Eurocard is an IEEE standard format for printed circuit board (PCB) cards that can be plugged together into a standard chassis which, in turn, can be mounted in a 19-inch rack. The chassis consists of a series of slotted card guides on the top and bottom, into which the cards are slid so they stand on end, like books on a shelf. At the spine of each card is one or more connectors which plug into mating connectors on a backplane that closes the rear of the chassis.
CompactPCI is a computer bus interconnect for industrial computers, combining a Eurocard-type connector and PCI signaling and protocols. Boards are standardized to 3U or 6U sizes, and are typically interconnected via a passive backplane. The connector pin assignments are standardized by the PICMG US and PICMG Europe organizations. The connectors and the electrical rules allow for eight boards in a PCI segment. Multiple bus segments are allowed with bridges.
PC/104 is a family of embedded computer standards which define both form factors and computer buses by the PC/104 Consortium. Its name derives from the 104 pins on the interboard connector (ISA) in the original PC/104 specification and has been retained in subsequent revisions, despite changes to connectors. PC/104 is intended for specialized environments where a small, rugged computer system is required. The standard is modular, and allows consumers to stack together boards from a variety of COTS manufacturers to produce a customized embedded system.
PICMG, or PCI Industrial Computer Manufacturers Group, is a consortium of over 140 companies in the fields of computer science and engineering. Founded in 1994, the group was originally formed to adapt PCI technology for use in high-performance telecommunications, military, and industrial computing applications, but its work has grown to include newer technologies. PICMG currently focuses on developing and implementing specifications and guidelines for open standards–based computer architectures from a wide variety of interconnects.
Advanced Telecommunications Computing Architecture is the largest specification effort in the history of the PCI Industrial Computer Manufacturers Group (PICMG), with more than 100 companies participating. Known as AdvancedTCA, the official specification designation PICMG 3.x was ratified by the PICMG organization in December 2002. AdvancedTCA is targeted primarily to requirements for "carrier grade" communications equipment, but has recently expanded its reach into more ruggedized applications geared toward the military/aerospace industries as well. This series of specifications incorporates the latest trends in high speed interconnect technologies, next-generation processors, and improved Reliability, Availability and Serviceability (RAS).
Advanced Mezzanine Cards are printed circuit boards (PCBs) that follow a specification of the PCI Industrial Computers Manufacturers Group (PICMG). Known as AdvancedMC or AMC, the official specification designation is AMC.x. Originally AMC was targeted to requirements for carrier grade communications equipment, but later used in other markets.
Communications servers are open, standards-based computing systems that operate as a carrier-grade common platform for a wide range of communications applications and allow equipment providers to add value at many levels of the system architecture.
ETX, standing for Embedded Technology eXtended, is an integrated and compact 95 × 125 mm (3.7 × 4.9 in) computer-on-module (COM) form factor, which can be used in a design application much like an integrated circuit component. Each ETX COM integrates core CPU and memory functionality, the common I/O of a PC/AT, USB, audio, graphics, and Ethernet. All I/O signals as well as a full implementation of ISA and PCI buses are mapped to four high-density, low-profile connectors on the bottom side of the module.
ESMexpress is a very compact computer-on-module (COM) standard. It is a complete processor module that currently supports several low-power Intel and PowerPC platforms. Apart from a CPU component, every module also includes memory and a range of serial communication interfaces such as PCI Express, Gigabit Ethernet, USB, SATA, SDVO, LVDS and HD audio. These interfaces are defined in the form factor's specification, and signals are assigned to two 120-pin connectors. This fixed pin mapping ensures that different ESMexpress modules can be exchanged more easily. Consequently, ESMexpress typically does not have an onboard FPGA. The idea behind this is to implement very specialized functions in an FPGA on the COM's carrier board to ease upgrades of the system CPU through exchange of the ESMexpress module.
Embedded System Module, or ESM, is a compact computer-on-module (COM) standard. An ESM module typically includes a CPU processor, memory, module-specific I/O interfaces and a number of basic front I/O connectors. They can be plugged on a carrier board or be used as a stand-alone processor card.
CompactPCI PlusIO is an extension to the PICMG 2.0 CompactPCI industrial standard for modular computer systems. CompactPCI PlusIO was officially adopted by the PCI Industrial Computer Manufacturers Group PICMG as PICMG 2.30 CompactPCI PlusIO in November 2009. Being 100% compatible with CompactPCI, PICMG 2.30 defines a migration path to the future CompactPCI Serial standard. It defines a fixed rear I/O pin assignment that focuses on modern, fast serial point-to-point connections. The new technology succeeding parallel CompactPCI comprises both CompactPCI Serial and CompactPCI PlusIO.
CompactPCI Serial is an industrial standard for modular computer systems. It is based on the established PICMG 2.0 CompactPCI standard, which uses the parallel PCI bus for communication among a system's card components. In contrast to this, CompactPCI Serial uses only serial point-to-point connections. CompactPCI Serial was officially adopted by the PCI Industrial Computer Manufacturers Group PICMG as PICMG CPCI-S.0 CompactPCI Serial in March 2011. Its mechanical concept is based on the proven standards of IEEE 1101-1-1998 and IEEE 1101-10-1996. CompactPCI Serial includes different connectors that permit very high data rates. The new technology standard succeeding parallel CompactPCI comprises another specification called PICMG 2.30 CompactPCI PlusIO. This is why CompactPCI Serial and CompactPCI PlusIO as a whole were also called CompactPCI Plus. PICMG's first working title of CompactPCI Serial was CPLUS.0. CompactPCI Serial backplanes and chassis are developed by Schroff, Elmа, and Pixus Technologies companies, as for the CompactPCI Serial board level electronics – they are developed by MEN Mikro Elektronik, Fastwel, EKF, Emerson Embedded Computing, ADLINK, Data Patterns and Kontron.
The FeaturePak standard defines a small form factor card for I/O expansion of embedded systems and other space-constrained computing applications. The cards are intended to be used for adding a wide range of capabilities, such as A/D, D/A, digital I/O, counter/timers, serial I/O, wired or wireless networking, image processing, GPS, etc. to their host systems.
CoreExpress modules are complete computer-on-module (COM) highly integrated, compact computers that can be used in an embedded computer board design, much like an integrated circuit component. COMs integrate CPU, memory, graphics, and BIOS, and common I/O interfaces. The interfaces are modern, using only digital buses such as PCI Express, Serial ATA, Ethernet, USB, and HD audio. All signals are accessible on a high-density, high-speed, 220-pin connector. Although most implementations use Intel processors, the specification is open for different CPU modules.
Qseven, a computer-on-module (COM) form factor, is a small, highly integrated computer module that can be used in a design application much like an integrated circuit component. It is smaller than other computer-on-module standards such as COM Express, ETX or XTX and is limited to very low power consuming CPUs. The maximum power consumption should be no more than 12 watts.
FPGA Mezzanine Card (FMC) is an ANSI/VITA 57.1 standard that defines I/O mezzanine modules with connection to an FPGA or other device with re-configurable I/O capability. It specifies a low profile connector and compact board size for compatibility with several industry standard slot card, blade, low profile motherboard, and mezzanine form factors.
Smart Mobility Architecture (SMARC) is a computer hardware standard for computer-on-modules (COMs). SMARC modules are specifically designed for the development of extremely compact low-power systems, such as mobile devices.
M.2, pronounced m dot two and formerly known as the Next Generation Form Factor (NGFF), is a specification for internally mounted computer expansion cards and associated connectors. M.2 replaces the mSATA standard, which uses the PCI Express Mini Card physical card layout and connectors. Employing a more flexible physical specification, M.2 allows different module widths and lengths, which, paired with the availability of more advanced interfacing features, makes M.2 more suitable than mSATA in general for solid-state storage applications, particularly in smaller devices such as ultrabooks and tablets.
MicroTCA is a modular, open standard, created and maintained by the PCI Industrial Computer Manufacturers Group (PICMG). It provides the electrical, mechanical, thermal and management specifications to create a switched fabric computer system, using Advanced Mezzanine Cards (AMC), connected directly to a backplane. MicroTCA is a descendant of the AdvancedTCA standard.
The computer-on-module for high performance compute (COM-HPC) form factor standard targets high I/O and computer performance levels. Each COM-HPC module integrates core CPU and memory functionality and input and output including USB up to Gen 4, audio, graphics, up to Gen. 5, and Ethernet up to 25 Gbit/s per lane. All I/O signals are mapped to two high density, high speed and low profile connectors on the bottom side of the module. COM-HPC employs a mezzanine-based approach. The COM modules plug into a carrier or base board that is typically customized to the application. Over time, the COM-HPC mezzanine modules can be upgraded to newer, backwards-compatible versions. COM-HPC targets Industrial, Military/Aerospace, Gaming, Medical, Transportation, IoT, and General Computing embedded applications and even scales up to RAM and performance hungry server or edge server applications.
