An inductor, also called a coil, choke, or reactor, is a passive two-terminal electrical component that stores energy in a magnetic field when electric current flows through it. An inductor typically consists of an insulated wire wound into a coil.
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.
A gyrator is a passive, linear, lossless, two-port electrical network element proposed in 1948 by Bernard D. H. Tellegen as a hypothetical fifth linear element after the resistor, capacitor, inductor and ideal transformer. Unlike the four conventional elements, the gyrator is non-reciprocal. Gyrators permit network realizations of two-(or-more)-port devices which cannot be realized with just the conventional four elements. In particular, gyrators make possible network realizations of isolators and circulators. Gyrators do not however change the range of one-port devices that can be realized. Although the gyrator was conceived as a fifth linear element, its adoption makes both the ideal transformer and either the capacitor or inductor redundant. Thus the number of necessary linear elements is in fact reduced to three. Circuits that function as gyrators can be built with transistors and op-amps using feedback.
Practical capacitors and inductors as used in electric circuits are not ideal components with only capacitance or inductance. However, they can be treated, to a very good degree of approximation, as being ideal capacitors and inductors in series with a resistance; this resistance is defined as the equivalent series resistance (ESR). If not otherwise specified, the ESR is always an AC resistance, which means it is measured at specified frequencies, 100 kHz for switched-mode power supply components, 120 Hz for linear power-supply components, and at its self-resonant frequency for general-application components. Additionally, audio components may report a "Q factor", incorporating ESR among other things, at 1000 Hz.
Laser trimming is the manufacturing process of using a laser to adjust the operating parameters of an electronic circuit.
An electronic component is any basic discrete device or physical entity in an electronic system used to affect electrons or their associated fields. Electronic components are mostly industrial products, available in a singular form and are not to be confused with electrical elements, which are conceptual abstractions representing idealized electronic components and elements.
A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices and passive components, bonded to a substrate or printed circuit board (PCB). A PCB having components on a Printed Wiring Board (PWB) is not considered a true hybrid circuit according to the definition of MIL-PRF-38534.
Capacitors are manufactured in many styles, forms, dimensions, and from a large variety of materials. They all contain at least two electrical conductors, called plates, separated by an insulating layer (dielectric). Capacitors are widely used as parts of electrical circuits in many common electrical devices.
A capacitor is a device that stores electrical energy in an electric field by virtue of accumulating electric charges on two close surfaces insulated from each other. It is a passive electronic component with two terminals.
A test probe is a physical device used to connect electronic test equipment to a device under test (DUT). Test probes range from very simple, robust devices to complex probes that are sophisticated, expensive, and fragile. Specific types include test prods, oscilloscope probes and current probes. A test probe is often supplied as a test lead, which includes the probe, cable and terminating connector.
A ceramic capacitor is a fixed-value capacitor where the ceramic material acts as the dielectric. It is constructed of two or more alternating layers of ceramic and a metal layer acting as the electrodes. The composition of the ceramic material defines the electrical behavior and therefore applications. Ceramic capacitors are divided into two application classes:
A variety of types of electrical transformer are made for different purposes. Despite their design differences, the various types employ the same basic principle as discovered in 1831 by Michael Faraday, and share several key functional parts.
A radio-frequency microelectromechanical system is a microelectromechanical system with electronic components comprising moving sub-millimeter-sized parts that provide radio-frequency (RF) functionality. RF functionality can be implemented using a variety of RF technologies. Besides RF MEMS technology, III-V compound semiconductor, ferrite, ferroelectric, silicon-based semiconductor, and vacuum tube technology are available to the RF designer. Each of the RF technologies offers a distinct trade-off between cost, frequency, gain, large-scale integration, lifetime, linearity, noise figure, packaging, power handling, power consumption, reliability, ruggedness, size, supply voltage, switching time and weight.
Integrated passive devices (IPDs), also known as integrated passive components (IPCs) or embedded passive components (EPC), are electronic components where resistors (R), capacitors (C), inductors (L)/coils/chokes, microstriplines, impedance matching elements, baluns or any combinations of them are integrated in the same package or on the same substrate. Sometimes integrated passives can also be called as embedded passives, and still the difference between integrated and embedded passives is technically unclear. In both cases passives are realized in between dielectric layers or on the same substrate.
Thick-film technology is used to produce electronic devices/modules such as surface mount devices modules, hybrid integrated circuits, heating elements, integrated passive devices and sensors. Main manufacturing technique is screen printing (stenciling), which in addition to use in manufacturing electronic devices can also be used for various graphic reproduction targets. It became one of the key manufacturing/miniaturisation techniques of electronic devices/modules during 1950s. Typical film thickness – manufactured with thick film manufacturing processes for electronic devices – is 0.0001 to 0.1 mm.
Capacitors have many uses in electronic and electrical systems. They are so ubiquitous that it is rare that an electrical product does not include at least one for some purpose. Capacitors allow only AC signals to pass when they are charged blocking DC signals. The main components of filters are capacitors. Capacitors have the ability to connect one circuit segment to another. Capacitors are used by Dynamic Random Access Memory (DRAM) devices to represent binary information as bits.
Passivity is a property of engineering systems, most commonly encountered in analog electronics and control systems. Typically, analog designers use passivity to refer to incrementally passive components and systems, which are incapable of power gain. In contrast, control systems engineers will use passivity to refer to thermodynamically passive ones, which consume, but do not produce, energy. As such, without context or a qualifier, the term passive is ambiguous.
Photoimageable thick-film technology is a combination of conventional thick film technology with elements of thin film technology, and it provides a low cost solution to producing high quality microwave circuits. The ability to directly photoimage the printed layers means that the technology can provide the high line and gap resolution required by high frequency planar components. It provides a feasible fabrication process to produce circuits operating at microwave and millimetre-wave frequencies. Circuits made using this technology meet the modern requirements for high density packaging, whilst yielding the high quality components required for very high frequency applications, including wireless communication, radar and measurement systems.
KEMET Corporation, a subsidiary of Yageo Corporation, is an American company which manufactures a broad selection of capacitor technologies such as tantalum, aluminum, multilayer ceramic, film, paper, polymer electrolytic, and supercapacitors. KEMET also manufacturers a variety of other passive electronic components, such as AC line filters, EMI cores and filters, flex suppressors, electro-mechanical devices (relays), metal composite inductors, ferrite products, and transformers/magnetics. The product line consists of nearly 5 million distinct part configurations distinguished by various attributes, such as dielectric material, configuration, encapsulation, capacitance, voltage, performance characteristics, and packaging.
