Safety engineering is an engineering discipline which assures that engineered systems provide acceptable levels of safety. It is strongly related to industrial engineering/systems engineering, and the subset system safety engineering. Safety engineering assures that a life-critical system behaves as needed, even when components fail.
Mean time between failures (MTBF) is the predicted elapsed time between inherent failures of a mechanical or electronic system, during normal system operation. MTBF can be calculated as the arithmetic mean (average) time between failures of a system. The term is used for repairable systems, while mean time to failure (MTTF) denotes the expected time to failure for a non-repairable system.
Forensic engineering has been defined as "the investigation of failures - ranging from serviceability to catastrophic - which may lead to legal activity, including both civil and criminal". It includes the investigation of materials, products, structures or components that fail or do not operate or function as intended, causing personal injury, damage to property or economic loss. The consequences of failure may give rise to action under either criminal or civil law including but not limited to health and safety legislation, the laws of contract and/or product liability and the laws of tort. The field also deals with retracing processes and procedures leading to accidents in operation of vehicles or machinery. Generally, the purpose of a forensic engineering investigation is to locate cause or causes of failure with a view to improve performance or life of a component, or to assist a court in determining the facts of an accident. It can also involve investigation of intellectual property claims, especially patents. In the US, forensic engineers require a professional engineering license from each state.
In computing, overclocking is the practice of increasing the clock rate of a computer to exceed that certified by the manufacturer. Commonly, operating voltage is also increased to maintain a component's operational stability at accelerated speeds. Semiconductor devices operated at higher frequencies and voltages increase power consumption and heat. An overclocked device may be unreliable or fail completely if the additional heat load is not removed or power delivery components cannot meet increased power demands. Many device warranties state that overclocking or over-specification voids any warranty, however there are an increasing number of manufacturers that will allow overclocking as long as performed (relatively) safely.
In materials science, fatigue is the initiation and propagation of cracks in a material due to cyclic loading. Once a fatigue crack has initiated, it grows a small amount with each loading cycle, typically producing striations on some parts of the fracture surface. The crack will continue to grow until it reaches a critical size, which occurs when the stress intensity factor of the crack exceeds the fracture toughness of the material, producing rapid propagation and typically complete fracture of the structure.
A product's service life is its period of use in service. It is mostly used in a non-technical context and has no scientific support or meaning. Several other terms more accurately describe a product's life, from the point of manufacture, storage, and distribution, and eventual use.
Parts stress modelling is a method in engineering and especially electronics to find an expected value for the rate of failure of the mechanical and electronic components of a system. It is based upon the idea that the more components that there are in the system, and the greater stress that they undergo in operation, the more often they will fail.
Failure rate is the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.
Troubleshooting is a form of problem solving, often applied to repair failed products or processes on a machine or a system. It is a logical, systematic search for the source of a problem in order to solve it, and make the product or process operational again. Troubleshooting is needed to identify the symptoms. Determining the most likely cause is a process of elimination—eliminating potential causes of a problem. Finally, troubleshooting requires confirmation that the solution restores the product or process to its working state.
Reliability engineering is a sub-discipline of systems engineering that emphasizes the ability of equipment to function without failure. Reliability describes the ability of a system or component to function under stated conditions for a specified period of time. Reliability is closely related to availability, which is typically described as the ability of a component or system to function at a specified moment or interval of time.
Fault tolerance is the property that enables a system to continue operating properly in the event of the failure of one or more faults within some of its components. If its operating quality decreases at all, the decrease is proportional to the severity of the failure, as compared to a naively designed system, in which even a small failure can cause total breakdown. Fault tolerance is particularly sought after in high-availability, mission-critical, or even life-critical systems. The ability of maintaining functionality when portions of a system break down is referred to as graceful degradation.
A test engineer is a professional who determines how to create a process that would best test a particular product in manufacturing and related disciplines, in order to assure that the product meets applicable specifications. Test engineers are also responsible for determining the best way a test can be performed in order to achieve adequate test coverage. Often test engineers also serve as a liaison between manufacturing, design engineering, sales engineering and marketing communities as well.
A highly accelerated life test (HALT) is a stress testing methodology for enhancing product reliability. HALT testing is currently in use by major manufacturing and research & development organizations to improve product reliability in a variety of industries, including electronics, computer, medical, and military.
Time-dependent gate oxide breakdown is a kind of transistor aging, a failure mechanism in MOSFETs, when the gate oxide breaks down as a result of long-time application of relatively low electric field. The breakdown is caused by formation of a conducting path through the gate oxide to substrate due to electron tunneling current, when MOSFETs are operated close to or beyond their specified operating voltages.
A tantalum electrolytic capacitor is an electrolytic capacitor, a passive component of electronic circuits. It consists of a pellet of porous tantalum metal as an anode, covered by an insulating oxide layer that forms the dielectric, surrounded by liquid or solid electrolyte as a cathode. Because of its very thin and relatively high permittivity dielectric layer, the tantalum capacitor distinguishes itself from other conventional and electrolytic capacitors in having high capacitance per volume and lower weight.
Accelerated life testing is the process of testing a product by subjecting it to conditions in excess of its normal service parameters in an effort to uncover faults and potential modes of failure in a short amount of time. By analyzing the product's response to such tests, engineers can make predictions about the service life and maintenance intervals of a product.
Electronic components have a wide range of failure modes. These can be classified in various ways, such as by time or cause. Failures can be caused by excess temperature, excess current or voltage, ionizing radiation, mechanical shock, stress or impact, and many other causes. In semiconductor devices, problems in the device package may cause failures due to contamination, mechanical stress of the device, or open or short circuits.
Robustness validation is a skills strategy with which the Robustness of a product to the loading conditions of a real application is proven and targeted statements about risks and reliability can be made. This strategy is particularly for use in the automotive industry however could be applied to any industry where high levels of reliability are required
High-temperature operating life (HTOL) is a reliability test applied to integrated circuits (ICs) to determine their intrinsic reliability. This test stresses the IC at an elevated temperature, high voltage and dynamic operation for a predefined period of time. The IC is usually monitored under stress and tested at intermediate intervals. This reliability stress test is sometimes referred to as a "lifetime test", "device life test" or "extended burn in test" and is used to trigger potential failure modes and assess IC lifetime.
Aluminium capacitors are polarized electrolytic capacitors whose anode electrode (+) is made of a pure aluminum foil with an etched surface. The aluminum forms a very thin insulating layer of aluminium oxide by anodization that acts as the dielectric of the capacitor. A non-solid electrolyte covers the rough surface of the oxide layer, serving in principle as the second electrode (cathode) (-) of the capacitor. A second aluminum foil called “cathode foil” contacts the electrolyte and serves as the electrical connection to the negative terminal of the capacitor.
