Memory module

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Two types of DIMMs (dual in-line memory modules): a 168-pin SDRAM module (top) and a 184-pin DDR SDRAM module (bottom). DIMMs.jpg
Two types of DIMMs (dual in-line memory modules): a 168-pin SDRAM module (top) and a 184-pin DDR SDRAM module (bottom).

In computing, a memory module or RAM (random-access memory) stick is a printed circuit board on which memory integrated circuits are mounted. [1] Memory modules permit easy installation and replacement in electronic systems, especially computers such as personal computers, workstations, and servers. The first memory modules were proprietary designs that were specific to a model of computer from a specific manufacturer. Later, memory modules were standardized by organizations such as JEDEC and could be used in any system designed to use them.

Contents

Types of memory module include:

Distinguishing characteristics of computer memory modules include voltage, capacity, speed (i.e., bit rate), and form factor. For economic reasons, the large (main) memories found in personal computers, workstations, and non-handheld game-consoles (such as PlayStation and Xbox) normally consist of dynamic RAM (DRAM). Other parts of the computer, such as cache memories normally use static RAM (SRAM). Small amounts of SRAM are sometimes used in the same package as DRAM. [2] However, since SRAM has high leakage power and low density, die-stacked DRAM has recently been used for designing multi-megabyte sized processor caches. [3]

Physically, most DRAM is packaged in black epoxy resin.

General DRAM formats

A 256 x 4 Kibit 20-pin DIP DRAM on an early PC memory card, usually Industry Standard Architecture 256Kx4 DRAM.JPG
A 256 x 4 Kibit 20-pin DIP DRAM on an early PC memory card, usually Industry Standard Architecture
Common DRAM packages. From top to bottom: DIP, SIPP, SIMM (30-pin), SIMM (72-pin), DIMM (168-pin), DDR DIMM (184-pin). RAM n.jpg
Common DRAM packages. From top to bottom: DIP, SIPP, SIMM (30pin), SIMM (72pin), DIMM (168pin), DDR DIMM (184pin).
16 GiB DDR4-2666 288-pin 1.2 V UDIMMs 16 GiB-DDR4-RAM-Riegel RAM019FIX Small Crop 90 PCNT.png
16  GiB DDR4-2666 288-pin 1.2 V UDIMMs

Dynamic random access memory is produced as integrated circuits (ICs) bonded and mounted into plastic packages with metal pins for connection to control signals and buses. In early use individual DRAM ICs were usually either installed directly to the motherboard or on ISA expansion cards; later they were assembled into multi-chip plug-in modules (DIMMs, SIMMs, etc.). Some standard module types are:

Common DRAM modules

Common DRAM packages as illustrated to the right, from top to bottom (last three types are not present in the group picture, and the last type is available in a separate picture):

Common SO-DIMM DRAM modules:

Related Research Articles

<span class="mw-page-title-main">DDR SDRAM</span> Type of computer memory

Double Data Rate Synchronous Dynamic Random-Access Memory is a double data rate (DDR) synchronous dynamic random-access memory (SDRAM) class of memory integrated circuits used in computers. DDR SDRAM, also retroactively called DDR1 SDRAM, has been superseded by DDR2 SDRAM, DDR3 SDRAM, DDR4 SDRAM and DDR5 SDRAM. None of its successors are forward or backward compatible with DDR1 SDRAM, meaning DDR2, DDR3, DDR4 and DDR5 memory modules will not work on DDR1-equipped motherboards, and vice versa.

<span class="mw-page-title-main">Dynamic random-access memory</span> Type of computer memory

Dynamic random-access memory is a type of random-access semiconductor memory that stores each bit of data in a memory cell, usually consisting of a tiny capacitor and a transistor, both typically based on metal–oxide–semiconductor (MOS) technology. While most DRAM memory cell designs use a capacitor and transistor, some only use two transistors. In the designs where a capacitor is used, the capacitor can either be charged or discharged; these two states are taken to represent the two values of a bit, conventionally called 0 and 1. The electric charge on the capacitors gradually leaks away; without intervention the data on the capacitor would soon be lost. To prevent this, DRAM requires an external memory refresh circuit which periodically rewrites the data in the capacitors, restoring them to their original charge. This refresh process is the defining characteristic of dynamic random-access memory, in contrast to static random-access memory (SRAM) which does not require data to be refreshed. Unlike flash memory, DRAM is volatile memory, since it loses its data quickly when power is removed. However, DRAM does exhibit limited data remanence.

<span class="mw-page-title-main">Synchronous dynamic random-access memory</span> Type of computer memory

Synchronous dynamic random-access memory is any DRAM where the operation of its external pin interface is coordinated by an externally supplied clock signal.

<span class="mw-page-title-main">DIMM</span> Computer memory module

A DIMM, or Dual In-Line Memory Module, is a type of computer memory module used in desktop, laptop, and server computers. It is a circuit board that contains memory chips and connects to the computer's motherboard. A DIMM is often called a "RAM stick" due to its shape and size. A DIMM comprises a series of dynamic random-access memory integrated circuits that are mounted to its circuit board. DIMMs are the predominant method for adding memory into a computer system. The vast majority of DIMMs are standardized through JEDEC standards, although there are proprietary DIMMs. DIMMs come in a variety of speeds and sizes, but generally are one of two lengths - PC which are 133.35 mm (5.25 in) and laptop (SO-DIMM) which are about half the size at 67.60 mm (2.66 in).

Rambus DRAM (RDRAM), and its successors Concurrent Rambus DRAM (CRDRAM) and Direct Rambus DRAM (DRDRAM), are types of synchronous dynamic random-access memory (SDRAM) developed by Rambus from the 1990s through to the early 2000s. The third-generation of Rambus DRAM, DRDRAM was replaced by XDR DRAM. Rambus DRAM was developed for high-bandwidth applications and was positioned by Rambus as replacement for various types of contemporary memories, such as SDRAM.

<span class="mw-page-title-main">SIMM</span> Computer memory module

A SIMM is a type of memory module containing random-access memory used in computers from the early 1980s to the early 2000s. It differs from a dual in-line memory module (DIMM), the most predominant form of memory module since the late 1990s, in that the contacts on a SIMM are redundant on both sides of the module. SIMMs were standardised under the JEDEC JESD-21C standard.

<span class="mw-page-title-main">DDR2 SDRAM</span> Second generation of double-data-rate synchronous dynamic random-access memory

Double Data Rate 2 Synchronous Dynamic Random-Access Memory is a double data rate (DDR) synchronous dynamic random-access memory (SDRAM) interface. It is a JEDEC standard (JESD79-2); first published in September 2003. DDR2 succeeded the original DDR SDRAM specification, and was itself succeeded by DDR3 SDRAM in 2007. DDR2 DIMMs are neither forward compatible with DDR3 nor backward compatible with DDR.

<span class="mw-page-title-main">Double data rate</span> Method of computer bus operation

In computing, double data rate (DDR) describes a computer bus that transfers data on both the rising and falling edges of the clock signal. This is also known as double pumped, dual-pumped, and double transition. The term toggle mode is used in the context of NAND flash memory.

Semiconductor memory is a digital electronic semiconductor device used for digital data storage, such as computer memory. It typically refers to devices in which data is stored within metal–oxide–semiconductor (MOS) memory cells on a silicon integrated circuit memory chip. There are numerous different types using different semiconductor technologies. The two main types of random-access memory (RAM) are static RAM (SRAM), which uses several transistors per memory cell, and dynamic RAM (DRAM), which uses a transistor and a MOS capacitor per cell. Non-volatile memory uses floating-gate memory cells, which consist of a single floating-gate transistor per cell.

In computing, serial presence detect (SPD) is a standardized way to automatically access information about a memory module. Earlier 72-pin SIMMs included five pins that provided five bits of parallel presence detect (PPD) data, but the 168-pin DIMM standard changed to a serial presence detect to encode more information.

Double Data Rate 3 Synchronous Dynamic Random-Access Memory is a type of synchronous dynamic random-access memory (SDRAM) with a high bandwidth interface, and has been in use since 2007. It is the higher-speed successor to DDR and DDR2 and predecessor to DDR4 synchronous dynamic random-access memory (SDRAM) chips. DDR3 SDRAM is neither forward nor backward compatible with any earlier type of random-access memory (RAM) because of different signaling voltages, timings, and other factors.

GDDR4 SDRAM, an abbreviation for Graphics Double Data Rate 4 Synchronous Dynamic Random-Access Memory, is a type of graphics card memory (SGRAM) specified by the JEDEC Semiconductor Memory Standard. It is a rival medium to Rambus's XDR DRAM. GDDR4 is based on DDR3 SDRAM technology and was intended to replace the DDR2-based GDDR3, but it ended up being replaced by GDDR5 within a year.

A memory controller is a digital circuit that manages the flow of data going to and from a computer's main memory. A memory controller can be a separate chip or integrated into another chip, such as being placed on the same die or as an integral part of a microprocessor; in the latter case, it is usually called an integrated memory controller (IMC). A memory controller is sometimes also called a memory chip controller (MCC) or a memory controller unit (MCU).

Double Data Rate 4 Synchronous Dynamic Random-Access Memory is a type of synchronous dynamic random-access memory with a high bandwidth interface.

<span class="mw-page-title-main">Random-access memory</span> Form of computer data storage

Random-access memory is a form of electronic computer memory that can be read and changed in any order, typically used to store working data and machine code. A random-access memory device allows data items to be read or written in almost the same amount of time irrespective of the physical location of data inside the memory, in contrast with other direct-access data storage media, where the time required to read and write data items varies significantly depending on their physical locations on the recording medium, due to mechanical limitations such as media rotation speeds and arm movement.

A memory rank is a set of DRAM chips connected to the same chip select, which are therefore accessed simultaneously. In practice all DRAM chips share all of the other command and control signals, and only the chip select pins for each rank are separate.

Apollo VP3 is a x86 based Socket 7 chipset which was manufactured by VIA Technologies and was launched in 1997. On its time Apollo VP3 was a high performance, cost effective, and energy efficient chipset. It offered AGP support for Socket 7 processors which was not supported at that moment by Intel, SiS and ALi chipsets. In November 1997 FIC released motherboard PA-2012, which uses Apollo VP3 and has AGP bus. This was the first Socket 7 motherboard supporting AGP.

A NVDIMM or non-volatile DIMM is a type of persistent random-access memory for computers using widely used DIMM form-factors. Non-volatile memory is memory that retains its contents even when electrical power is removed, for example from an unexpected power loss, system crash, or normal shutdown. Properly used, NVDIMMs can improve application performance and system crash recovery time. They enhance solid-state drive (SSD) endurance and reliability.

<span class="mw-page-title-main">DDR5 SDRAM</span> Fifth generation of double-data-rate synchronous dynamic random-access memory

Double Data Rate 5 Synchronous Dynamic Random-Access Memory is a type of synchronous dynamic random-access memory. Compared to its predecessor DDR4 SDRAM, DDR5 was planned to reduce power consumption, while doubling bandwidth. The standard, originally targeted for 2018, was released on July 14, 2020.

<span class="mw-page-title-main">UniDIMM</span> Specification for DIMMs

UniDIMM is a specification for dual in-line memory modules (DIMMs), which are printed circuit boards (PCBs) designed to carry dynamic random-access memory (DRAM) chips. UniDIMMs can be populated with either DDR3 or DDR4 chips, with no support for any additional memory control logic; as a result, the computer's memory controller must support both DDR3 and DDR4 memory standards. The UniDIMM specification was created by Intel for its Skylake microarchitecture, whose integrated memory controller (IMC) supports both DDR3 and DDR4 memory technologies.

References

  1. Bruce Jacob, Spencer W. Ng, David T. Wang (2008). Memory Systems: Cache, DRAM, Disk. Morgan Kaufmann Publishers. pp. 417–418.
  2. "Mitsubishi's 3D-RAM And Cache DRAM incorporate high performance, on-board SRAM cache". Business Wire. 21 July 1998. Archived from the original on 24 December 2008.
  3. S. Mittal et al., "A Survey Of Techniques for Architecting DRAM Caches", IEEE TPDS, 2015