Rajiv Joshi

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Rajiv V. Joshi is an Indian-American prolific inventor and research staff member at IBM's Thomas J. Watson Research Center. His work focuses on the development of integrated circuits and memory chips. He is an IEEE Fellow [1] and received the Industrial Pioneer Award from the IEEE Circuits and Systems Society in 2013 [2] and the IEEE Daniel E. Noble Award in 2018. He holds 271 U.S. patents. [3]

Contents

Education

Joshi holds a bachelor of technology in mechanical engineering [4] from IIT Bombay. [5] He came to the United States in 1977 to pursue a master's degree at MIT and a doctoral degree at Columbia University. [6]

Technical Innovations

Integrated Circuit Interconnect

Dr. Joshi led innovation in new materials for integrated circuit interconnects, including refractory metals contacts, liners, and deposition techniques, chemical mechanical polishing processes, and large grain copper to prevent adverse effects. These inventions enabled replacement of conventional aluminum by copper and allowed achievement of multi-level wiring for further miniaturization of chips with low power. In state of the art microprocessors, there over 15 Billion transistors and over 50 km of Copper Interconnect.

Predictive Failure Analytics for Big Data

Joshi led development of many techniques for accelerating Predictive Analytics. This approach more rapidly estimates failure and optimizes the objective function. His techniques are 5-6 orders of magnitude faster than the conventional techniques which set the research across multiple CAD companies.

Advanced Integrated Circuit Memory

Joshi created several novel high speed memory innovations including MRAM, TRAM, IN-Memory computation enabling memory technology to scale beyond previously predicted Moore's Law limits, while improving bandwidth, performance and data movement.

Technology-Circuit Co-design

Joshi demonstrated the first high performance register file which helped to make the decision to change from bulk to SOI technology. Joshi demonstrated first time application of FinFET for low power and high performance SRAM and proposed strained non-planar devices. Such FinFETs are widely used in the industry.

Low Power Circuits

Joshi developed lower power circuits for energy efficient. Low power is essential for functionality and performance of VLSI Circuits . present/future Internet of everything (IOE) requires such techniques. Joshi's recent low power memory operating at 0.3V is an example. His work received wide spread publicity in EE Times.

Awards

Related Research Articles

<span class="mw-page-title-main">Integrated circuit</span> Electronic circuit formed on a small, flat piece of semiconductor material

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<span class="mw-page-title-main">Semiconductor device fabrication</span> Manufacturing process used to create integrated circuits

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<span class="mw-page-title-main">Very-large-scale integration</span> Creating an integrated circuit by combining many transistors into a single chip

Very-large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining millions or billions of MOS transistors onto a single chip. VLSI began in the 1970s when MOS integrated circuit chips were developed and then widely adopted, enabling complex semiconductor and telecommunication technologies. The microprocessor and memory chips are VLSI devices.

<span class="mw-page-title-main">CMOS</span> Technology for constructing integrated circuits

Complementary metal–oxide–semiconductor is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips, and other digital logic circuits. CMOS technology is also used for analog circuits such as image sensors, data converters, RF circuits, and highly integrated transceivers for many types of communication.

<span class="mw-page-title-main">Clock signal</span> Timing of electronic circuits

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A three-dimensional integrated circuit is a MOS integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.

In integrated circuits, optical interconnects refers to any system of transmitting signals from one part of an integrated circuit to another using light. Optical interconnects have been the topic of study due to the high latency and power consumption incurred by conventional metal interconnects in transmitting electrical signals over long distances, such as in interconnects classed as global interconnects. The International Technology Roadmap for Semiconductors (ITRS) has highlighted interconnect scaling as a problem for the semiconductor industry.

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References

  1. ↑ "Rajiv Joshi - Fellow". IEEE . Retrieved 16 November 2014.
  2. ↑ "IEEE Recognizes IBM Memory Researcher". Media & Entertainment Technologies. June 2013. Retrieved 29 September 2018.
  3. ↑ "US Patents with Rajiv Joshi as inventor as of 16 January 2016". Archived from the original on 13 January 2019. Retrieved 17 January 2016.
  4. ↑ Mozumder, Suman Guha (31 October 2014). "Rajiv Joshi, Krishan Sabnani in New Jersey Inventors Hall of Fame". India Abroad.
  5. ↑ "Indian unveils fastest chip". The Tribune . Chandigarh. 24 June 2000. Retrieved 29 September 2018.
  6. ↑ Babu, Chaya (19 July 2013). ""Thinking out of the box became natural to me"". India Abroad.
  7. ↑ Agencies (26 May 2020). "IIT Mumbai alumnus & IBM scientist Rajiv Joshi named Inventor of the Year". Business Standard India. Retrieved 26 May 2020.
  8. ↑ "Rajiv Joshi, CASS Board of Governors Member, wins the 2018 IEEE Daniel e. Noble Award for Emerging Technologies Award | IEEE CAS".
  9. ↑ "Indian American Rajiv Joshi wins the 2018 IEEE Daniel E. Noble Award for Emerging Technologies". The American Bazaar. 21 February 2018. Retrieved 26 May 2020.
  10. ↑ "THE 2016 WORLD TECHNOLOGY AWARD Winners and Finalists".
  11. ↑ Chakrabarty, Krishnendu; Alioto, Massimo (2016). "Editorial First TVLSI Best AE and Reviewer Awards". IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 24 (8): 2613. doi:10.1109/TVLSI.2016.2583178.
  12. ↑ "2014 Awardees".
  13. ↑ https://ieeexplore.ieee.org/author/37273934800 [ bare URL ]
  14. ↑ "ISQED Fellows".
  15. ↑ https://ieeexplore.ieee.org/author/37273934800 [ bare URL ]
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