Release date | January 10, 2023 |
---|---|
Designed by | Intel |
Manufactured by | Lotes |
Type | LGA-ZIF |
Chip form factors | Flip-chip |
Contacts | 4677 |
FSB protocol | PCI Express (PCIe) Direct Media Interface (DMI) Ultra Path Interconnect (UPI) |
FSB frequency | 16 GT/s to 20 GT/s UPI |
Processor dimensions | 77.5 mm x 56.5 mm |
Processors | |
Predecessor | LGA 4189 |
Successor | LGA 7529 |
Memory support | DDR5 with ECC support |
This article is part of the CPU socket series |
LGA 4677 (Socket E) is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel, compatible with Sapphire Rapids server and workstation processors, which was released in January 2023. [1] [2] [3]
Chipset | ||||
---|---|---|---|---|
C741 | W790 | |||
Release date | January 2023 | March 2023 | ||
Price (USD) | $70 | $72 | ||
Overclocking | No | Yes | ||
Bus Interface | DMI 4.0 x8 | DMI 4.0 x8 | ||
CPU support | Sapphire Rapids-SP Emerald Rapids-SP | Sapphire Rapids-WS Sapphire Rapids-64L Sapphire Rapids-112L | ||
Socket count | 1s or 2S | 1S | ||
Memory capacity | Up to 4 TB with one CPU or 8 TB with two CPUs | Up to 2 TB (on W-2400 models) Up to 4 TB (on W-3400 models) | ||
Maximum DIMM slots | 16 (1 CPU) 32 (2 CPUs) | 8 (W-2400) 16 (W-3400) | ||
Maximum USB 2.0 ports | 14 | |||
USB 3.2 ports configuration | Gen 1 (5 Gbit/s) | 10 | 10 | |
Gen 2 | x1 (10 Gbit/s) | ? | 10 | |
x2 (20 Gbit/s) | ? | 5 | ||
Maximum SATA 3.0 ports | 20 | 8 | ||
Processor PCI Express configuration | 5.0 | Up to 80 lanes | Up to 112 lanes | |
4.0 | — | |||
PCH PCI Express configuration | 4.0 | — | 16 | |
3.0 | 20 | 12 | ||
Independent display support (digital ports/pipes) | ? | |||
Wireless | Integrated | No | Intel Wi-Fi 6E AX211 (Garfield Peak 2) | |
Discrete | Intel Wi-Fi 6E AX211 (Typhoon Peak 2) | |||
PCIe RAID support | ? | |||
SATA RAID support | ||||
Intel Optane Memory support | ||||
Intel Smart Sound Technology | No | Yes | ||
Intel Active Management, Trusted Execution and vPro Technology | Yes | |||
Chipset TDP | 11 W | 6 W | ||
Chipset package size | 22 mm × 23 mm 506 mm2 | 28 mm × 25 mm 700 mm2 | ||
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