This article needs additional citations for verification .(August 2008) |
A highly accelerated life test (HALT) is a stress testing methodology for enhancing product reliability in which prototypes are stressed to a much higher degree than expected from actual use in order to identify weaknesses in the design or manufacture of the product. [1] Manufacturing and research and development organizations in the electronics, computer, medical, and military industries use HALT to improve product reliability.
HALT can be effectively used multiple times over a product's life time. During product development, it can find design weakness earlier in the product lifecycle when changes are much less costly to make. By finding weaknesses and making changes early, HALT can lower product development costs and compress time to market. When HALT is used at the time a product is being introduced into the market, it can expose problems caused by new manufacturing processes. When used after a product has been introduced into the market, HALT can be used to audit product reliability caused by changes in components, manufacturing processes, suppliers, etc.
Highly accelerated life testing (HALT) techniques are important in uncovering many of the weak links of a new product. These discovery tests rapidly find weaknesses using accelerated stress conditions. The goal of HALT is to proactively find weaknesses and fix them, thereby increasing product reliability. Because of its accelerated nature, HALT is typically faster and less expensive than traditional testing techniques.
HALT is a test technique called test-to-fail, where a product is tested until failure. HALT does not help to determine or demonstrate the reliability value or failure probability in field. Many accelerated life tests are test-to-pass, meaning they are used to demonstrate the product life or reliability.
It is highly recommended to perform HALT in the initial phases of product development to uncover weak links in a product, so that there is better chance and more time to modify and improve the product.
HALT uses several stress factors (decided by a Reliability Test Engineer) and/or the combination of various factors. Commonly used stress factors are temperature, vibration, and humidity for electronics and mechanical products. Other factors can include voltage, current, power cycling and combinations of them.
Environmental stresses are applied in a HALT procedure, [2] eventually reaching a level significantly beyond that expected during use. The stresses used in HALT are typically hot and cold temperatures, temperature cycles, random vibration, power margining, and power cycling. The product under test is in operation during HALT and is continuously monitored for failures. As stress-induced failures occur, the cause should be determined, and if possible, the problem should be repaired so that the test can continue to find other weaknesses.
Output of the HALT gives you:
A specialized environmental chamber is required for HALT. A suitable chamber also has to be capable of applying pseudo-random vibration with a suitable profile in relation to frequency. The HALT chamber should be capable of applying random vibration energy from 2 to 10,000 Hz in 6 degrees of freedom and temperatures from -100 to +200°C. [3] Sometimes HALT chambers are called repetitive shock chambers because pneumatic air hammers are used to produce vibration. The chamber should also be capable of rapid changes in temperature, 50°C per minute should be considered a minimum rate of change. Usually high power resistive heating elements are used for heating and liquid nitrogen (LN2) is used for cooling.
Test fixtures must transmit vibration to the item under test. They must also be open in design or use air circulation to produce rapid temperature change to internal components. Test fixtures can use simple channels to attach the product to the chamber table or more complicated fixtures sometimes are fabricated.
The equipment under test must be monitored so that if the equipment fails under test, the failure is detected. Monitoring is typically performed with thermocouple sensors, vibration accelerometers, multimeters and data loggers. Common causes of failures during HALT are poor product design, workmanship, and poor manufacturing. Failures to individual components such as resistors, capacitors, diodes, printed circuit boards occur because of these issues. Failure types found during HALT testing are associated with the infant mortality region of the bathtub curve. [1]
HALT is conducted before qualification testing. By catching failures early, flaws are found earlier in the acceptance process, eliminating repetitive later-stage reviews.
Reliability engineering is a sub-discipline of systems engineering that emphasizes the ability of equipment to function without failure. Reliability is defined as the probability that a product, system, or service will perform its intended function adequately for a specified period of time, OR will operate in a defined environment without failure. Reliability is closely related to availability, which is typically described as the ability of a component or system to function at a specified moment or interval of time.
Environmental stress screening (ESS) refers to the process of exposing a newly manufactured or repaired product or component to stresses such as thermal cycling and vibration in order to force latent defects to manifest themselves by permanent or catastrophic failure during the screening process. The surviving population, upon completion of screening, can be assumed to have a higher reliability than a similar unscreened population.
A structural load or structural action is a mechanical load applied to structural elements. A load causes stress, deformation, displacement or acceleration in a structure. Structural analysis, a discipline in engineering, analyzes the effects of loads on structures and structural elements. Excess load may cause structural failure, so this should be considered and controlled during the design of a structure. Particular mechanical structures—such as aircraft, satellites, rockets, space stations, ships, and submarines—are subject to their own particular structural loads and actions. Engineers often evaluate structural loads based upon published regulations, contracts, or specifications. Accepted technical standards are used for acceptance testing and inspection.
A test engineer is a professional who determines how to create a process that would best test a particular product in manufacturing and related disciplines, in order to assure that the product meets applicable specifications. Test engineers are also responsible for determining the best way a test can be performed in order to achieve adequate test coverage. Often test engineers also serve as a liaison between manufacturing, design engineering, sales engineering and marketing communities as well.
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge. Product safety standards may dictate particular features of a consumer product, for example, external case temperature or grounding of exposed metal parts. Prototypes and industrial equipment made in small quantities may use standardized commercially available enclosures such as card cages or prefabricated boxes. Mass-market consumer devices may have highly specialized packaging to increase consumer appeal. Electronic packaging is a major discipline within the field of mechanical engineering.
The ongoing reliability test (ORT) is a hardware test process usually used in manufacturing to ensure that quality of the products is still of the same specifications as the day it first went to production or general availability.
Microvias are used as the interconnects between layers in high density interconnect (HDI) substrates and printed circuit boards (PCBs) to accommodate the high input/output (I/O) density of advanced packages. Driven by portability and wireless communications, the electronics industry strives to produce affordable, light, and reliable products with increased functionality. At the electronic component level, this translates to components with increased I/Os with smaller footprint areas, and on the printed circuit board and package substrate level, to the use of high density interconnects (HDIs).
Reliability of a semiconductor device is the ability of the device to perform its intended function during the life of the device in the field.
An environmental chamber, also called a climatic chamber or climate chamber, is an enclosure used to test the effects of specified environmental conditions on biological items, industrial products, materials, and electronic devices and components.
Accelerated life testing is the process of testing a product by subjecting it to conditions in excess of its normal service parameters in an effort to uncover faults and potential modes of failure in a short amount of time. By analyzing the product's response to such tests, engineers can make predictions about the service life and maintenance intervals of a product.
Package testing or packaging testing involves the measurement of a characteristic or property involved with packaging. This includes packaging materials, packaging components, primary packages, shipping containers, and unit loads, as well as the associated processes.
Electronic components have a wide range of failure modes. These can be classified in various ways, such as by time or cause. Failures can be caused by excess temperature, excess current or voltage, ionizing radiation, mechanical shock, stress or impact, and many other causes. In semiconductor devices, problems in the device package may cause failures due to contamination, mechanical stress of the device, or open or short circuits.
HASA is a proven test method developed to find manufacturing/production process induced defects in electronics and electro-mechanical assemblies before those products are released to market. HASA is a form of HASS – a powerful testing tool for improving product reliability, reducing warranty costs and increasing customer satisfaction.
Physics of failure is a technique under the practice of reliability design that leverages the knowledge and understanding of the processes and mechanisms that induce failure to predict reliability and improve product performance.
Sherlock Automated Design Analysis is a software tool developed by DfR Solutions for analyzing, grading, and certifying the expected reliability of products at the circuit card assembly level. Based on the physics of failure, Sherlock predicts failure mechanism-specific failure rates over time using a combination of finite element method and material properties to capture stress values and first order analytical equations to evaluate damage evolution. The software is designed for use by design and reliability engineers and managers in the electronics industry. DfR Solutions is based in Beltsville, Maryland, USA, and was acquired by Ansys in May 2019.
Robustness validation is a skills strategy with which the Robustness of a product to the loading conditions of a real application is proven and targeted statements about risks and reliability can be made. This strategy is particularly for use in the automotive industry however could be applied to any industry where high levels of reliability are required
High-temperature operating life (HTOL) is a reliability test applied to integrated circuits (ICs) to determine their intrinsic reliability. This test stresses the IC at an elevated temperature, high voltage and dynamic operation for a predefined period of time. The IC is usually monitored under stress and tested at intermediate intervals. This reliability stress test is sometimes referred to as a lifetime test, device life test or extended burn in test and is used to trigger potential failure modes and assess IC lifetime.
A stress test of hardware is a form of deliberately intense and thorough testing used to determine the stability of a given system or entity. It involves testing beyond normal operational capacity, often to a breaking point, in order to observe the results.
NIU College of Engineering and Engineering Technology was established in 1985 and offers ABET and ATMAE accredited programs in engineering and engineering technology. The college offers degree programs in electrical engineering, mechanical engineering, industrial and systems engineering, engineering technology, and industrial technology.
Solder fatigue is the mechanical degradation of solder due to deformation under cyclic loading. This can often occur at stress levels below the yield stress of solder as a result of repeated temperature fluctuations, mechanical vibrations, or mechanical loads. Techniques to evaluate solder fatigue behavior include finite element analysis and semi-analytical closed-form equations.
{{cite book}}
: CS1 maint: location missing publisher (link)