Smart Mobility Architecture (SMARC) is a computer hardware standard for computer-on-modules (COMs). SMARC modules are specifically designed for the development of extremely compact low-power systems, such as mobile devices. [1]
Smart Mobility Architecture (SMARC) is a computer hardware standard for computer-on-modules (COMs). SMARC modules are specifically designed for the development of extremely compact low-power systems, such as mobile devices. [1]
The SMARC hardware specification V1.0 was published by the Standardization Group for Embedded Technologies (SGeT). SGeT had its first meeting in 2012, headed by Engelbert Hörmannsdorfer. [2] The specification is freely available as a download on the SGeT website. Generally, SMARC modules are based on ARM architecture processors, they can, however, also be fitted with other low-power system on a chip (SoC) architectures, like, for example, ones based on x86 processors. [3] Typically, SMARC modules' power requirement is in the range of a few watts. [4]
Computer-on-modules integrate the core function of a bootable computer, as well as additional circuitry, including DRAM, boot-flash, voltage distribution, Ethernet and display transmitter. The modules are deployed together with an application-specific carrier board, whose size and form can be defined to meet customer-specific requirements. The carrier board executes the required interfaces and can integrate, if required, any further functionalities, such as audio codecs, touch controller, wireless communication interfaces, etc.
The SMARC specification outlines both the dimensions of the module and the positioning of the anchor points as well as the connector to the carrier board and the executed interfaces with the pin-out. The pin-out is optimized for ARM and low-power SoC interfaces and is distinguished from classical PC interfaces by its target-oriented focus on low-power and mobile applications.
SMARC is based on the ultra-low power (ULP-COM) form factor which was introduced by the companies Kontron and Adlink in February 2012. [5] During the specification process by the SGeT the standard was renamed to SMARC. SGET approved the 1.0 specification in December 2012. [1]
SMARC defines two module sizes:
SMARC Computer-on-Modules have 314 card edge contacts on the printed circuit board (PCB) of the module which is plugged via a low-profile connector on the carrier board. In most cases, the connector has a construction height of 4.3 mm. It is also used for Mobile PCI Express Module 3.0 graphic cards, which naturally have completely different pin assignments.
Signal transmission is carried out via a total of 314 pins. 33 of these are reserved signal lines for power supply and grounding, so that with SMARC a total of 281 signal lines are effectively available. ARM- and SoC-typical energy-saving interfaces, like, for instance, parallel LCD for display connection, mobile industry processor interfaces for cameras, Serial Peripheral Interface (SPI) for general peripheral connection, I²S for audio and I2C are included. Besides these, classical computer interfaces such as USB, SATA and PCI Express are also defined.
In the 2.0 version of the SMARC specification not all of the 314 signal lines are assigned to fixed I/Os. The Alternate Function Block (AFB) has free pins available for different requirements. This is to ensure that the SMARC specification can flexibly accommodate up and coming technical developments which today are not foreseeable while remaining fully compatibility to previous designs. On the one hand, extended versions of the SMARC specification can assign new standard functions to these 20 AFB signal lines. On the other hand, the SMARC specification 1.0 lists the Media Oriented System Transport (MOST) bus, dual Gigabit Ethernet, Super Speed USB, or industrial network protocols which could be imagined as or might be assigned as interfaces of the AFB.
In telecommunications, RS-232 or Recommended Standard 232 is a standard originally introduced in 1960 for serial communication transmission of data. It formally defines signals connecting between a DTE such as a computer terminal or PC, and a DCE, such as a modem. The standard defines the electrical characteristics and timing of signals, the meaning of signals, and the physical size and pinout of connectors. The current version of the standard is TIA-232-F Interface Between Data Terminal Equipment and Data Circuit-Terminating Equipment Employing Serial Binary Data Interchange, issued in 1997. The RS-232 standard had been commonly used in computer serial ports and is still widely used in industrial communication devices.
A system on a chip or system-on-chip is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include on-chip central processing unit (CPU), memory interfaces, input/output devices and interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip. SoCs may contain digital and also analog, mixed-signal and often radio frequency signal processing functions.
The MultiMediaCard, officially abbreviated as MMC, is a memory card standard used for solid-state storage. Unveiled in 1997 by SanDisk and Siemens, MMC is based on a surface-contact low pin-count serial interface using a single memory stack substrate assembly, and is therefore much smaller than earlier systems based on high pin-count parallel interfaces using traditional surface-mount assembly such as CompactFlash. Both products were initially introduced using SanDisk NOR-based flash technology.
JTAG is an industry standard for verifying designs and testing printed circuit boards after manufacture.
PC/104 is a family of embedded computer standards which define both form factors and computer buses by the PC/104 Consortium. Its name derives from the 104 pins on the interboard connector (ISA) in the original PC/104 specification and has been retained in subsequent revisions, despite changes to connectors. PC/104 is intended for specialized environments where a small, rugged computer system is required. The standard is modular, and allows consumers to stack together boards from a variety of COTS manufacturers to produce a customized embedded system.
Advanced Telecommunications Computing Architecture is the largest specification effort in the history of the PCI Industrial Computer Manufacturers Group (PICMG), with more than 100 companies participating. Known as AdvancedTCA, the official specification designation PICMG 3.x was ratified by the PICMG organization in December 2002. AdvancedTCA is targeted primarily to requirements for "carrier grade" communications equipment, but has recently expanded its reach into more ruggedized applications geared toward the military/aerospace industries as well. This series of specifications incorporates the latest trends in high speed interconnect technologies, next-generation processors, and improved Reliability, Availability and Serviceability (RAS).
Advanced Mezzanine Cards are printed circuit boards (PCBs) that follow a specification of the PCI Industrial Computers Manufacturers Group (PICMG). Known as AdvancedMC or AMC, the official specification designation is AMC.x. Originally AMC was targeted to requirements for carrier grade communications equipment, but later used in other markets.
ETX, standing for Embedded Technology eXtended, is an integrated and compact 95 × 125 mm (3.7 × 4.9 in) computer-on-module (COM) form factor, which can be used in a design application much like an integrated circuit component. Each ETX COM integrates core CPU and memory functionality, the common I/O of a PC/AT, USB, audio, graphics, and Ethernet. All I/O signals as well as a full implementation of ISA and PCI buses are mapped to four high-density, low-profile connectors on the bottom side of the module.
A computer-on-module (COM) is a type of single-board computer (SBC), a subtype of an embedded computer system. An extension of the concept of system on chip (SoC) and system in package (SiP), COM lies between a full-up computer and a microcontroller in nature. It is very similar to a system on module (SOM).
COM Express, a computer-on-module (COM) form factor, is a highly integrated and compact computer that can be used in a design application much like an integrated circuit component. Each module integrates core CPU and memory functionality, the common I/O of a PC/AT, USB, audio, graphics (PEG), and Ethernet. All I/O signals are mapped to two high density, low profile connectors on the bottom side of the module. COM Express employs a mezzanine-based approach. The COM modules plug into a baseboard that is typically customized to the application. Over time, the COM Express mezzanine modules can be upgraded to newer, backwards-compatible versions. COM Express is commonly used in Industrial, military, aerospace, gaming, medical, transportation, Internet of things, and general computing embedded applications.
The Small Form Factor Special Interest Group is an international non-profit standards body focused on modular computer hardware technologies used in embedded and small form factor computers and controllers. Members are mainly computer board and component manufacturers. The group was founded in 2007 and had a web site until early 2020.
Double Data Rate 4 Synchronous Dynamic Random-Access Memory is a type of synchronous dynamic random-access memory with a high bandwidth interface.
ESMexpress is a very compact computer-on-module (COM) standard. It is a complete processor module that currently supports several low-power Intel and PowerPC platforms. Apart from a CPU component, every module also includes memory and a range of serial communication interfaces such as PCI Express, Gigabit Ethernet, USB, SATA, SDVO, LVDS and HD audio. These interfaces are defined in the form factor's specification, and signals are assigned to two 120-pin connectors. This fixed pin mapping ensures that different ESMexpress modules can be exchanged more easily. Consequently, ESMexpress typically does not have an onboard FPGA. The idea behind this is to implement very specialized functions in an FPGA on the COM's carrier board to ease upgrades of the system CPU through exchange of the ESMexpress module.
Embedded System Module, or ESM, is a compact computer-on-module (COM) standard. An ESM module typically includes a CPU processor, memory, module-specific I/O interfaces and a number of basic front I/O connectors. They can be plugged on a carrier board or be used as a stand-alone processor card.
The C form-factor pluggable is a multi-source agreement to produce a common form-factor for the transmission of high-speed digital signals. The c stands for the Latin letter C used to express the number 100 (centum), since the standard was primarily developed for 100 Gigabit Ethernet systems.
A carputer, or car-puter, is a computer with specializations to run in a car, such as compact size, low power requirement, and some customized components. The computing hardware is typically based on standard PCs or mobile devices. They normally have standard interfaces such as Bluetooth, USB, and WiFi. The first carputer was introduced by Clarion on December 4, 1998, although on-board diagnostics have been employed since the 1980s to precisely measure the amount of fuel entering the engine as the carburetors got too complex.
CoreExpress modules are complete computer-on-module (COM) highly integrated, compact computers that can be used in an embedded computer board design, much like an integrated circuit component. COMs integrate CPU, memory, graphics, and BIOS, and common I/O interfaces. The interfaces are modern, using only digital buses such as PCI Express, Serial ATA, Ethernet, USB, and HD audio. All signals are accessible on a high-density, high-speed, 220-pin connector. Although most implementations use Intel processors, the specification is open for different CPU modules.
Qseven, a computer-on-module (COM) form factor, is a small, highly integrated computer module that can be used in a design application much like an integrated circuit component. It is smaller than other computer-on-module standards such as COM Express, ETX or XTX and is limited to very low power consuming CPUs. The maximum power consumption should be no more than 12 watts.
ISEE is a European multinational company that designs and manufactures small computer-on-modules (COMs), single-board computers, expansion boards, radars and other embedded systems. The abbreviation of ISEE refers to Integration, Software & Electronics Engineering. Their products are based on the IGEP Technology, the ISEE Generic Enhanced Platform using Texas Instruments OMAP processors.
The computer-on-module for high performance compute (COM-HPC) form factor standard targets high I/O and computer performance levels. Each COM-HPC module integrates core CPU and memory functionality and input and output including USB up to Gen 4, audio, graphics, up to Gen. 5, and Ethernet up to 25 Gbit/s per lane. All I/O signals are mapped to two high density, high speed and low profile connectors on the bottom side of the module. COM-HPC employs a mezzanine-based approach. The COM modules plug into a carrier or base board that is typically customized to the application. Over time, the COM-HPC mezzanine modules can be upgraded to newer, backwards-compatible versions. COM-HPC targets Industrial, Military/Aerospace, Gaming, Medical, Transportation, IoT, and General Computing embedded applications and even scales up to RAM and performance hungry server or edge server applications.