The System Management Bus is a single-ended simple two-wire bus for the purpose of lightweight communication. Most commonly it is found in chipsets of computer motherboards for communication with the power source for ON/OFF instructions. The exact functionality and hardware interfaces vary with vendors.
The Khronos Group, Inc. is an open, non-profit, member-driven consortium of 170 organizations developing, publishing and maintaining royalty-free interoperability standards for 3D graphics, virtual reality, augmented reality, parallel computation, vision acceleration and machine learning. The open standards and associated conformance tests enable software applications and middleware to effectively harness authoring and accelerated playback of dynamic media across a wide variety of platforms and devices. The group is based in Beaverton, Oregon.
OMAP is a family of image/video processors that was developed by Texas Instruments. They are proprietary system on chips (SoCs) for portable and mobile multimedia applications. OMAP devices generally include a general-purpose ARM architecture processor core plus one or more specialized co-processors. Earlier OMAP variants commonly featured a variant of the Texas Instruments TMS320 series digital signal processor.
A smart battery or a smart battery pack is a rechargeable battery pack with a built-in battery management system (BMS), usually designed for use in a portable computer such as a laptop. In addition to the usual positive and negative terminals, a smart battery has two or more terminals to connect to the BMS; typically the negative terminal is also used as BMS "ground". BMS interface examples are: SMBus, PMBus, EIA-232, EIA-485, and Local Interconnect Network.
The WiMedia Alliance was a non-profit industry trade group that promoted the adoption, regulation, standardization and multi-vendor interoperability of ultra-wideband (UWB) technologies. It existed from about 2002 through 2009.
The DigRF working group was formed as a MIPI Alliance (MIPI) working group in April 2007. The group is focused on developing specifications for wireless mobile RFIC to base-band IC (BBIC) interfaces in mobile devices.
Universal Flash Storage (UFS) is a flash storage specification for digital cameras, mobile phones and consumer electronic devices. It was designed to bring higher data transfer speed and increased reliability to flash memory storage, while reducing market confusion and removing the need for different adapters for different types of cards. The standard encompasses both packages permanently embedded within a device (eUFS), and removable UFS memory cards.
The Display Serial Interface (DSI) is a specification by the Mobile Industry Processor Interface (MIPI) Alliance aimed at reducing the cost of display controllers in a mobile device. It is commonly targeted at LCD and similar display technologies. It defines a serial bus and a communication protocol between the host, the source of the image data, and the device which is the destination. The interface is closed source, which means that the specification of the interface is not open to the public. The maintenance of the interface is the responsibility of the MIPI Alliance. Only legal entities can be members. These members or the persons commissioned and approved by them have access to the specification in order to use it in their possible applications.
UniPro is a high-speed interface technology for interconnecting integrated circuits in mobile and mobile-influenced electronics. The various versions of the UniPro protocol are created within the MIPI Alliance, an organization that defines specifications targeting mobile and mobile-influenced applications.
The Serial Low-power Inter-chip Media Bus (SLIMbus) is a standard interface between baseband or application processors and peripheral components in mobile terminals. It was developed within the MIPI Alliance, founded by ARM, Nokia, STMicroelectronics and Texas Instruments. The interface supports many digital audio components simultaneously, and carries multiple digital audio data streams at differing sample rates and bit widths.
Mobile Display Digital Interface (MDDI) is a high-speed digital interface developed by Qualcomm to interconnect the upper and lower clamshell in a flip phone. The MDDI solution supports variable data rates of up to 3.2 Gbit/s, and decreases the number of signals that connect the digital baseband controller with the LCD and camera.
The Wireless Gigabit Alliance was a trade association that developed and promoted the adoption of multi-gigabit per second speed wireless communications technology "WiGig" operating over the unlicensed 60 GHz frequency band. The alliance was subsumed by the Wi-Fi Alliance in March 2013.
The RVU Alliance (RVUA) is a standards body created to manage the RVU protocol standard as used by manufacturers of consumer electronics to allow entertainment devices within the home to share their content with each other across a home network.
Linaro is an engineering organization that works on free and open-source software such as the Linux kernel, the GNU Compiler Collection (GCC), QEMU, power management, graphics and multimedia interfaces for the ARM family of instruction sets and implementations thereof as well as for the Heterogeneous System Architecture (HSA). The company provides a collaborative engineering forum for companies to share engineering resources and funding to solve common problems on ARM software. In addition to Linaro's collaborative engineering forum, Linaro also works with companies on a one-to-one basis through its Services division.
Power Matters Alliance (PMA) was a global, not-for-profit, industry organization whose mission was to advance a suite of standards and protocols for wireless power transfer for mobile electronic devices. The organization was merged with Alliance for Wireless Power (A4WP) in 2015 to form AirFuel Alliance.
MIPI Alliance Debug Architecture provides a standardized infrastructure for debugging deeply embedded systems in the mobile and mobile-influenced space. The MIPI Alliance MIPI Debug Working Group has released a portfolio of specifications; their objective is to provide standard debug protocols and standard interfaces from a system on a chip (SoC) to the debug tool. The whitepaper Architecture Overview for Debug summarizes all the efforts. In recent years, the group focused on specifying protocols that improve the visibility of the internal operations of deeply embedded systems, standardizing debug solutions via the functional interfaces of form factor devices, and specifying the use of I3C as debugging bus.
The Camera Serial Interface (CSI) is a specification of the Mobile Industry Processor Interface (MIPI) Alliance. It defines an interface between a camera and a host processor.
I3C, also known as SenseWire, is a specification to enable communication between computer chips by defining the electrical connection between the chips and signaling patterns to be used. Short for "Improved Inter Integrated Circuit", the standard defines the electrical connection between the chips to be a two wire, shared (multidrop), serial data bus, one wire (SCL) being used as a clock to define the sampling times, the other wire (SDA) being used as a data line whose voltage can be sampled. The standard defines a signalling protocol in which multiple chips can control communication and thereby act as the bus controller.
The System Power Management Interface (SPMI) is a high-speed, low-latency, bi-directional, two-wire serial bus suitable for real-time control of voltage and frequency scaled multi-core application processors and its power management of auxiliary components. SPMI obsoletes a number of legacy, custom point-to-point interfaces and provides a low pin count, high-speed control bus for up to 4 master and 16 slave devices. SPMI is specified by the MIPI Alliance.
M-PHY is a high speed data communications physical layer protocol standard developed by the MIPI Alliance, PHY Working group, and targeted at the needs of mobile multimedia devices. The specification's details are proprietary to MIPI member organizations, but a substantial body of knowledge can be assembled from open sources. A number of industry standard settings bodies have incorporated M-PHY into their specifications including Mobile PCI Express, Universal Flash Storage, and as the physical layer for SuperSpeed InterChip USB.
