COM-HPC

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COM-HPC Client Size A module with heat-spreader and customized carrier board Client Carrier with COM-HPC module for PICMG r7.png
COM-HPC Client Size A module with heat-spreader and customized carrier board
COM-HPC Module Size Overview COM-HPC Sizes.jpg
COM-HPC Module Size Overview
Overview of the possible IOs for COM-HPC Server and Client modules COM-HPC Server Client Pinout Overview.png
Overview of the possible IOs for COM-HPC Server and Client modules
Top Side of a COM-HPC Module with CPU and SODIMM memory socket COM-HPC Size A Module Top Side.png
Top Side of a COM-HPC Module with CPU and SODIMM memory socket
Bottom Side of a COM-HPC Module COM-HPC Size A Module Bottom Side.png
Bottom Side of a COM-HPC Module
COM-HPC Carrier Board Connector COM-HPC Carrier Board Module Connector.jpg
COM-HPC Carrier Board Connector

The computer-on-module for high performance compute (COM-HPC) form factor standard targets high I/O and computer performance levels. Each COM-HPC module integrates core CPU and memory functionality and input and output including USB up to Gen 4, audio (MIPI SoundWire, I2S and DMIC), graphics, (PCI Express) up to Gen. 5, and Ethernet up to 25 Gbit/s per lane. All I/O signals are mapped to two high density, high speed and low profile connectors on the bottom side of the module. COM-HPC employs a mezzanine-based approach. The COM modules plug into a carrier or base board that is typically customized to the application. Over time, the COM-HPC mezzanine modules can be upgraded to newer, backwards-compatible versions. COM-HPC targets Industrial, Military/Aerospace, Gaming, Medical, Transportation, IoT, and General Computing embedded applications and even scales up to RAM and performance hungry server or edge server applications.

Contents

History

The PICMG work-group officially started in October 23, 2018.

Types

There are 3 different pin outs defined in the specification.

Summary of COM-HPC IOs by Pinout Type
IO TypeClient PinoutServer PinoutMini Pinout
PCIe 49 (1 BMC dedicated lane)65 (1 BMC dedicated lane)16 (shared with 2xSATA and 2x ETH Serdes)
Ethernet2x NbaseT1x NbaseT2x NbaseT + 2x Serdes (shared with PCIe)
25 Gigabit Ethernet KR280
USB4 (Can also be used for USB 3.x or USB 2.0)424 (shared with DDI & USB3.2)
USB 2.0888
DDI (Digital Display Interface for HDMI or DisplayPort)302 (shared with USB4 and USB3.2)
eDP or MIPI DSI (for flat panel displays)101
MIPI SoundWire or DMIC202
I2S or MIPI SoundWire1 I2S (or 2 Soundwire)01 I2S (or 2 Soundwire)
MIPI CSI-3 (CSI-2 also supported)202 on flatfoil connector
SATA 222 shared with PCIe
GPIO 121212
UART 222
IPMB110
eSPI (includes 2 Chip Select Pins)111
SPI (for boot devices)222
GP_SPI (includes 4 Chip Select Pins)111
I2C222
SMB 111
DC Power Input8-20 Volt12 Volt +/- 5%8-20 Volt

Size

The specification defines 6 module sizes:

The sizes A, B and C are typical Client Type sizes.

The larger D and E sizes are typical Server Type sizes to support full size DRAM modules

Specification

The COM-HPC specification is hosted by PICMG. It is not freely available but may be purchased from the PICMG website. [1] PICMG provides a preview version for free download. [2] The COM-HPC hardware specification will be released Jan 2021. Further COM-HPC related documents will be released in 2021

See also

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References

  1. "PICMG website".
  2. "Free COM-HPC preview specification" (PDF).