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Through-hole technology (also spelled "thru-hole"), refers to the mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side either by manual assembly (hand placement) or by the use of automated insertion mount machines.
In electronics, a lead is an electrical connection consisting of a length of wire or a metal pad (SMD) that is designed to connect two locations electrically. Leads are used for many purposes, including: transfer of power; testing of an electrical circuit to see if it is working, using a test light or a multimeter; transmiting information, as when the leads from an electrocardiograph, or ECG are attached to a person's body to transmit information about their heart rhythm; and sometimes to act as a heatsink. The tiny leads coming off through-hole components are also often called pins.
A printed circuit board (PCB) mechanically supports and electrically connects electronic components or electrical components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.
Soldering is a process in which two or more items are joined together by melting and putting a filler metal (solder) into the joint, the filler metal having a lower melting point than the adjoining metal. Unlike welding, soldering does not involve melting the work pieces. In brazing, the filler metal melts at a higher temperature, but the work piece metal does not melt. In the past, nearly all solders contained lead, but environmental and health concerns have increasingly dictated use of lead-free alloys for electronics and plumbing purposes.
Through-hole technology almost completely replaced earlier electronics assembly techniques such as point-to-point construction. From the second generation of computers in the 1950s until surface-mount technology (SMT) became popular in the late 1980s, every component on a typical PCB was a through-hole component. PCBs initially had tracks printed on one side only, later both sides, then multi-layer boards were in use. Through holes became plated-through holes (PTH) in order for the components to make contact with the required conductive layers. Plated-through holes are no longer required with SMT boards for making the component connections, but are still used for making interconnections between the layers and in this role are more usually called vias.
Point-to-point construction is a non-automated method of construction of electronics circuits widely used before the use of printed circuit boards (PCBs) and automated assembly gradually became widespread following their introduction in the 1950s. Circuits using thermionic valves were relatively large, relatively simple, and used large sockets, all of which made the PCB less obviously advantageous than with later complex semiconductor circuits. Point-to-point construction is still used to construct prototype equipment with few or heavy electronic components.
The history of computing hardware covers the developments from early simple devices to aid calculation to modern day computers. Before the 20th century, most calculations were done by humans. Early mechanical tools to help humans with digital calculations, like the abacus, were called "calculating machines", called by proprietary names, or referred to as calculators. The machine operator was called the computer.
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In industry, it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board, with the through-hole technology used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.
Components with wire leads are generally used on through-hole boards. Axial leads protrude from each end of a typically cylindrical or elongated box-shaped component, on the geometrical axis of symmetry. Axial-leaded components resemble wire jumpers in shape, and can be used to span short distances on a board, or even otherwise unsupported through an open space in point-to-point wiring. Axial components do not protrude much above the surface of a board, producing a low-profile or flat configuration when placed "lying down" or parallel to the board.
Radial leads project more or less in parallel from the same surface or aspect of a component package, rather than from opposite ends of the package. Originally, radial leads were defined as more-or-less following a radius of a cylindrical component (such as a ceramic disk capacitor).Over time, this definition was generalized in contrast to axial leads, and took on its current form. When placed on a board, radial components "stand up" perpendicular, occupying a smaller footprint on sometimes-scarce "board real estate", making them useful in many high-density designs. The parallel leads projecting from a single mounting surface gives radial components an overall "plugin nature", facilitating their use in high-speed automated component insertion ("board-stuffing") machines.
In classical geometry, a radius of a circle or sphere is any of the line segments from its center to its perimeter, and in more modern usage, it is also their length. The name comes from the Latin radius, meaning ray but also the spoke of a chariot wheel. The plural of radius can be either radii or the conventional English plural radiuses. The typical abbreviation and mathematical variable name for radius is r. By extension, the diameter d is defined as twice the radius:
A ceramic capacitor is a fixed-value capacitor where the ceramic material acts as the dielectric. It is constructed of two or more alternating layers of ceramic and a metal layer acting as the electrodes. The composition of the ceramic material defines the electrical behavior and therefore applications. Ceramic capacitors are divided into two application classes:
When needed, an axial component can be effectively converted into a radial component, by bending one of its leads into a "U" shape so that it ends up close to and parallel with the other lead.Extra insulation with heat-shrink tubing may be used to prevent shorting out on nearby components. Conversely, a radial component can be pressed into service as an axial component by separating its leads as far as possible, and extending them into an overall length-spanning shape. These improvisations are often seen in breadboard or prototype construction, but are deprecated for mass production designs. This is because of difficulties in use with automated component placement machinery, and poorer reliability because of reduced vibration and mechanical shock resistance in the completed assembly.
Heat-shrink tubing is a shrinkable plastic tube used to insulate wires, providing abrasion resistance and environmental protection for stranded and solid wire conductors, connections, joints and terminals in electrical work. It can also be used to repair the insulation on wires or to bundle them together, to protect wires or small parts from minor abrasion, and to create cable entry seals, offering environmental sealing protection. Heat-shrink tubing is ordinarily made of nylon or polyolefin, which shrinks radially when heated, to between one-half and one-sixth of its diameter.
A short circuit is an electrical circuit that allows a current to travel along an unintended path with no or a very low electrical impedance. This results in an excessive amount of current flowing into the circuit. The electrical opposite of a short circuit is an "open circuit", which is an infinite resistance between two nodes. It is common to misuse "short circuit" to describe any electrical malfunction, regardless of the actual problem.
A breadboard is a construction base for prototyping of electronics. Originally it was literally a bread board, a polished piece of wood used for slicing bread. In the 1970s the solderless breadboard became available and nowadays the term "breadboard" is commonly used to refer to these.
For electronic components with two or more leads, for example diodes, transistors, ICs or resistor packs, a range of standard-sized semiconductor packages are used, either directly onto the PCB or via a socket.
While through-hole mounting provides strong mechanical bonds when compared to SMT techniques, the additional drilling required makes the boards more expensive to produce. They also limit the available routing area for signal traces on layers immediately below the top layer on multilayer boards since the holes must pass through all layers to the opposite side. To that end, through-hole mounting techniques are now usually reserved for bulkier or heavier components such as electrolytic capacitors or semiconductors in larger packages such as the TO-220 that require the additional mounting strength, or for components such as plug connectors or electromechanical relays that require great strength in support.
Design engineers often prefer the larger through-hole rather than surface mount parts when prototyping, because they can be easily used with breadboard sockets. However, high-speed or high-frequency designs may require SMT technology to minimize stray inductance and capacitance in wire leads, which would impair circuit function. Ultra-compact designs may also dictate SMT construction, even in the prototype phase of design.
In microelectronics, a dual in-line package, or dual in-line pin package (DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads ; eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density packages. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages.
Stripboard is the generic name for a widely used type of electronics prototyping board characterized by a 0.1 inches (2.54 mm) regular (rectangular) grid of holes, with wide parallel strips of copper cladding running in one direction all the way across one side of the board. It is commonly also known by the name of the original product Veroboard, which is a trademark, in the UK, of British company Vero Technologies Ltd and Canadian company Pixel Print Ltd. In using the board, breaks are made in the tracks, usually around holes, to divide the strips into multiple electrical nodes. With care, it is possible to break between holes to allow for components that have two pin rows only one position apart such as twin row headers for IDCs.
In electronics, desoldering is the removal of solder and components from a circuit board for troubleshooting, repair, replacement, and salvage.
Wave soldering is a bulk soldering process used in the manufacture of printed circuit boards. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit board makes contact with this wave, the components become soldered to the board. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount. In the latter case, the components are glued onto the surface of a printed circuit board (PCB) by placement equipment, before being run through the molten solder wave. Wave soldering is mainly used in soldering of through hole components.
SMT component placement systems, commonly called pick-and-place machines or P&Ps, are robotic machines which are used to place surface-mount devices (SMDs) onto a printed circuit board (PCB). They are used for high speed, high precision placing of broad range of electronic components, like capacitors, resistors, integrated circuits onto the PCBs which are in turn used in computers, consumer electronics as well as industrial, medical, automotive, military and telecommunications equipment. Similar equipment exists for through hole components. This type of equipment is sometimes also used to package microchips using the flip chip method.
A via or VIA is an electrical connection between layers in a physical electronic circuit that goes through the plane of one or more adjacent layers. To ensure via robustness, IPC sponsored a round-robin exercise that developed a time to failure calculator.
Selective soldering is the process of selectively soldering components to printed circuit boards and molded modules that could be damaged by the heat of a reflow oven or wave soldering in a traditional surface-mount technology (SMT) or Through-hole technology assembly processes.This usually follows an SMT oven reflow process; parts to be selectively soldered are usually surrounded by parts that have been previously soldered in a surface-mount reflow process, and the selective-solder process must be sufficiently precise to avoid damaging them.
Perfboard is a material for prototyping electronic circuits. It is a thin, rigid sheet with holes pre-drilled at standard intervals across a grid, usually a square grid of 0.1 inches (2.54 mm) spacing. These holes are ringed by round or square copper pads, though bare boards are also available. Inexpensive perfboard may have pads on only one side of the board, while better quality perfboard can have pads on both sides. Since each pad is electrically isolated, the builder makes all connections with either wire wrap or miniature point to point wiring techniques. Discrete components are soldered to the prototype board such as resistors, capacitors, and integrated circuits. The substrate is typically made of paper laminated with phenolic resin or a fiberglass-reinforced epoxy laminate (FR-4).
Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) manufacture where a camera autonomously scans the device under test for both catastrophic failure and quality defects. It is commonly used in the manufacturing process because it is a non-contact test method. It is implemented at many stages through the manufacturing process including bare board inspection, solder paste inspection (SPI), pre-reflow and post-reflow as well as other stages.
A zero-ohm link or zero-ohm resistor is a wire link used to connect traces on a printed circuit board that is packaged in the same physical package format as a resistor. This format allows it to be placed on the circuit board using the same automated equipment used to place other resistors, instead of requiring a separate machine to install a jumper or other wire. Zero-ohm resistors may be packaged like cylindrical resistors, or like surface-mount resistors.
The Occam process is a solder-free, Restriction of Hazardous Substances Directive (RoHS)-compliant method for use in the manufacturing of electronic circuit boards developed by Verdant Electronics. It combines the usual two steps of the construction of printed circuit boards (PCBs) followed by the population process of placing various leaded and non-leaded electronic components into one process.
An insertion mount machine or inserter is a device used to insert the leads of electronic components through holes in printed circuit boards.
Veroboard is a brand of stripboard, a pre-formed circuit board material of copper strips on an insulating bonded paper board which was originated and developed in the early 1960s by the Electronics Department of Vero Precision Engineering Ltd (VPE). It was introduced as a general-purpose material for use in constructing electronic circuits - differing from purpose-designed printed circuit boards (PCBs) in that a variety of electronics circuits may be constructed using a standard wiring board.
Onanon is a design, engineering and manufacturing company specializing in the automating panel array manufacturing process, which can produce multiple units in a single session. The company utilizes engineered plastics for manufacturing, using high-speed machinery and automation to produce connectors in large batches. The process removes the need for human handling, thus reducing the probability of error. Onanon utilizes printed circuit boards as a base to add other components. Headquartered in Milpitas, California, Onanon is the first company to introduce a PC board as a connector pin substrate, a technique which is considered standard today but was seen as revolutionary at the time.