Nemotek Technologie

Last updated
Nemotek Technologie
Type Private
Industry Semiconductor
Founded2008
Headquarters Morocco
Key people
CEO: José da Costa Gatta
Products Wafer-level Packaging (WLP)

Wafer-level optics (WLO)

Wafer-level cameras (WLC)

Nemotek Technologie is a Moroccan manufacturing company based in the Rabat Technopolis Park in Morocco, founded in May 2008.

Contents

Nemotek Technologie, funded by Caisse de dépôt et de gestion (CDG), manufactures customized wafer-level cameras for portable applications. [1] It provides customized design and manufacturing services of wafer-level packaging, [2] wafer-level optics and wafer-level cameras. [3] [4]

History

In July 2009, Nemotek Technologie announced a new WLP technology, which provides a true chip-scale package with a minimum thickness of only 400om. [5] The die size is ultra-small at just 0.6mm, which fits up to 40,000 dies per wafer. This solution is based on advanced WLP technology [6] and delivered based on Through Silicon Via (TSV) technology. It provides customers a thin, reliable, and more sophisticated imaging components for applications such as mobile camera phones, mobile computers, and other mobile devices used in medical or automotive. In October 2009, Nemotek announced the availability of its miniaturized Wafer-Level Camera (WLC) for portable applications. [7]

The company announced the development of a two-element VGA lens which was exhibited at the 2010 Mobile World Congress in Barcelona, Spain. A two-element lens is made when two optical wafers are processed and then bonded together. [8]

Most recently, Nemotek announced a one-element wider field of view lens for portable applications. The lens provides a field of view up to 65 degrees while traditional lenses tend to be limited to 60 degrees. [9] The announcement has attracted significant attention in the mobile camera market. The new lens further narrows the gap with standalone digital cameras. [10] The development is considered a milestone for Nemotek. [11]

Related Research Articles

<span class="mw-page-title-main">MEMS</span> Very small devices that incorporate moving components

MEMS is the technology of microscopic devices incorporating both electronic and moving parts. MEMS are made up of components between 1 and 100 micrometres in size, and MEMS devices generally range in size from 20 micrometres to a millimetre, although components arranged in arrays can be more than 1000 mm2. They usually consist of a central unit that processes data and several components that interact with the surroundings.

<span class="mw-page-title-main">Digital camera</span> Camera that captures photographs or video in digital format

A digital camera is a camera that captures photographs in digital memory. Most cameras produced today are digital, largely replacing those that capture images on photographic film. Digital cameras are now widely incorporated into mobile devices like smartphones with the same or more capabilities and features of dedicated cameras. High-end, high-definition dedicated cameras are still commonly used by professionals and those who desire to take higher-quality photographs.

<span class="mw-page-title-main">Smartphone</span> Handheld mobile device

A smartphone is a portable computer device that combines mobile telephone functions and personal computing functions into one unit. They are distinguished from older-design feature phones by their more advanced hardware capabilities and extensive mobile operating systems, which facilitate wider software, access to the internet, and multimedia functionality, alongside core phone functions such as voice calls and text messaging. Smartphones typically contain a number of metal–oxide–semiconductor (MOS) integrated circuit (IC) chips, include various sensors that can be leveraged by pre-installed and third-party software, and support wireless communication protocols. More recently, smartphone manufacturers have begun to integrate satellite messaging connectivity and satellite emergency services into devices for use in remote regions where there is no reliable cellular network.

<span class="mw-page-title-main">SD card</span> Type of memory storage for portable devices

Secure Digital, officially abbreviated as SD, is a proprietary, non-volatile, flash memory card format the SD Association (SDA) developed for use in portable devices.

<span class="mw-page-title-main">Camera phone</span> Mobile phone which is able to capture still photographs and usually also videos

A camera phone is a mobile phone which is able to capture photographs and often record video using one or more built-in digital cameras. It can also send the resulting image wirelessly and conveniently. The first commercial phone with color camera was the Kyocera Visual Phone VP-210, released in Japan in May 1999.

<span class="mw-page-title-main">Handheld projector</span> Image projector in a handheld device

A handheld projector is an image projector in a handheld device. It was developed as a computer display device for compact portable devices such as mobile phones, personal digital assistants, and digital cameras, which have sufficient storage capacity to handle presentation materials but are too small to accommodate a display screen that an audience can see easily. Handheld projectors involve miniaturized hardware, and software that can project digital images onto a nearby viewing surface.

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A three-dimensional integrated circuit is a MOS integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.

<span class="mw-page-title-main">Microlens</span> Small lens, generally with a diameter less than a millimetre

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<span class="mw-page-title-main">Wafer-level packaging</span> Means of packaging an integrated circuit

Wafer-level packaging (WLP) is a process where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WSP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer. This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components are attached.

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Advanced Semiconductor Engineering, Inc., also known as ASE Group, is a provider of independent semiconductor assembling and test manufacturing services, with its headquarters in Kaohsiung, Taiwan.

<span class="mw-page-title-main">Fan-out wafer-level packaging</span>

Fan-out wafer-level packaging is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions.

The Samsung Galaxy A60 and Samsung Galaxy M40 are Android phablets manufactured by Samsung Electronics as part of its fifth-generation Galaxy A series lineup and first-generation Galaxy M series lineup. The phones feature Android 9 (Pie) with Samsung's proprietary One UI skin, 64 or 128 GB of internal storage, and a 3500 mAh battery. The A60 is marketed for China, while the M40 is marketed for India and other countries. The A60 and M40 are identical except for colors, pricing, RAM and LTE bands. The A60 was unveiled on April 17, 2019, while the M40 was unveiled on June 11, 2019.

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References

  1. Bulabois, Nicolas. "I-Micronews, market research reports, reverse engineering, cost simulation in all domains". www.i-micronews.com. Retrieved 2017-08-24.
  2. "SUSS MicroTec: SUSS MicroTec Receives Multiple Orders from Nemotek Technologie for Wafer-Level Camera Production to use in Portable Applications". Archived from the original on 2010-02-02. Retrieved 2009-11-27.
  3. "Nemotek Technologie : Quotes, Address, Contact". AZoNano.com. Retrieved 2017-08-24.
  4. "Moroccan group first to use Tessera wafer level technology | EE Times". EETimes. Retrieved 2017-08-24.
  5. "Elmehdi CHAOUI GHALI (Nemotek Technologies à Morteau) - Viadeo". viadeo.journaldunet.com. Retrieved 2022-11-18.
  6. nanotechwire.com. "SUSS MicroTec Receives Multiple Orders from Nemotek Technologie for Wafer-Level Camera Production to use in Portable Applications, Products, SUSS MicroTec - NanoTechWire.com - The online resource for Nano Technology And Research". www.nanotechwire.com. Archived from the original on 2011-07-14. Retrieved 2017-08-24.
  7. "Nemotek Technologie Announces Miniaturized, Reflow Compatible Wafer-Level Camera Modules". Business Wire. 2009-10-13.
  8. "Nemotek Lenses To Shrink, Improve Cameras". www.image-acquire.com. Archived from the original on 2010-02-20.
  9. "News". Microwave Engineering Europe. Retrieved 2017-08-24.
  10. "Nemotek Designs Wider Field of View Lens for Mobile Phones". IntoMobile. 2010-04-19. Retrieved 2017-08-24.
  11. "Nemotek Designs Wider FOV Lens for Mobile Phones | Sensors Magazine". www.sensorsmag.com. Retrieved 2017-08-24.

See also