An integrated circuit or monolithic integrated circuit is a set of electronic circuits on one small flat piece of semiconductor material that is normally silicon. The integration of large numbers of tiny transistors into a small chip results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs.
Robert Drost is an American computer scientist. He was born in 1970 in New York City.
Ivan Edward Sutherland is an American computer scientist and Internet pioneer, widely regarded as the "father of computer graphics". His early work in computer graphics as well as his teaching with David C. Evans in that subject at the University of Utah in the 1970s was pioneering in the field. Sutherland, Evans, and their students from that era invented several foundations of modern computer graphics. He received the Turing Award from the Association for Computing Machinery in 1988 for the invention of Sketchpad, an early predecessor to the sort of graphical user interface that has become ubiquitous in personal computers. He is a member of the National Academy of Engineering, as well as the National Academy of Sciences among many other major awards. In 2012 he was awarded the Kyoto Prize in Advanced Technology for "pioneering achievements in the development of computer graphics and interactive interfaces".
Proximity communication replaces wires by capacitive coupling, promises significant increase in communications speed between chips in an electronic system, among other benefits.[1] Partially funded by a $50 million award from the Defense Advanced Research Projects Agency.
Comparing traditional area ball bonding, proximity communication has one order smaller scale, so it can be two order densier (in terms of connection number/PIN) than ball bonding. This technique requires very good alignment between chips and very small gaps between transmitting (Tx) and receiving (Rx) parts (2-3 micrometers), which can be destroyed by thermal expansion, vibration, dust, etc.
Chip transmitter consists (according to presentation slide) of big 32x32 array of very small Tx micropads, 4x4 array of bigger Rx micropads (four times bigger than tx micropad), and two linear arrays of 14 X vernier and 14 Y vernier.
Proximity communication can be used with 3D packing on chips in Multi-Chip Module, allowing to connect several MCM without sockets and wires.
Speed was up to 1.35 Gbit/s/channel in tests of 16 channel systems. BER < 10−12. Static power is 3.6mW/channel, dynamic power is 3.9 pJ/bit.
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In telecommunications and computer networks, multiplexing is a method by which multiple analog or digital signals are combined into one signal over a shared medium. The aim is to share a scarce resource. For example, in telecommunications, several telephone calls may be carried using one wire. Multiplexing originated in telegraphy in the 1870s, and is now widely applied in communications. In telephony, George Owen Squier is credited with the development of telephone carrier multiplexing in 1910.
A system on a chip or system on chip is an integrated circuit that integrates all components of a computer or other electronic system. These components typically include a central processing unit (CPU), memory, input/output ports and secondary storage – all on a single substrate or microchip, the size of a coin. It may contain digital, analog, mixed-signal, and often radio frequency signal processing functions, depending on the application. As they are integrated on a single substrate, SoCs consume much less power and take up much less area than multi-chip designs with equivalent functionality. Because of this, SoCs are very common in the mobile computing and edge computing markets. Systems on chip are commonly used in embedded systems and the Internet of Things.
High frequency (HF) is the ITU designation for the range of radio frequency electromagnetic waves between 3 to 30 megahertz (MHz). It is also known as the decameter band or decameter wave as its wavelengths range from one to ten decameters. Frequencies immediately below HF are denoted medium frequency (MF), while the next band of higher frequencies is known as the very high frequency (VHF) band. The HF band is a major part of the shortwave band of frequencies, so communication at these frequencies is often called shortwave radio. Because radio waves in this band can be reflected back to Earth by the ionosphere layer in the atmosphere – a method known as "skip" or "skywave" propagation – these frequencies are suitable for long-distance communication across intercontinental distances and for mountainous terrains which prevent line-of-sight communications. The band is used by international shortwave broadcasting stations (2.31–25.82 MHz), aviation communication, government time stations, weather stations, amateur radio and citizens band services, among other uses.
GeoPort is a serial data system used on some models of the Apple Macintosh that could be externally clocked to run at a 2 Mbit/s data rate. GeoPort slightly modified the existing Mac serial port pins to allow the computer's internal DSP hardware or software to send data that, when passed to a digital-to-analog converter, emulated various devices such as modems and fax machines. GeoPort could be found on late-model 68K-based machines as well as many pre-USB Power Macintosh models. Some later Macintosh models also included an internal GeoPort via an internal connector on the Communications Slot. Apple GeoPort technology is now obsolete, and modem support is typically offered through USB.
A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
A DNA microarray is a collection of microscopic DNA spots attached to a solid surface. Scientists use DNA microarrays to measure the expression levels of large numbers of genes simultaneously or to genotype multiple regions of a genome. Each DNA spot contains picomoles of a specific DNA sequence, known as probes. These can be a short section of a gene or other DNA element that are used to hybridize a cDNA or cRNA sample under high-stringency conditions. Probe-target hybridization is usually detected and quantified by detection of fluorophore-, silver-, or chemiluminescence-labeled targets to determine relative abundance of nucleic acid sequences in the target. The original nucleic acid arrays were macro arrays approximately 9 cm × 12 cm and the first computerized image based analysis was published in 1981. It was invented by Patrick O. Brown.
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Dept., Utica, N.Y. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry, it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to external circuitry.
Liquid crystal on silicon is a miniaturized reflective active-matrix liquid-crystal display or "microdisplay" using a liquid crystal layer on top of a silicon backplane. It is also referred to as a spatial light modulator. LCoS was initially developed for projection televisions but is now used for wavelength selective switching, structured illumination, near-eye displays and optical pulse shaping. By way of comparison, some LCD projectors use transmissive LCD, allowing light to pass through the liquid crystal.
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board.
HP Integrity is a series of server computers produced by Hewlett Packard Enterprise since 2003, based on the Itanium processor. The Integrity brand name was inherited by HP from Tandem Computers via Compaq.
In electronics, a lead is an electrical connection consisting of a length of wire or a metal pad that is designed to connect two locations electrically. Leads are used for many purposes, including: transfer of power; testing of an electrical circuit to see if it is working, using a test light or a multimeter; transmitting information, as when the leads from an electrocardiograph, or ECG are attached to a person's body to transmit information about their heart rhythm; and sometimes to act as a heatsink. The tiny leads coming off through-hole components are also often called pins.
A network on a chip or network-on-chip is a network-based communications subsystem on an integrated circuit ("microchip"), most typically between modules in a system on a chip (SoC). The modules on the IC are typically semiconductor IP cores schematizing various functions of the computer system, and are designed to be modular in the sense of network science. The network on chip is a router-based packet switching network between SoC modules.
DCB was a proprietary data interchange interface by Roland Corporation, developed in 1981 and introduced in 1982 in their Roland Juno-60 and Roland Jupiter-8 products. DCB functions were basically the same as MIDI, but unlike MIDI, DCB could provide note on/off, program change and vcf/vca control only. DCB-to-MIDI adapters were produced for a number of early Roland products. The DCB interface was made in 2 variants, the earlier one used 20-pin sockets and cables, later switching to the 14-pin Amphenol DDK connector vaguely resembling a parallel port.
Fiber-optic communication is a method of transmitting information from one place to another by sending pulses of light through an optical fiber. The light forms an electromagnetic carrier wave that is modulated to carry information. Fiber is preferred over electrical cabling when high bandwidth, long distance, or immunity to electromagnetic interference are required.
In radio, multiple-input and multiple-output, or MIMO, is a method for multiplying the capacity of a radio link using multiple transmission and receiving antennas to exploit multipath propagation. MIMO has become an essential element of wireless communication standards including IEEE 802.11n (Wi-Fi), IEEE 802.11ac (Wi-Fi), HSPA+ (3G), WiMAX (4G), and Long Term Evolution. More recently, MIMO has been applied to power-line communication for 3-wire installations as part of ITU G.hn standard and HomePlug AV2 specification.
RX is the family name for a range of 32-bit microcontrollers manufactured by Renesas Electronics. RX is an acronym for Renesas Extreme, a description of the key concept behind the product family, that is "extreme high performance".
In computing, a logic block or configurable logic block (CLB) is a fundamental building block of field-programmable gate array (FPGA) technology. Logic blocks can be configured by the engineer to provide reconfigurable logic gates.
