SSI CEB

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The Compact Electronics Bay Specification (CEB) as well as EEB, MEB and TEB are standard form factors for dual or multi processor motherboards defined by the Server System Infrastructure (SSI) Forum. The specification is intended for value servers and workstations based on the Intel Xeon and AMD Epyc processors (X399/C600 chipsets)

Contents

NameForm factor (height × length)
Compact Electronics Bay (CEB)12 × 10.5 in (approximated to 305 × 266.7 mm) [1]
Enterprise Electronics Bay (EEB)12 × 13 in (305 × 330 mm) [1]
Thin Electronics Bay (TEB) [2] Same as EEB [3] [1] [4]
Midrange Electronics Bay (MEB) [5] 16 × 13 in (approximated to 406.4 x 330 mm) [6]

The SSI CEB specification was derived from the EEB and ATX specifications. SSI CEB motherboards have the same IO connector area and many of the same motherboard mounting holes as ATX motherboards, although SSI CEB motherboards are larger in size than ATX motherboards and have different processor mounting holes. The rear panel aperture is identical to the EEB and ATX specification and expansion cards mounted on an SSI CEB motherboard appear much the same as they would on an ATX motherboard.

To standardize thermal behavior, processor position is defined, including primary and secondary processor identification. For motherboards with only one processor installed, it is recommended the primary processor socket be populated first.

History

In the "2007 Version 1.0" revision, the separate CEB & TEB specifications were consolidated into the EEB specification. [7]

References

  1. 1 2 3 SSI Forum (April 2012). "2.1 Layout and Baseboard Mounting Locations". Enterprise Electronics Bay Specification for 2011 Dual-Socket Servers and Workstations, Version 1.0.1 (PDF). Storage Networking Industry Association. p. 9. Archived (PDF) from the original on 21 June 2025.
  2. ↑ "SSI Releases EEB 2011 Specification to Rev 1.0". SSI forum. 2010-02-25. Archived from the original on 2016-03-04.
  3. ↑ SSI Forum (April 2012). "1 Introduction". Enterprise Electronics Bay Specification for 2011 Dual-Socket Servers and Workstations, Version 1.0.1 (PDF). Storage Networking Industry Association. p. 6. Archived (PDF) from the original on 21 June 2025. TEB leverages the majority of the EEB specification requirements and adds some additional constraints due to reduced system heights
  4. ↑ Mueller, Scott; Soper, Mark Edward; Sosinsky, Barrie (May 2006). "Chapter 4. Server Motherboards and BIOS § The TEB Form Factor". Upgrading and Repairing Servers. Indianapolis: Que Publishing. ISBN   0-7897-2815-X. The size of a TEB version 2.11 motherboard is the same as that used by the latest version of EEB
  5. ↑ Mueller, Scott; Soper, Mark Edward; Sosinsky, Barrie (May 2006). "Chapter 4. Server Motherboards and BIOS § Motherboard Types and Form Factors". Upgrading and Repairing Servers. Indianapolis: Que Publishing. ISBN   0-7897-2815-X.
  6. ↑ Mueller, Scott; Soper, Mark Edward; Sosinsky, Barrie (May 2006). "Table 4.2 ATX and SSI Motherboard Form Factors Compared". Upgrading and Repairing Servers. Indianapolis: Que Publishing. ISBN   0-7897-2815-X.
  7. ↑ SSI Forum (2012). "Revision History". Enterprise Electronics Bay Specification for 2008 Dual-Socket Servers and Workstations, Version 1.0.1 (PDF). Storage Networking Industry Association. p. 4. Archived (PDF) from the original on 2 August 2024.
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