The Mini Small Outline Package (MSOP) is a miniaturized version of the small outline integrated circuit packaging format for integrated circuits.
The Mini Small Outline Package (MSOP) is a miniaturized version of the small outline integrated circuit packaging format for integrated circuits.
Many integrated circuits are available in the MSOP form factor. They are suited for space-limited applications requiring 1 mm or less mounted height and are commonly used in disk drives, video/audio and consumer electronics. [1]
The size of the Mini Small Outline Package is only 3mm × 3mm for the 8 and 10 pin versions [1] and 3mm × 4mm for the 12 and 16 pin version. [2] [3] The small package offers a small footprint, short wires for improved electrical connections, and good moisture reliability. [1] Some versions have an exposed pad on the bottom side. The exposed pad will be soldered on the PCB to transfer heat from the package to the PCB. [2] [1]
| Part number | Pins | Body width (mm) | Body length (mm) | Lead pitch (mm) |
|---|---|---|---|---|
| MSOP8 | 8 | 3 | 3 | 0.65 |
| MSOP10 | 10 | 3 | 3 | 0.5 |
| MSOP12 | 12 | 3 | 4 | 0.65 |
| MSOP16 | 16 | 3 | 4 | 0.5 |
In microelectronics, a dual in-line package, is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads ; eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages.
A printed circuit board is a medium used in electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds vias: plated-through holes that allow interconnections between layers.
A DIMM, commonly called a RAM stick, comprises a series of dynamic random-access memory integrated circuits. These memory modules are mounted on a printed circuit board and designed for use in personal computers, workstations, printers, and servers. They are the predominant method for adding memory into a computer system. The vast majority of DIMMs are standardized through JEDEC standards, although there are proprietary DIMMs. DIMMs come in a variety of speeds and sizes, but generally are one of two lengths - PC which are 133.35 mm (5.25 in) and laptop (SO-DIMM) which are about half the size at 67.60 mm (2.66 in).
A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
The MultiMediaCard, officially abbreviated as MMC, is a memory card standard used for solid-state storage. Unveiled in 1997 by SanDisk and Siemens, MMC is based on a surface-contact low pin-count serial interface using a single memory stack substrate assembly, and is therefore much smaller than earlier systems based on high pin-count parallel interfaces using traditional surface-mount assembly such as CompactFlash. Both products were initially introduced using SanDisk NOR-based flash technology. MMC is about the size of a postage stamp: 32 mm × 24 mm × 1.4 mm. MMC originally used a 1-bit serial interface, but newer versions of the specification allow transfers of 4 or 8 bits at a time. MMC can be used in many devices that can use Secure Digital (SD) cards.
Stripboard is the generic name for a widely used type of electronics prototyping material for circuit boards characterized by a pre-formed 0.1 inches (2.54 mm) regular (rectangular) grid of holes, with wide parallel strips of copper cladding running in one direction all the way across one side of on an insulating bonded paper board. It is commonly also known by the name of the original product Veroboard, which is a trademark, in the UK, of British company Vero Technologies Ltd and Canadian company Pixel Print Ltd. It was originated and developed in the early 1960s by the Electronics Department of Vero Precision Engineering Ltd (VPE). It was introduced as a general-purpose material for use in constructing electronic circuits - differing from purpose-designed printed circuit boards (PCBs) in that a variety of electronics circuits may be constructed using a standard wiring board.
A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP).
The Zilog Z8 is a microcontroller architecture, originally introduced in 1979, which today also includes the Z8 Encore!, eZ8 Encore!, eZ8 Encore! XP, and eZ8 Encore! MC families.
Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile and have tight lead spacing.
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins. For example, a 14-pin 4011 would be housed in an SOIC-14 or SO-14 package.
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON, is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. Flat no-lead packages usually, but not always, include an exposed thermally conductive pad to improve heat transfer out of the IC. Heat transfer can be further facilitated by metal vias in the thermal pad. The QFN package is similar to the quad-flat package (QFP), and a ball grid array (BGA).
In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits. TO stands for "Transistor Outline" and relates to a series of technical drawings produced by JEDEC.
The Double Decawatt Package, D2PAK, SOT404 or DDPAK, standardized as TO-263, is a semiconductor package type intended for surface mounting on circuit boards. The TO-263 is designed by Motorola. They are similar to the earlier TO-220-style packages intended for high power dissipation but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package. As with all SMT packages, the pins on a D2PAK are bent to lie against the PCB surface. The TO-263 can have 3 to 7 terminals.
DipTrace is a software suite for electronic design automation (EDA) to create schematic diagrams and printed circuit board layouts. DipTrace has four modules: schematic capture editor, PCB layout editor with built-in shape-based autorouter and 3D preview, component editor, and pattern editor.
Lightning is a proprietary computer bus and power connector created and designed by Apple Inc. and introduced on September 12, 2012, to replace its predecessor, the 30-pin dock connector. The Lightning connector is used to connect Apple mobile devices like iPhones, iPads, and iPods to host computers, external monitors, cameras, USB battery chargers, and other peripherals. Using 8 pins instead of 30, Lightning is much smaller than its predecessor, which was integrated with devices like the iPhone 4 and the iPad 2. The Lightning plug is symmetrical, so it can be inserted into a Lightning receptacle in either orientation. The plug is indented on each side to match up with corresponding points inside the receptacle to retain the connection.
In microelectronics, a quad in-line package, is an electronic component package with a rectangular housing and four parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. Rockwell used a QIP with 42 leads formed into staggered rows for their PPS-4 microprocessor family introduced in 1973, and other microprocessors and microcontrollers, some with higher lead counts, through the early 1990s.
TO-252, also known as DPAK or Decawatt Package, is a semiconductor package developed by Motorola for surface mounting on circuit boards. It represents a surface-mount variant of TO-251 package, and smaller variant of the D2PAK package. It is often used for high-power MOSFETs and voltage regulators.
The NEC μCOM series is a series of microprocessors and microcontrollers manufactured by NEC in the 1970s and 1980s. The initial entries in the series were custom-designed 4 and 16-bit designs, but later models in the series were mostly based on the Intel 8080 and Zilog Z80 8-bit designs, and later, the Intel 8086 16-bit design. Most of the line was replaced in 1984 by the NEC V20, an Intel 8088 clone.
The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads.
