Related Research Articles
Xeon is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have advanced features such as support for ECC memory, higher core counts, more PCI Express lanes, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability (RAS) features responsible for handling hardware exceptions through the Machine Check Architecture. They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the machine-check exception (MCE). Some also support multi-socket systems with two, four, or eight sockets through use of the Ultra Path Interconnect (UPI) bus.
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board.
Socket 604 is a 604-pin microprocessor socket designed to interface an Intel's Xeon processor to the rest of the computer. It provides both an electrical interface as well as physical support. This socket is designed to support a heatsink.
Tick–tock was a production model adopted in 2007 by chip manufacturer Intel. Under this model, every microarchitecture change (tock) was followed by a die shrink of the process technology (tick). It was replaced by the process–architecture–optimization model, which was announced in 2016 and is like a tick–tock cycle followed by an optimization phase. As a general engineering model, tick–tock is a model that refreshes one side of a binary system each release cycle.
LGA 2011, also called Socket R, is a CPU socket by Intel released on November 14, 2011. It launched along with LGA 1356 to replace its predecessor, LGA 1366 and LGA 1567. While LGA 1356 was designed for dual-processor or low-end servers, LGA 2011 was designed for high-end desktops and high-performance servers. The socket has 2011 protruding pins that touch contact points on the underside of the processor.
Skylake is the codename used by Intel for a processor microarchitecture that was launched in August 2015 succeeding the Broadwell microarchitecture. Skylake is a microarchitecture redesign using the same 14 nm manufacturing process technology as its predecessor, serving as a tock in Intel's tick–tock manufacturing and design model. According to Intel, the redesign brings greater CPU and GPU performance and reduced power consumption. Skylake CPUs share their microarchitecture with Kaby Lake, Coffee Lake, Cannon Lake, Whiskey Lake, and Comet Lake CPUs.
Ivy Bridge is the codename for Intel's 22 nm microarchitecture used in the third generation of the Intel Core processors. Ivy Bridge is a die shrink to 22 nm process based on FinFET ("3D") Tri-Gate transistors, from the former generation's 32 nm Sandy Bridge microarchitecture—also known as tick–tock model. The name is also applied more broadly to the Xeon and Core i7 Ivy Bridge-E series of processors released in 2013.
Broadwell is the fifth generation of the Intel Core Processor. It is Intel's codename for the 14 nanometer die shrink of its Haswell microarchitecture. It is a "tick" in Intel's tick–tock principle as the next step in semiconductor fabrication. Like some of the previous tick-tock iterations, Broadwell did not completely replace the full range of CPUs from the previous microarchitecture (Haswell), as there were no low-end desktop CPUs based on Broadwell.
Kaby Lake is Intel's codename for its seventh generation Core microprocessor family announced on August 30, 2016. Like the preceding Skylake, Kaby Lake is produced using a 14 nanometer manufacturing process technology. Breaking with Intel's previous "tick–tock" manufacturing and design model, Kaby Lake represents the optimized step of the newer process–architecture–optimization model. Kaby Lake began shipping to manufacturers and OEMs in the second quarter of 2016, with its desktop chips officially launched in January 2017.
Ice Lake is Intel's codename for the 10th generation Intel Core mobile and 3rd generation Xeon Scalable server processors based on the Sunny Cove microarchitecture. Ice Lake represents an Architecture step in Intel's Process-Architecture-Optimization model. Produced on the second generation of Intel's 10 nm process, 10 nm+, Ice Lake is Intel's second microarchitecture to be manufactured on the 10 nm process, following the limited launch of Cannon Lake in 2018. However, Intel altered their naming scheme in 2020 for the 10 nm process. In this new naming scheme, Ice Lake's manufacturing process is called simply 10 nm, without any appended pluses.
LGA 3647 is an Intel microprocessor compatible socket used by Xeon Phi x200, Xeon Phi 72x5, Skylake-SP, Cascade Lake-SP/AP, and Cascade Lake-W microprocessors.
Epyc is a brand of multi-core x86-64 microprocessors designed and sold by AMD, based on the company's Zen microarchitecture. Introduced in June 2017, they are specifically targeted for the server and embedded system markets. Epyc processors share the same microarchitecture as their regular desktop-grade counterparts, but have enterprise-grade features such as higher core counts, more PCI Express lanes, support for larger amounts of RAM, and larger cache memory. They also support multi-chip and dual-socket system configurations by using the Infinity Fabric interconnect.
Sapphire Rapids is a codename for Intel's server and workstation processors based on Intel 7.
Comet Lake is Intel's codename for its 10th generation Core microprocessors. They are manufactured using Intel's third 14 nm Skylake process refinement, succeeding the Whiskey Lake U-series mobile processor and Coffee Lake desktop processor families. Intel announced low-power mobile Comet Lake-U CPUs on August 21, 2019, H-series mobile CPUs on April 2, 2020, desktop Comet Lake-S CPUs April 30, 2020, and Xeon W-1200 series workstation CPUs on May 13, 2020. Comet Lake processors and Ice Lake 10 nm processors are together branded as the Intel "10th Generation Core" family. Intel officially launched Comet Lake-Refresh CPUs on the same day as 11th Gen Core Rocket Lake launch. The low-power mobile Comet Lake-U Core and Celeron 5205U CPUs were discontinued on July 7, 2021.
Cooper Lake is Intel's codename for the third-generation of their Xeon scalable processors, developed as the successor to Cascade Lake. Cooper Lake processors are targeted at the 4S and 8S segments of the server market; Ice Lake-SP serves the 1S and 2S segment.
LGA 1700 is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake, which was first released in November 2021.
Emerald Rapids is a codename for Intel's fifth generation Xeon server processors based on the Intel 7 node. Emerald Rapids CPUs are designed for data centers; the roughly contemporary Raptor Lake is intended for the wider public. Nevine Nassif is a chief engineer for this generation.
Sierra Forest is a codename for Intel's first generation E-core based Xeon server processors. It is fabricated using Intel's Intel 3 process and compatible with the LGA 7529 socket.
LGA 4677 is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel, compatible with Sapphire Rapids server and workstation processors, which was released in January 2023.
References
- ↑ Hruska, Joel (June 22, 2020). "Intel Launches Cooper Lake With New AI, Increased Bandwidth, 2nd Gen Optane". ExtremeTech. Retrieved August 22, 2020.
- ↑ Shilov, Anton; Cutress, Ian (August 8, 2018). "Intel Server Roadmap: 14nm Cooper Lake in 2019, 10nm Ice Lake in 2020". AnandTech. Retrieved September 3, 2018.
- ↑ Kennedy, Patrick (March 16, 2020). "Intel Cooper Lake Rationalized Still Launching 1H 2020". ServeTheHome. Retrieved April 16, 2021.
- ↑ "LGA 4189 is the Latest Socket for Intel's Next Generation of Xeon CPUs". TechPowerUp. September 3, 2019. Retrieved November 9, 2021.
- ↑ "Intel Launches Its Most Advanced Performance Data Center Platform". Intel Newsroom. April 6, 2021. Retrieved November 19, 2022.
- ↑ "How to Install an Intel® Xeon® Processor into an LGA4189 Socket". Intel. June 25, 2021. Retrieved November 19, 2022.
- ↑ Kennedy, Patrick (February 25, 2021). "Installing a 3rd Generation Intel Xeon Scalable LGA4189 CPU and Cooler". ServeTheHome. Retrieved November 19, 2022.