Mini Small Outline Package

A surface-mount IC in the MSOP form-factor

The Mini Small Outline Package (MSOP) is a miniaturized version of the small outline integrated circuit packaging format for integrated circuits. Some vendors, e.g. Texas Instruments, refer to this form factor as Very Thin Shrink Small Outline Package (VSSOP). ^[1]

Application

Many integrated circuits are available in the MSOP form factor. They are suited for space-limited applications requiring 1 mm or less mounted height and are commonly used in disk drives, video/audio and consumer electronics. ^[2]

Physical properties

The size of the Mini Small Outline Package is only 3mm × 3mm for the 8 and 10 pin versions ^[2] and 3mm × 4mm for the 12 and 16 pin version. ^{[3] [4]} The small package offers a small footprint, short wires for improved electrical connections, and good moisture reliability. ^[2] Some versions have an exposed pad on the bottom side. The exposed pad will be soldered on the PCB to transfer heat from the package to the PCB. ^{[3] [2]}

Package	Pins	Body width (mm)	Body length (mm)	Lead pitch (mm)
MSOP8	8	3	3	0.65
MSOP10	10	3	3	0.5
MSOP12	12	3	4	0.65
MSOP16	16	3	4	0.5

Synonyms

• μMAX or micro max - Maxim name for the MSOP package. ^{[5] [3]}
• μMAX-EP or micro max exposed pad - Maxim name for the MSOP package with exposed pad. ^{[3] [5]}
• MSE - Linear Technology name for the MSOP package with exposed pad. ^[3]

See also

• List of electronic component packaging types

References

1. "Texas Instruments Packaging terminology". www.ti.com. Retrieved 6 January 2026.
2. "MSOP in STATS ChipPAC datasheet" . Retrieved 8 December 2020.
3. "MSOP on mbedded.ninja". blog.mbedded.ninja. Retrieved 8 December 2020.
4. "MSOP on EESemi.com". eesemi.com. Retrieved 8 December 2020.
5. "Package Information - Maxim Integrated". www.maximintegrated.com. Retrieved 2021-01-04.