. and Nanometrics Inc. [6] The merger eventually occurred and closed on October 30, 2019. [7] According to the Joint Proxy Statement announcing the terms of the merger, talks began in the first quarter of 2016 and continuing into 2017, Nanometrics and Rudolph engaged in discussions concerning a potential business combination between the two companies, to be structured as a merger of equals transaction, which discussions between the parties are referred to as the 2017 discussions. In connection with the 2017 discussions, in February 2016, Nanometrics and Rudolph entered into a mutual confidentiality agreement, which was subsequently extended in January 2017. [8]

On October 25, 2019, Rudolph merged with Nanometrics Incorporated to become Onto Innovation, trading as NYSE :  ONTO. [7]

The company is now headquartered in Wilmington, Massachusetts, with additional U.S. operations in New Jersey, Minnesota, California, Texas, Oregon and Washington. Manufacturing operations for inspection and some metrology products are consolidated in Minnesota; most metrology manufacturing operations is in California; stepper manufacturing is located in Wilmington, Massachusetts.

Products and services

Semiconductor fabrication, packaging and testing

Semiconductor device fabrication is the process used to create the integrated circuits that are found in commonly used electronic devices and electrical equipment. It is a multiple-step process during which electronic circuits are gradually built by adding elements and layers of material on a substrate made of pure silicon, or various compounds in the case of specialized applications, hundreds of steps performed by specialized process tools are required before the wafer moves to a final packaging facility.

The focus of packaging and assembly is to ensure an electrical connection from the die to the circuit board, to encapsulate the package for mechanical integrity and to withstand thermal variations. The era of slim form-factor devices, such as smart phones, implies high level of functionality in very dense footprint. Due to these requirements, the challenges in packaging, assembly and test have significantly increased and advanced packaging techniques such as bumping or through-silicon via are necessary.

JetStep

Onto Innovation has sold multiple JetStep-branded projection lithography steppers. JetStep supports large-panel format lithography. [9]

Rudolph Technologies, a predecessor to Onto Innovation, described its JetStep system as being suitable for wafers up to 450mm and rectangular panels up to Gen 3.5 size (720mm x 600mm). [10]

See also

Related Research Articles

<span class="mw-page-title-main">Semiconductor device fabrication</span> Manufacturing process used to create integrated circuits

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as microprocessors, microcontrollers, and memories. It is a multiple-step photolithographic and physico-chemical process during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.

<span class="mw-page-title-main">Wafer (electronics)</span> Thin slice of semiconductor used for the fabrication of integrated circuits

In electronics, a wafer is a thin slice of semiconductor, such as a crystalline silicon, used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells.

Applied Materials, Inc. is an American corporation that supplies equipment, services and software for the manufacture of semiconductor chips for electronics, flat panel displays for computers, smartphones, televisions, and solar products. The company also supplies equipment to produce coatings for flexible electronics, packaging and other applications. The company is headquartered in Santa Clara, California, and is the second largest supplier of semiconductor equipment in the world based on revenue behind Dutch company ASML.

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<span class="mw-page-title-main">Photomask</span> Photolithographic tool

A photomask is an opaque plate with transparent areas that allow light to shine through in a defined pattern. Photomasks are commonly used in photolithography for the production of integrated circuits to produce a pattern on a thin wafer of material. In semiconductor manufacturing, a mask is sometimes called a reticle.

<span class="mw-page-title-main">Stepper</span> Photolithographic Tool

A stepper or wafer stepper is a device used in the manufacture of integrated circuits (ICs). It is an essential part of the process of photolithography, which creates millions of microscopic circuit elements on the surface of silicon wafers out of which chips are made. It is similar in operation to a slide projector or a photographic enlarger. The ICs that are made form the heart of computer processors, memory chips, and many other electronic devices.

<span class="mw-page-title-main">ASML Holding</span> Dutch manufacturer of semiconductor production equipment

ASML Holding N.V. is a Dutch multinational corporation founded in 1984. ASML specializes in the development and manufacturing of photolithography machines which are used to produce computer chips.

KLA Corporation is an American company based in Milpitas, California that makes wafer fab equipment. It supplies process control and yield management systems for the semiconductor industry and other related nanoelectronics industries. The company's products and services are intended for all phases of wafer, reticle, integrated circuit (IC) and packaging production, from research and development to final volume manufacturing.

<span class="mw-page-title-main">Lam Research</span> American semiconductor equipment company

Lam Research Corporation is an American supplier of wafer-fabrication equipment and related services to the semiconductor industry. Its products are used primarily in front-end wafer processing, which involves the steps that create the active components of semiconductor devices and their wiring (interconnects). The company also builds equipment for back-end wafer-level packaging (WLP) and for related manufacturing markets such as for microelectromechanical systems (MEMS).

In silicon wafer manufacturing overlay control is the control of pattern-to-pattern alignment necessary in the manufacture of silicon wafers.

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<span class="mw-page-title-main">VIEW Engineering</span>

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Glossary of microelectronics manufacturing terms

<span class="mw-page-title-main">Shanghai Micro Electronics Equipment</span> SMEE, Chinese lithography machine manufacturer

Shanghai Micro Electronics Equipment (Group) Co., Ltd. (SMEE), is a semiconductor manufacturing equipment company based in Shanghai, China. The company is involved in the research, development, manufacture and sale of lithography scanners and inspection tools to the semiconductor manufacturing industry; it also provides support services to its customers.

LCD manufacturing is the process of making liquid crystal display (LCD) panels. It involves using glass and silicon substrates. Photolithography is used to pattern the substrates, and liquid crystal materials are added. In the case of a color TFT LCD, color filters are patterned in layers to make red, green, and blue pixels.

References

  1. "Onto Innovation Investor Presentation" (PDF). Retrieved 2025-01-05.
  2. "History". Rudolph Technologies. Retrieved July 30, 2017.
  3. "Riverside Partners".
  4. "Login". webfin.libertypartners.com.
  5. "Rudolph Announces Retirement of Paul F. McLaughlin and Appointment of Michael P. Plisinski as New CEO and Director | Rudolph Technologies Investor Center". Archived from the original on 2019-06-28. Retrieved 2019-06-28.
  6. 1 2 Mattioli, Dana; Benoit, David (January 19, 2017), Activist Investor Presses Rudolph Technologies, Nanometrics to Merge, New York: The Wall Street Journal, retrieved January 23, 2017
  7. 1 2 "Onto Innovation Merger Successfully Completed, Combining Nanometrics and Rudolph Technologies". Business Wire. 28 October 2019. Retrieved 28 October 2019.
  8. "Joint Proxy Statement/Prospectus" . Retrieved November 7, 2019.
  9. "Onto Innovation Announces Multiple Orders for JetStep Panel Lithography System". AP News. 2020-08-03. Retrieved 2025-01-05.
  10. "Rudolph's JetStep Lithography System Maximizes Throughput while Addressing the Specific Challenges of Advanced Packaging Applications" (PDF). Retrieved 2025-01-05.