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Xeon is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have advanced features such as support for error correction code (ECC) memory, higher core counts, more PCI Express lanes, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability (RAS) features responsible for handling hardware exceptions through the Machine Check Architecture (MCA). They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the machine-check exception (MCE). Some also support multi-socket systems with two, four, or eight sockets through use of the Ultra Path Interconnect (UPI) bus, which replaced the older QuickPath Interconnect (QPI) bus.
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board.
Socket 604 is a 604-pin microprocessor socket designed to interface an Intel Xeon processor to the rest of the computer. It provides both an electrical interface as well as physical support. This socket is designed to support a heatsink.
Tick–tock was a production model adopted in 2007 by chip manufacturer Intel. Under this model, every new process technology was first used to manufacture a die shrink of a proven microarchitecture (tick), followed by a new microarchitecture on the now-proven process (tock). It was replaced by the process–architecture–optimization model, which was announced in 2016 and is like a tick–tock cycle followed by an optimization phase. More generally, tick–tock is an engineering model which refreshes one half of a binary system each release cycle.
The Platform Controller Hub (PCH) is a family of Intel's single-chip chipsets, first introduced in 2009. It is the successor to the Intel Hub Architecture, which used two chips–a northbridge and southbridge, and first appeared in the Intel 5 Series.
LGA 2011, also called Socket R, is a CPU socket by Intel released on November 14, 2011. It launched along with LGA 1356 to replace its predecessor, LGA 1366 and LGA 1567. While LGA 1356 was designed for dual-processor or low-end servers, LGA 2011 was designed for high-end desktops and high-performance servers. The socket has 2011 protruding pins that touch contact points on the underside of the processor.
Skylake is Intel's codename for its sixth generation Core microprocessor family that was launched on August 5, 2015, succeeding the Broadwell microarchitecture. Skylake is a microarchitecture redesign using the same 14 nm manufacturing process technology as its predecessor, serving as a tock in Intel's tick–tock manufacturing and design model. According to Intel, the redesign brings greater CPU and GPU performance and reduced power consumption. Skylake CPUs share their microarchitecture with Kaby Lake, Coffee Lake, Whiskey Lake, and Comet Lake CPUs.
Ice Lake is Intel's codename for the 10th generation Intel Core mobile and 3rd generation Xeon Scalable server processors based on the Sunny Cove microarchitecture. Ice Lake represents an Architecture step in Intel's process–architecture–optimization model. Produced on the second generation of Intel's 10 nm process, 10 nm+, Ice Lake is Intel's second microarchitecture to be manufactured on the 10 nm process, following the limited launch of Cannon Lake in 2018. However, Intel altered their naming scheme in 2020 for the 10 nm process. In this new naming scheme, Ice Lake's manufacturing process is called simply 10 nm, without any appended pluses.
LGA 3647 is an Intel microprocessor compatible socket used by Xeon Phi x200, Xeon Phi 72x5, Skylake-SP, Cascade Lake-SP, and Cascade Lake-W microprocessors.
Epyc is a brand of multi-core x86-64 microprocessors designed and sold by AMD, based on the company's Zen microarchitecture. Introduced in June 2017, they are specifically targeted for the server and embedded system markets.
Sapphire Rapids is a codename for Intel's server and workstation processors based on the Golden Cove microarchitecture and produced using Intel 7. It features up to 60 cores and an array of accelerators, and it is the first generation of Intel server and workstation processors to use a chiplet design.
Cooper Lake is Intel's codename for the third-generation of their Xeon Scalable processors, developed as the successor to Cascade Lake-SP. Cooper Lake processors are targeted at the 4S and 8S segments of the server market; Ice Lake-SP serves the 1S and 2S segment.
LGA 1700 is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake, which was first released in November 2021.
Sierra Forest is the codename for sixth generation Xeon Scalable server processors designed by Intel, launched in June 2024. It is the first generation of Xeon processors to exclusively feature density-optimized E-cores. Sierra Forest processors are targeted towards cloud server customers with up to 288 Crestmont E-cores.
Granite Rapids is the codename for 6th generation Xeon Scalable server processors designed by Intel, launched on 24 September 2024. Featuring up to 128 P-cores, Granite Rapids is designed for high performance computing applications. The platform equivalent Sierra Forest processors with up to 288 E-cores launched in June 2024 before Granite Rapids.
LGA 4677 is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel, compatible with Sapphire Rapids server and workstation processors, which was released in January 2023.
LGA 7529 is a zero insertion force flip-chip land grid array (LGA) socket designed by Intel which supports the Sierra Forest line of E-core only Xeon processors, designed for heavily multithreaded cloud workloads, as well as the Granite Rapids line of P-core only Xeon microprocessors, designed for mainstream usage. The socket is also expected to support the mainstream successor to Granite Rapids, Diamond Rapids. The first pictures of the Intel Birch Stream platform were posted on January 31, 2023, by Yuuki_Ans. They showcased a dual LGA 7529 socket engineering sample motherboard.
References
- ↑ Hruska, Joel (June 22, 2020). "Intel Launches Cooper Lake With New AI, Increased Bandwidth, 2nd Gen Optane". ExtremeTech. Retrieved August 22, 2020.
- ↑ Shilov, Anton; Cutress, Ian (August 8, 2018). "Intel Server Roadmap: 14nm Cooper Lake in 2019, 10nm Ice Lake in 2020". AnandTech. Retrieved September 3, 2018.
- ↑ Kennedy, Patrick (March 16, 2020). "Intel Cooper Lake Rationalized Still Launching 1H 2020". ServeTheHome. Retrieved April 16, 2021.
- ↑ "LGA 4189 is the Latest Socket for Intel's Next Generation of Xeon CPUs". TechPowerUp. September 3, 2019. Retrieved November 9, 2021.
- ↑ "Intel Launches Its Most Advanced Performance Data Center Platform". Intel Newsroom. April 6, 2021. Retrieved November 19, 2022.
- ↑ "How to Install an Intel® Xeon® Processor into an LGA4189 Socket". Intel. June 25, 2021. Retrieved November 19, 2022.
- ↑ Kennedy, Patrick (February 25, 2021). "Installing a 3rd Generation Intel Xeon Scalable LGA4189 CPU and Cooler". ServeTheHome. Retrieved November 19, 2022.
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