The troposphere is the lowest layer of the atmosphere of Earth. It contains 80% of the total mass of the planetary atmosphere and 99% of the total mass of water vapor and aerosols, and is where most weather phenomena occur. From the planetary surface of the Earth, the average height of the troposphere is 18 km in the tropics; 17 km in the middle latitudes; and 6 km in the high latitudes of the polar regions in winter; thus the average height of the troposphere is 13 km.
In thermal fluid dynamics, the Nusselt number is the ratio of total heat transfer to conductive heat transfer at a boundary in a fluid. Total heat transfer combines conduction and convection. Convection includes both advection and diffusion (conduction). The conductive component is measured under the same conditions as the convective but for a hypothetically motionless fluid. It is a dimensionless number, closely related to the fluid's Rayleigh number.
The thermal conductivity of a material is a measure of its ability to conduct heat. It is commonly denoted by , , or and is measured in W·m−1·K−1.
The kinetic theory of gases is a simple classical model of the thermodynamic behavior of gases. It treats a gas as composed of numerous particles, too small to see with a microscope, which are constantly in random motion. Their collisions with each other and with the walls of their container are used to explain physical properties of the gas—for example, the relationship between its temperature, pressure, and volume. The particles are now known to be the atoms or molecules of the gas.
Thermal conduction is the diffusion of thermal energy (heat) within one material or between materials in contact. The higher temperature object has molecules with more kinetic energy; collisions between molecules distributes this kinetic energy until an object has the same kinetic energy throughout. Thermal conductivity, frequently represented by k, is a property that relates the rate of heat loss per unit area of a material to its rate of change of temperature. Essentially, it is a value that accounts for any property of the material that could change the way it conducts heat. Heat spontaneously flows along a temperature gradient. For example, heat is conducted from the hotplate of an electric stove to the bottom of a saucepan in contact with it. In the absence of an opposing external driving energy source, within a body or between bodies, temperature differences decay over time, and thermal equilibrium is approached, temperature becoming more uniform.
In the study of heat transfer, Newton's law of cooling is a physical law which states that the rate of heat loss of a body is directly proportional to the difference in the temperatures between the body and its environment. The law is frequently qualified to include the condition that the temperature difference is small and the nature of heat transfer mechanism remains the same. As such, it is equivalent to a statement that the heat transfer coefficient, which mediates between heat losses and temperature differences, is a constant.
In mathematics and physics, the heat equation is a certain partial differential equation. Solutions of the heat equation are sometimes known as caloric functions. The theory of the heat equation was first developed by Joseph Fourier in 1822 for the purpose of modeling how a quantity such as heat diffuses through a given region.
The Biot number (Bi) is a dimensionless quantity used in heat transfer calculations, named for the eighteenth-century French physicist Jean-Baptiste Biot (1774–1862). The Biot number is the ratio of the thermal resistance for conduction inside a body to the resistance for convection at the surface of the body. This ratio indicates whether the temperature inside a body varies significantly in space when the body is heated or cooled over time by a heat flux at its surface.
The lumped-element model is a simplified representation of a physical system or circuit that assumes all components are concentrated at a single point and their behavior can be described by idealized mathematical models. The lumped-element model simplifies the system or circuit behavior description into a topology. It is useful in electrical systems, mechanical multibody systems, heat transfer, acoustics, etc. This is in contrast to distributed parameter systems or models in which the behaviour is distributed spatially and cannot be considered as localized into discrete entities.
A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with other high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.
In thermodynamics, the heat transfer coefficient or film coefficient, or film effectiveness, is the proportionality constant between the heat flux and the thermodynamic driving force for the flow of heat. It is used in calculating the heat transfer, typically by convection or phase transition between a fluid and a solid. The heat transfer coefficient has SI units in watts per square meter per kelvin (W/m2K).
Used in hydrogeology, the groundwater flow equation is the mathematical relationship which is used to describe the flow of groundwater through an aquifer. The transient flow of groundwater is described by a form of the diffusion equation, similar to that used in heat transfer to describe the flow of heat in a solid. The steady-state flow of groundwater is described by a form of the Laplace equation, which is a form of potential flow and has analogs in numerous fields.
In thermal engineering, the logarithmic mean temperature difference (LMTD) is used to determine the temperature driving force for heat transfer in flow systems, most notably in heat exchangers. The LMTD is a logarithmic average of the temperature difference between the hot and cold feeds at each end of the double pipe exchanger. For a given heat exchanger with constant area and heat transfer coefficient, the larger the LMTD, the more heat is transferred. The use of the LMTD arises straightforwardly from the analysis of a heat exchanger with constant flow rate and fluid thermal properties.
HydroGeoSphere (HGS) is a 3D control-volume finite element groundwater model, and is based on a rigorous conceptualization of the hydrologic system consisting of surface and subsurface flow regimes. The model is designed to take into account all key components of the hydrologic cycle. For each time step, the model solves surface and subsurface flow, solute and energy transport equations simultaneously, and provides a complete water and solute balance.
Time-domain thermoreflectance is a method by which the thermal properties of a material can be measured, most importantly thermal conductivity. This method can be applied most notably to thin film materials, which have properties that vary greatly when compared to the same materials in bulk. The idea behind this technique is that once a material is heated up, the change in the reflectance of the surface can be utilized to derive the thermal properties. The reflectivity is measured with respect to time, and the data received can be matched to a model with coefficients that correspond to thermal properties.
Miniaturizing components has always been a primary goal in the semiconductor industry because it cuts production cost and lets companies build smaller computers and other devices. Miniaturization, however, has increased dissipated power per unit area and made it a key limiting factor in integrated circuit performance. Temperature increase becomes relevant for relatively small-cross-sections wires, where it may affect normal semiconductor behavior. Besides, since the generation of heat is proportional to the frequency of operation for switching circuits, fast computers have larger heat generation than slow ones, an undesired effect for chips manufacturers. This article summaries physical concepts that describe the generation and conduction of heat in an integrated circuit, and presents numerical methods that model heat transfer from a macroscopic point of view.
The transport of heat in solids involves both electrons and vibrations of the atoms (phonons). When the solid is perfectly ordered over hundreds of thousands of atoms, this transport obeys established physics. However, when the size of the ordered regions decreases new physics can arise, thermal transport in nanostructures. In some cases heat transport is more effective, in others it is not.
In heat transfer, thermal engineering, and thermodynamics, thermal conductance and thermal resistance are fundamental concepts that describe the ability of materials or systems to conduct heat and the opposition they offer to the heat current. The ability to manipulate these properties allows engineers to control temperature gradient, prevent thermal shock, and maximize the efficiency of thermal systems. Furthermore, these principles find applications in a multitude of fields, including materials science, mechanical engineering, electronics, and energy management. Knowledge of these principles is crucial in various scientific, engineering, and everyday applications, from designing efficient temperature control, thermal insulation, and thermal management in industrial processes to optimizing the performance of electronic devices.
In engineering, physics, and chemistry, the study of transport phenomena concerns the exchange of mass, energy, charge, momentum and angular momentum between observed and studied systems. While it draws from fields as diverse as continuum mechanics and thermodynamics, it places a heavy emphasis on the commonalities between the topics covered. Mass, momentum, and heat transport all share a very similar mathematical framework, and the parallels between them are exploited in the study of transport phenomena to draw deep mathematical connections that often provide very useful tools in the analysis of one field that are directly derived from the others.
The vaporizing droplet problem is a challenging issue in fluid dynamics. It is part of many engineering situations involving the transport and computation of sprays: fuel injection, spray painting, aerosol spray, flashing releases… In most of these engineering situations there is a relative motion between the droplet and the surrounding gas. The gas flow over the droplet has many features of the gas flow over a rigid sphere: pressure gradient, viscous boundary layer, wake. In addition to these common flow features one can also mention the internal liquid circulation phenomenon driven by surface-shear forces and the boundary layer blowing effect.
