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A logic gate is a device that performs a Boolean function, a logical operation performed on one or more binary inputs that produces a single binary output. Depending on the context, the term may refer to an ideal logic gate, one that has, for instance, zero rise time and unlimited fan-out, or it may refer to a non-ideal physical device.
An operational amplifier is a DC-coupled high-gain electronic voltage amplifier with a differential input and, usually, a single-ended output. In this configuration, an op amp produces an output potential that is typically 100,000 times larger than the potential difference between its input terminals. The operational amplifier traces its origin and name to analog computers, where they were used to perform mathematical operations in linear, non-linear, and frequency-dependent circuits.
The signal-to-noise and distortion ratio (SINAD) is a measure of the quality of a signal from a communications device, often defined as
A microphone, colloquially called a mic, is a transducer that converts sound into an electrical signal. Microphones are used in many applications such as telephones, hearing aids, public address systems for concert halls and public events, motion picture production, live and recorded audio engineering, sound recording, two-way radios, megaphones, and radio and television broadcasting. They are also used in computers and other electronic devices, such as mobile phones, for recording sounds, speech recognition, VoIP, and other purposes, such as ultrasonic sensors or knock sensors.
The BNC connector is a miniature quick connect/disconnect radio frequency connector used for coaxial cable. It is designed to maintain the same characteristic impedance of the cable, with 50 ohm and 75 ohm types being made. It is usually applied for video and radio frequency connections up to about 2 GHz and up to 500 volts. The connector has a twist to lock design with two lugs in the female portion of the connector engaging a slot in the shell of the male portion. The type was introduced on military radio equipment in the 1940s and has since become widely applied in radio systems, and is a common type of video connector. Similar radio-frequency connectors differ in dimensions and attachment features, and may allow for higher voltages, higher frequencies, or three-wire connections.
In electronics, emitter-coupled logic (ECL) is a high-speed integrated circuit bipolar transistor logic family. ECL uses an overdriven bipolar junction transistor (BJT) differential amplifier with single-ended input and limited emitter current to avoid the saturated region of operation and its slow turn-off behavior. As the current is steered between two legs of an emitter-coupled pair, ECL is sometimes called current-steering logic (CSL), current-mode logic (CML) or current-switch emitter-follower (CSEF) logic.
A United States defense standard, often called a military standard, "MIL-STD", "MIL-SPEC", or (informally) "MilSpecs", is used to help achieve standardization objectives by the U.S. Department of Defense.
A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices and passive components, bonded to a substrate or printed circuit board (PCB). A PCB having components on a Printed Wiring Board (PWB) is not considered a true hybrid circuit according to the definition of MIL-PRF-38534.
Environmental stress screening (ESS) refers to the process of exposing a newly manufactured or repaired product or component to stresses such as thermal cycling and vibration in order to force latent defects to manifest themselves by permanent or catastrophic failure during the screening process. The surviving population, upon completion of screening, can be assumed to have a higher reliability than a similar unscreened population.
A sound level meter is used for acoustic measurements. It is commonly a hand-held instrument with a microphone. The best type of microphone for sound level meters is the condenser microphone, which combines precision with stability and reliability. The diaphragm of the microphone responds to changes in air pressure caused by sound waves. That is why the instrument is sometimes referred to as a sound pressure level meter (SPL). This movement of the diaphragm, i.e. the sound pressure, is converted into an electrical signal. While describing sound in terms of sound pressure, a logarithmic conversion is usually applied and the sound pressure level is stated instead, in decibels (dB), with 0 dB SPL equal to 20 micropascals.
A Wilson current mirror is a three-terminal circuit that accepts an input current at the input terminal and provides a "mirrored" current source or sink output at the output terminal. The mirrored current is a precise copy of the input current. It may be used as a Wilson current source by applying a constant bias current to the input branch as in Fig. 2. The circuit is named after George R. Wilson, an integrated circuit design engineer who worked for Tektronix. Wilson devised this configuration in 1967 when he and Barrie Gilbert challenged each other to find an improved current mirror overnight that would use only three transistors. Wilson won the challenge.
In electronics, high impedance means that a point in a circuit allows a relatively small amount of current through, per unit of applied voltage at that point. High impedance circuits are low current and potentially high voltage, whereas low impedance circuits are the opposite. Numerical definitions of "high impedance" vary by application.
A test probe is a physical device used to connect electronic test equipment to a device under test (DUT). Test probes range from very simple, robust devices to complex probes that are sophisticated, expensive, and fragile. Specific types include test prods, oscilloscope probes and current probes. A test probe is often supplied as a test lead, which includes the probe, cable and terminating connector.
A line impedance stabilization network (LISN) is a device used in conducted and radiated radio-frequency emission and susceptibility tests, as specified in various electromagnetic compatibility (EMC)/EMI test standards.
Electrical or fiber-optic connectors used by U.S. Department of Defense were originally developed in the 1930s for severe aeronautical and tactical service applications, and the Type "AN" (Army-Navy) series set the standard for modern military circular connectors. These connectors, and their evolutionary derivatives, are often called Military Standard, "MIL-STD", or (informally) "MIL-SPEC" or sometimes "MS" connectors. They are now used in aerospace, industrial, marine, and even automotive commercial applications.
MIL-PRF-38535 is a United States military specification that establishes the general performance and verification requirements of single die integrated circuit device type electronics. It is a performance-based specification document defining the general requirements, as well as the quality assurance and reliability requirements, for the manufacture of microelectronic or integrated circuits used in military applications and high-reliability microcircuit application programs.
Flatpack is a US military standardized printed-circuit-board surface-mount-component package. The military standard MIL-STD-1835C defines: Flat package (FP). A rectangular or square package with leads parallel to base plane attached on two opposing sides of the package periphery.
Reliability of a semiconductor device is the ability of the device to perform its intended function during the life of the device in the field.
A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers before being diced into die, tested, and packaged. The package provides a means for connecting it to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader. There are thousands of package types in use. Some are defined by international, national, or industry standards, while others are particular to an individual manufacturer.
References
- ↑ "Mil-Std-883F, Department of Defense Test Method Standard: Microcircuits, Test Standards (18 Jun 2004) [S/S By Mil-Std-883G]" (PDF). EverySpec LLC. 2004-06-18. Archived (PDF) from the original on 2021-10-11. Retrieved 2022-11-27.