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Embedded Platform for Industrial Computing (EPIC) is a computer form factor, a standard for an industrial-quality single-board computer, in use from about 2004 through 2016.
| | This article needs additional citations for verification .(May 2016) |
Embedded Platform for Industrial Computing (EPIC) is a computer form factor, a standard for an industrial-quality single-board computer, in use from about 2004 through 2016.
The EPIC standard was developed by a combined effort from WinSystems, VersaLogic, Octagon Systems, Micro/sys, and Ampro. Single board computers using this standard were available as early as 2004. [1] The EPIC-SBC group had a web site until about 2016. [2]
EPIC modules are 6.5 × 4.5 inches (165 × 114 mm) in size, between PC/104-Plus and Embedded Board eXpandable (EBX) standards. [3] [4] It supported both PC/104 and PC/104-Plus expansion, for which hundreds of I/O modules were available. I/O connections can be either pin headers or PC-style connectors. The standard provides specific I/O zones to implement functions such as Ethernet, serial ports, digital and analog I/O, video, wireless, and various application-specific interfaces. It also supported serial buses like PCI Express. [5]
An embedded system is a computer system—a combination of a computer processor, computer memory, and input/output peripheral devices—that has a dedicated function within a larger mechanical or electronic system. It is embedded as part of a complete device often including electrical or electronic hardware and mechanical parts. Because an embedded system typically controls physical operations of the machine that it is embedded within, it often has real-time computing constraints. Embedded systems control many devices in common use today. In 2009, it was estimated that ninety-eight percent of all microprocessors manufactured were used in embedded systems.
In computing, an expansion card is a printed circuit board that can be inserted into an electrical connector, or expansion slot on a computer's motherboard to add functionality to a computer system. Sometimes the design of the computer's case and motherboard involves placing most of these slots onto a separate, removable card. Typically such cards are referred to as a riser card in part because they project upward from the board and allow expansion cards to be placed above and parallel to the motherboard.
A system on a chip, also written as system-on-a-chip and system-on-chip, is an integrated circuit that integrates all or most components of a computer or other electronic system. These components almost always include a central processing unit (CPU), memory interfaces, on-chip input/output devices, input/output interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip. It may contain digital, analog, mixed-signal, and often radio frequency signal processing functions.
A single-board computer (SBC) is a complete computer built on a single circuit board, with microprocessor(s), memory, input/output (I/O) and other features required of a functional computer. Single-board computers are commonly made as demonstration or development systems, for educational systems, or for use as embedded computer controllers. Many types of home computers or portable computers integrate all their functions onto a single printed circuit board.
PC/104 is a family of embedded computer standards which define both form factors and computer buses by the PC/104 Consortium. Its name derives from the 104 pins on the interboard connector (ISA) in the original PC/104 specification and has been retained in subsequent revisions, despite changes to connectors. PC/104 is intended for specialized environments where a small, rugged computer system is required. The standard is modular, and allows consumers to stack together boards from a variety of COTS manufacturers to produce a customized embedded system.
The PCI Industrial Computer Manufacturers Group (PICMG) is a consortium of over 150 companies. Founded in 1994, the group was originally formed to adapt PCI technology for use in high-performance telecommunications, military, and industrial computing applications, but its work has now grown to include newer technologies. PICMG is distinct from the similarly named and adjacently-focused PCI Special Interest Group (PCI-SIG).
ETX, standing for Embedded Technology eXtended, is an integrated and compact 95 × 125 mm (3.7 × 4.9 in) computer-on-module (COM) form factor, which can be used in a design application much like an integrated circuit component. Each ETX COM integrates core CPU and memory functionality, the common I/O of a PC/AT, USB, audio, graphics, and Ethernet. All I/O signals as well as a full implementation of ISA and PCI buses are mapped to four high-density, low-profile connectors on the bottom side of the module.
A computer-on-module (COM) is a type of single-board computer (SBC), a subtype of an embedded computer system. An extension of the concept of system on chip (SoC) and system in package (SiP), COM lies between a full-up computer and a microcontroller in nature. It is very similar to a system on module (SOM).
COM Express, a computer-on-module (COM) form factor, is a highly integrated and compact computer that can be used in a design application much like an integrated circuit component. Each module integrates core CPU and memory functionality, the common I/O of a PC/AT, USB, audio, graphics (PEG), and Ethernet. All I/O signals are mapped to two high density, low profile connectors on the bottom side of the module. COM Express employs a mezzanine-based approach. The COM modules plug into a baseboard that is typically customized to the application. Over time, the COM Express mezzanine modules can be upgraded to newer, backwards-compatible versions. COM Express is commonly used in Industrial, military, aerospace, gaming, medical, transportation, Internet of things, and general computing embedded applications.
In computing, the motherboard form factor is the specification of a motherboard – the dimensions, power supply type, location of mounting holes, number of ports on the back panel, etc. Specifically, in the IBM PC compatible industry, standard form factors ensure that parts are interchangeable across competing vendors and generations of technology, while in enterprise computing, form factors ensure that server modules fit into existing rackmount systems. Traditionally, the most significant specification is for that of the motherboard, which generally dictates the overall size of the case. Small form factors have been developed and implemented.
VPX, also known as VITA 46, refers to a set of standards for connecting components of a computer, commonly used by defense contractors. Some are ANSI standards such as ANSI/VITA 46.0–2019. VPX provides VMEbus-based systems with support for switched fabrics over a new high speed connector. Defined by the VMEbus International Trade Association (VITA) working group starting in 2003, it was first demonstrated in 2004, and became an ANSI standard in 2007.
The Small Form Factor Special Interest Group is an international non-profit standards body focused on modular computer hardware technologies used in embedded and small form factor computers and controllers. Members are mainly computer board and component manufacturers. The group was founded in 2007 and had a web site until early 2020.
M-Modules are a mezzanine standard mainly used in industrial computers. Being mezzanines, they are always plugged on a carrier printed circuit board (PCB) that supports this format. The modules communicate with their carrier over a dedicated bus, and can have all kinds of special functions.
ESMexpress is a very compact computer-on-module (COM) standard. It is a complete processor module that currently supports several low-power Intel and PowerPC platforms. Apart from a CPU component, every module also includes memory and a range of serial communication interfaces such as PCI Express, Gigabit Ethernet, USB, SATA, SDVO, LVDS and HD audio. These interfaces are defined in the form factor's specification, and signals are assigned to two 120-pin connectors. This fixed pin mapping ensures that different ESMexpress modules can be exchanged more easily. Consequently, ESMexpress typically does not have an onboard FPGA. The idea behind this is to implement very specialized functions in an FPGA on the COM's carrier board to ease upgrades of the system CPU through exchange of the ESMexpress module.
GreenSpring Computers was started in 1984 as VME Specialists. The original product focus was VMEbus cards for industrial automation. The company was founded by Leonard Lehmann and his father Henry Lehmann in Redwood City, California, United States.
CoreExpress modules are complete computer-on-module (COM) highly integrated, compact computers that can be used in an embedded computer board design, much like an integrated circuit component. COMs integrate CPU, memory, graphics, and BIOS, and common I/O interfaces. The interfaces are modern, using only digital buses such as PCI Express, Serial ATA, Ethernet, USB, and HD audio. All signals are accessible on a high-density, high-speed, 220-pin connector. Although most implementations use Intel processors, the specification is open for different CPU modules.
Eurotech is a company dedicated to the research, development, production and marketing of miniature computers (NanoPCs) and high performance computers (HPCs).
WinSystems is an employee owned embedded systems manufacturer specializing in ruggedized, highly reliable industrial computer systems. The company was founded by Jerry Winfield in 1982 and is headquartered in Grand Prairie, Texas.
Smart Mobility Architecture (SMARC) is a computer hardware standard for computer-on-modules (COMs). SMARC modules are specifically designed for the development of extremely compact low-power systems, such as mobile devices.
Tensor Processing Unit (TPU) is an AI accelerator application-specific integrated circuit (ASIC) developed by Google for neural network machine learning, using Google's own TensorFlow software. Google began using TPUs internally in 2015, and in 2018 made them available for third party use, both as part of its cloud infrastructure and by offering a smaller version of the chip for sale.