Wafer fabrication

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Photolithography etching process.svg
Simplified illustration of the process of fabrication of a CMOS inverter on p-type substrate in semiconductor microfabrication. Each etch step is detailed in the following image. Note: Gate, source and drain contacts are not normally in the same plane in real devices, and the diagram is not to scale.

Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer fabrication is used to build components with the necessary electrical structures.

The main process begins with electrical engineers designing the circuit and defining its functions, and specifying the signals, inputs/outputs and voltages needed. These electrical circuit specifications are entered into electrical circuit design software, such as SPICE , and then imported into circuit layout programs, which are similar to ones used for computer aided design. This is necessary for the layers to be defined for photomask production. The resolution of the circuits increases rapidly with each step in design, as the scale of the circuits at the start of the design process is already being measured in fractions of micrometers. Each step thus increases circuit density for a given area.

The silicon wafers start out blank and pure. The circuits are built in layers in clean rooms. First, photoresist patterns are photo-masked in micrometer detail onto the wafers' surface. The wafers are then exposed to short-wave ultraviolet light and the unexposed areas are thus etched away and cleaned. Hot chemical vapors are deposited on to the desired zones and baked in high heat, which permeate the vapors into the desired zones. In some cases, ions, such as O2+ or O+, are implanted in precise patterns and at a specific depth by using RF-driven ion sources.

These steps are often repeated many hundreds of times, depending on the complexity of the desired circuit and its connections.

New processes to accomplish each of these steps with better resolution and in improved ways emerge every year, with the result of constantly changing technology in the wafer fabrication industry. New technologies result in denser packing of minuscule surface features such as transistors and micro-electro-mechanical systems (MEMS). This increased density continues the trend often cited as Moore's Law.

A fab is a common term for where these processes are accomplished. Often the fab is owned by the company that sells the chips, such as Intel, Texas Instruments, or Freescale. A foundry is a fab at which semiconductor chips or wafers are fabricated to order for third party companies that sell the chip, such as fabs owned by Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics Corporation (UMC), GlobalFoundries and Semiconductor Manufacturing International Corporation (SMIC).

In 2013 the cost of building the next generation wafer fab was over $10 billion. [1]

WFE market

Referred to respectively as the wafer fab equipment [2] or wafer front end [3] (equipment) market, both using the acronym WFE, the market is that of the manufacturers of the machines which in turn manufacture semiconductors. The apexresearch link in 2020 identified Applied Materials, ASML, KLA-Tencor, Lam Research, TEL and Dainippon Screen Manufacturing as market participants [2] while the 2019 electronicsweekly.com report, citing The Information Network’s president Robert Castellano, focused on the respective market shares commanded by the two leaders, Applied Materials and ASML. [3]

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Semiconductor device fabrication Manufacturing process used to create integrated circuits

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuit (IC) chips such as modern computer processors, microcontrollers, and memory chips such as NAND flash and DRAM that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photolithographic and chemical processing steps during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.

Wafer (electronics) Thin slice of semiconductor used for the fabrication of integrated circuits

In electronics, a wafer is a thin slice of semiconductor, such as a crystalline silicon (c-Si), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping, ion implantation, etching, thin-film deposition of various materials, and photolithographic patterning. Finally, the individual microcircuits are separated by wafer dicing and packaged as an integrated circuit.

TSMC Taiwanese semiconductor foundry company

Taiwan Semiconductor Manufacturing Company, Limited is a Taiwanese multinational semiconductor contract manufacturing and design company. It is the world's most valuable semiconductor company, the world's largest dedicated independent (pure-play) semiconductor foundry, and one of Taiwan's largest companies, with its headquarters and main operations located in the Hsinchu Science Park in Hsinchu. It is majority owned by foreign investors.

The foundry model is a microelectronics engineering and manufacturing business model consisting of a semiconductor fabrication plant, or foundry, and an integrated circuit design operation, each belonging to separate companies or subsidiaries.

Fabless manufacturing is the design and sale of hardware devices and semiconductor chips while outsourcing their fabrication to a specialized manufacturer called a semiconductor foundry. These foundries are typically, but not exclusively, located in the United States, China, and Taiwan. Fabless companies can benefit from lower capital costs while concentrating their research and development resources on the end market. Some fabless companies and pure play foundries may offer integrated-circuit design services to third parties.

Semiconductor Manufacturing International Corporation Chinese semiconductor foundry

Semiconductor Manufacturing International Corporation (SMIC) is a partially state-owned publicly-listed Chinese pure-play semiconductor foundry company. It is the largest contract chip maker in mainland China and 5th largest globally, with a market share of 5.3% in 2021.

The Centro Nacional de Tecnologia Electrônica Avançada S.A is a Brazilian technology center specialized in project development and fabrication in microelectronics, i.e. integrated circuits, or "chips". This center is one of the agents for the Brazilian Microelectronics Program.

Microfabrication

Microfabrication is the process of fabricating miniature structures of micrometre scales and smaller. Historically, the earliest microfabrication processes were used for integrated circuit fabrication, also known as "semiconductor manufacturing" or "semiconductor device fabrication". In the last two decades microelectromechanical systems (MEMS), microsystems, micromachines and their subfields, microfluidics/lab-on-a-chip, optical MEMS, RF MEMS, PowerMEMS, BioMEMS and their extension into nanoscale have re-used, adapted or extended microfabrication methods. Flat-panel displays and solar cells are also using similar techniques.

Maxim Integrated, a subsidiary of Analog Devices, designs, manufactures, and sells analog and mixed-signal integrated circuits for the automotive, industrial, communications, consumer, and computing markets. Maxim's product portfolio includes power and battery management ICs, sensors, analog ICs, interface ICs, communications solutions, digital ICs, embedded security, and microcontrollers. The company is headquartered in San Jose, California, and has design centers, manufacturing facilities, and sales offices worldwide.

Semiconductor fabrication plant Factory where integrated circuits are manufactured

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Multi-project wafer service

Multi-project chip (MPC), and multi-project wafer (MPW) semiconductor manufacturing arrangements allow customers to share mask and microelectronics wafer fabrication cost between several designs or projects.

ASM International Dutch ininformation technology company

ASM International is a Dutch headquartered multinational corporation that specializes in design, manufacturing, sales and service of semiconductor wafer processing equipment for the fabrication of semiconductor devices. ASM's products are used by semiconductor manufacturers in front-end wafer processing in their semiconductor fabrication plants. ASM’s technologies include atomic layer deposition, epitaxy, chemical vapor deposition and diffusion.

GlobalFoundries Inc. is a multinational semiconductor contract manufacturing and design company incorporated in the Cayman Islands and headquartered in Malta, New York. Created by the divestiture of the manufacturing arm of Advanced Micro Devices (AMD), the company was privately owned by Mubadala Investment Company, the sovereign wealth fund of the United Arab Emirates, until an initial public offering (IPO) in October 2021.

Semiconductor consolidation

Semiconductor consolidation is the trend of semiconductor companies collaborating in order to come to a practical synergy with the goal of being able to operate in a business model that can sustain profitability.

Tower Semiconductor Integrated circuit manufacturer

Tower Semiconductor Ltd. is an Israeli company that manufactures integrated circuits using specialty process technologies, including SiGe, BiCMOS, SOI, mixed-signal and RFCMOS, CMOS image sensors, non-imaging sensors, power management (BCD), and non-volatile memory (NVM) as well as MEMS capabilities. Tower Semiconductor also owns 51% of TPSCo, an enterprise with Nuvoton Technology Corporation Japan (NTCJ).

ChangXin Memory Technologies is a Chinese semiconductor integrated device manufacturer headquartered in Hefei, Anhui specializing in the production of DRAM memory.

Glossary of microelectronics manufacturing terms

The Chinese semiconductor industry, including IC design and manufacturing, forms a major part of mainland China's IT industry.

References

  1. Should an Indian fab use older process? Business Standard, 2013
  2. 1 2 apexresearch, "Global Wafer Fab Equipment (WFE) Market Insights 2019-2025" njmmanews.com, January 30, 2020. Sample apexresearch report (PDF). "Warning: Potential Security Risk Ahead" on the njmmanews.com link to the "Jesus Martinez fills in against Nah-Shon Burrell at Bellator 108" citation in the Nah-Shon Burrell Wikipedia article; no warning on the other links to the njmmanews.com site here in the "Wafer fabrication" Wikipedia article. Retrieved 2020-05-29.
  3. 1 2 Manners, David, "Applied to lose front-end equipment crown to ASML", electronicsweekly.com , 26 November 2019. Retrieved 2020-05-29.