Footnotes/references Financials as of June30,2024[update].[1]
Lam Research Corporation is an American supplier of wafer-fabrication equipment and related services to the semiconductor industry.[2] Its products are used primarily in front-end wafer processing, which involves the steps that create the active components of semiconductor devices (transistors, capacitors) and their wiring (interconnects). The company also builds equipment for back-end wafer-level packaging (WLP) and for related manufacturing markets such as for microelectromechanical systems (MEMS).
Lam Research was founded in 1980 by David K. Lam, a Chinese-born engineer who had previously worked at Xerox, Hewlett-Packard, and Texas Instruments.[6] It was while he was at Hewlett Packard that he saw the need for better plasma etching equipment, to keep up with the rapid miniaturization of semiconductor wafers.[6] He credited Bob Noyce, founder of Intel, for assisting him in getting funding by ensuring his business plan made sense.[6]
In 1981, the company introduced its first product, the AutoEtch 480, an automated polysilicon plasma etcher. The name AutoEtch was chosen to convey that the etcher was automated, while the 80 in 480 came from 1980, the year the company was founded.[7] The first system was sold in January 1982.[8] In 1982, Roger Emerick was appointed CEO.[9]
In May 1984, the company issued an initial public offering and was listed on Nasdaq under the symbol LRCX.[10] In 1985, David Lam left the company to join Link Technologies, which eventually was bought by Wyse[11] and is now Dell Wyse.[12] In the mid-1980s, Lam Research continued its global expansion, concentrating on Taiwan and also opening customer support centers throughout Europe, the United States and Japan.[12]
By the early 1990s, the company had a presence in China, Korea, Singapore, and Taiwan.[12] In March 1997, the company purchased OnTrak Systems Inc., a chip equipment manufacturer that specialized in chemical-mechanical planarization (CMP) cleaning, for $225 million.[13] CMP cleaning is a hybrid process to smooth surfaces using both etching and mechanical polishing. In August 1997, the company named OnTrak's CEO Jim Bagley as its CEO.[12][14] In 1998, Bagley was named chairman of the board.[14]
In 2005, Steve Newberry was appointed as CEO.[15] In 2006, Lam Research acquired Bullen Semiconductor, now Silfex, Inc.[16] In 2008, Lam Research acquired SEZ AG,[17] now Lam Research AG.[18] In 2011, Lam Research agreed to buy San Jose, California chip equipment manufacturer Novellus Systems, for $3.3 billion.[19] The deal was completed in June 2012.[20] In 2012, Martin Anstice was appointed as CEO.[15] In October 2015, Lam Research announced plans to buy Milpitas, California–based wafer inspection equipment vendor KLA-Tencor for $10.6bn, in what was viewed as a semiconductor industry consolidation move.[21] In June 2016, it was announced that Lam Research had joined the Fortune 500 for the first time.[22] In October 2016, the company announced it had terminated its offer for KLA-Tencor amidst concerns that the deal would not meet regulatory approval from the U.S. Department of Justice[23] over antitrust concerns.[24]
In September 2017, the company announced the acquisition of Cary, North Carolina–based chip simulation firm Coventor. The company's software reportedly would allow Lam to reduce the time to market for its new chips.[25] In November, the company launched Lam Research Capital (Lam Capital), a venture capital group chartered to invest in companies.[26]
In January 2018, the company announced that COO Tim Archer was being promoted to president, and CEO Martin Anstice remained in the CEO role.[27]
In December 2018, Martin Anstice resigned as CEO due to allegations of personal misconduct, and the Board of Directors of Lam Research named Tim Archer as president and chief executive officer.[28] Archer was also appointed to the Board of Directors of Lam Research.
In August 2021, Lam opened a manufacturing facility in Batu Kawan, Malaysia to meet the growing demand for wafer fabrication equipment and to work more closely with key customers and supply chain partners.[29]
On 15 September 2022, Lam Research established a new India Center for Engineering in Bengaluru. This center will be utilized for engineering, testing, and research and development of wafer manufacturing hardware and software, which are used to create memory components including DRAM, NAND, and logic technologies.This is Lam's second R&D lab and third Indian facility. It will assist the company's worldwide production operations with hardware and software. The new facility will lessen the Indian engineers' dependency on their US counterparts by enabling them to finish designs domestically and shift the bulk of Lam's international activities to India.[30][31]
In November 2022, it was announced Lam had acquired the Salzburg-headquartered, wet processing semiconductor equipment provider, Semsysco GmbH.[32] That same month, Lam also acquired the Texas-based plasma simulation company, Esgee Technologies, Inc.[33]
On September 9, 2024, Lam Research broke ground for a new systems lab at its India Center for Engineering. It will provide a fully working semiconductor manufacturing equipment development environment. With active chemistries and realistic test settings, the new facility will allow engineers to design, test, and validate semiconductor manufacturing processes and equipment on-site and on tool, resulting in much shorter design cycles. The lab is meant to be an essential component of Lam's ongoing and upcoming research and development activities.[34]
Lam's thin film deposition systems lay down the sub-microscopic layers of conducting (metal) or insulating (dielectric) materials that make up an integrated circuit. The processes require uniformity at the nanoscale level.[36]
Plasma-enhanced (PE) CVD and ALD technologies create dielectric films for a wide range of insulating parts. For gapfill processes, which require depositing dielectric material into narrow spaces, Lam uses high-density plasma (HDP) CVD technology.[40][41] PECVD and ALD are also used to form hardmasks, layers that can be removed to improve circuit patterning processes.[42]
Plasma etch
Lam Research uses proprietary technology in its equipment for plasma etch,[43] the process of selectively removing materials from the surface of a wafer to create the semiconductor device's features and patterns. The equipment helps chip manufacturers carve small parts such as those needed for the latest multiple patterning sequences, transistors, and advanced memory structures, which involve increasingly complex film stacks and ever higher aspect ratio structures.
Lam's dry strip systems use plasma technology to selectively remove the photoresist mask following a range of front-end wafer processing and advanced packaging applications.[44]
Wafer cleaning
Lam Research's wet spin clean and plasma-based bevel clean products remove particles, residues, and films from the wafer surface before or after adjacent processes.[45]
The company's spin wet clean technology is used between chip-processing steps to remove yield-limiting residues and defects. Lam's bevel clean technology directs a plasma at the very edge of the wafer to clean unwanted particles, residues, and films. If not removed, these materials can impact yield if they flake off and re-deposit on the device area during subsequent manufacturing steps.
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MEMS is the technology of microscopic devices incorporating both electronic and moving parts. MEMS are made up of components between 1 and 100 micrometres in size, and MEMS devices generally range in size from 20 micrometres to a millimetre, although components arranged in arrays can be more than 1000 mm2. They usually consist of a central unit that processes data and several components that interact with the surroundings.
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips. It is a multiple-step photolithographic and physico-chemical process during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
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Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions that dislodge portions of the material from the exposed surface. A common type of dry etching is reactive-ion etching. Unlike with many of the wet chemical etchants used in wet etching, the dry etching process typically etches directionally or anisotropically.
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Microfabrication is the process of fabricating miniature structures of micrometre scales and smaller. Historically, the earliest microfabrication processes were used for integrated circuit fabrication, also known as "semiconductor manufacturing" or "semiconductor device fabrication". In the last two decades, microelectromechanical systems (MEMS), microsystems, micromachines and their subfields have re-used, adapted or extended microfabrication methods. These subfields include microfluidics/lab-on-a-chip, optical MEMS, RF MEMS, PowerMEMS, BioMEMS and their extension into nanoscale. The production of flat-panel displays and solar cells also uses similar techniques.
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↑ PRNewswire, Staff Writer (4 August 2021). "Lam Research Strengthens Global Manufacturing Network by Opening Its Largest Manufacturing Facility in Malaysia". Yahoo Finance. PRNewswire.
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