Electroplating, also known as electrochemical deposition or electrodeposition, is a process for producing a metal coating on a solid substrate through the reduction of cations of that metal by means of a direct electric current. The part to be coated acts as the cathode of an electrolytic cell; the electrolyte is a solution of a salt whose cation is the metal to be coated, and the anode is usually either a block of that metal, or of some inert conductive material. The current is provided by an external power supply.
Chrome plating is a technique of electroplating a thin layer of chromium onto a metal object. A chrome plated part is called chrome, or is said to have been chromed. The chromium layer can be decorative, provide corrosion resistance, facilitate cleaning, and increase surface hardness. Sometimes a less expensive substitute for chrome, such as nickel, may be used for aesthetic purposes.
Faraday's laws of electrolysis are quantitative relationships based on the electrochemical research published by Michael Faraday in 1833.
Plating is a finishing process in which a metal is deposited on a surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for radiation shielding, and for other purposes. Jewelry typically uses plating to give a silver or gold finish.
Copper electroplating is the process of electroplating a layer of copper onto the surface of a metal object. Copper is used both as a standalone coating and as an undercoat onto which other metals are subsequently plated. The copper layer can be decorative, provide corrosion resistance, increase electrical and thermal conductivity, or improve the adhesion of additional deposits to the substrate.
Gold plating is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver, by a chemical or electrochemical (electroplating) process. Plating refers to modern coating methods, such as the ones used in the electronics industry, whereas gilding is the decorative covering of an object with gold, which typically involve more traditional methods and much larger objects.
Metallizing is the general name for the technique of coating metal on the surface of objects. Metallic coatings may be decorative, protective or functional.
Silvering is the chemical process of coating a non-conductive substrate such as glass with a reflective substance, to produce a mirror. While the metal is often silver, the term is used for the application of any reflective metal.
Electrotyping is a chemical method for forming metal parts that exactly reproduce a model. The method was invented by a Prussian engineer Moritz von Jacobi in Russia in 1838, and was immediately adopted for applications in printing and several other fields. As described in an 1890 treatise, electrotyping produces "an exact facsimile of any object having an irregular surface, whether it be an engraved steel- or copper-plate, a wood-cut, or a form of set-up type, to be used for printing; or a medal, medallion, statue, bust, or even a natural object, for art purposes."
Compact disc manufacturing is the process by which commercial compact discs (CDs) are replicated in mass quantities using a master version created from a source recording. This may be either in audio form (CD-DA) or data form (CD-ROM). This process is used in the mastering of read-only compact discs. DVDs and Blu-rays use similar methods.
Electrometallurgy is a method in metallurgy that uses electrical energy to produce metals by electrolysis. It is usually the last stage in metal production and is therefore preceded by pyrometallurgical or hydrometallurgical operations. The electrolysis can be done on a molten metal oxide which is used for example to produce aluminium from aluminium oxide via the Hall-Hérault process. Electrolysis can be used as a final refining stage in pyrometallurgical metal production (electrorefining) and it is also used for reduction of a metal from an aqueous metal salt solution produced by hydrometallurgy (electrowinning).
LIGA is a fabrication technology used to create high-aspect-ratio microstructures. The term is a German acronym for Lithographie, Galvanoformung, Abformung – lithography, electroplating, and molding.
Electroless nickel-phosphorus plating, also referred to as E-nickel, is a chemical process that deposits an even layer of nickel-phosphorus alloy on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing nickel salt and a phosphorus-containing reducing agent, usually a hypophosphite salt. It is the most common version of electroless nickel plating and is often referred by that name. A similar process uses a borohydride reducing agent, yielding a nickel-boron coating instead.
Electrogalvanizing is a process in which a layer of zinc is bonded to steel in order to protect against corrosion. The process involves electroplating, running a current of electricity through a saline/zinc solution with a zinc anode and steel conductor. Such Zinc electroplating or Zinc alloy electroplating maintains a dominant position among other electroplating process options, based upon electroplated tonnage per annum. According to the International Zinc Association, more than 5 million tons are used yearly for both hot dip galvanizing and electroplating. The plating of zinc was developed at the beginning of the 20th century. At that time, the electrolyte was cyanide based. A significant innovation occurred in the 1960s, with the introduction of the first acid chloride based electrolyte. The 1980s saw a return to alkaline electrolytes, only this time, without the use of cyanide. The most commonly used electrogalvanized cold rolled steel is SECC, acronym of "Steel, Electrogalvanized, Cold-rolled, Commercial quality". Compared to hot dip galvanizing, electroplated zinc offers these significant advantages:
Grinding is a type of abrasive machining process which uses a grinding wheel as cutting tool.
A molded interconnect device (MID) is an injection-molded thermoplastic part with integrated electronic circuit traces. The use of high temperature thermoplastics and their structured metallization opens a new dimension of circuit carrier design to the electronics industry. This technology combines plastic substrate/housing with circuitry into a single part by selective metallization.
Nickel electroplating is a technique of electroplating a thin layer of nickel onto a metal object. The nickel layer can be decorative, provide corrosion resistance, wear resistance, or used to build up worn or undersized parts for salvage purposes.
Reactive bonding describes a wafer bonding procedure using highly reactive nanoscale multilayer systems as an intermediate layer between the bonding substrates. The multilayer system consists of two alternating different thin metallic films. The self-propagating exothermic reaction within the multilayer system contributes the local heat to bond the solder films. Based on the limited temperature the substrate material is exposed, temperature-sensitive components and materials with different CTEs, i.e. metals, polymers and ceramics, can be used without thermal damage.
Localized pulsed electrodeposition (L-PED) is a technique for direct 3D printing of free-standing and layer-by-layer micro/nano-scale metallic structures at the tip of an electrolyte containing nozzle. The method follows the same principle for metal deposition as the traditional electrodeposition (electroplating), however the area of deposition is limited by the size of a liquid bridge (meniscus) formed between the nozzle tip and the substrate. The unique advantage of the L-PED process is the possibility of the control over the spatial microstructure of the printed metal in 3D geometries by adjusting deposition parameters. This method can be used in various applications in nanotechnology, in particular for 3-dimensional electronics and sensors.
Electroless copper plating is a chemical process that deposits an even layer of copper on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing copper salts and a reducing agent such as formaldehyde.
