Complementary metal–oxide–semiconductor is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips, and other digital logic circuits. CMOS technology is also used for analog circuits such as image sensors, data converters, RF circuits, and highly integrated transceivers for many types of communication.
A breadboard, solderless breadboard, or protoboard is a construction base used to build semi-permanent prototypes of electronic circuits. Unlike a perfboard or stripboard, breadboards do not require soldering or destruction of tracks and are hence reusable. For this reason, breadboards are also popular with students and in technological education.
The farad (symbol: F) is the unit of electrical capacitance, the ability of a body to store an electrical charge, in the International System of Units (SI), equivalent to 1 coulomb per volt (C/V). It is named after the English physicist Michael Faraday (1791–1867). In SI base units 1 F = 1 kg−1⋅m−2⋅s4⋅A2.
In electronics and especially synchronous digital circuits, a clock signal is an electronic logic signal which oscillates between a high and a low state at a constant frequency and is used like a metronome to synchronize actions of digital circuits. In a synchronous logic circuit, the most common type of digital circuit, the clock signal is applied to all storage devices, flip-flops and latches, and causes them all to change state simultaneously, preventing race conditions.
In digital electronics, the fan-out is the number of gate inputs driven by the output of another single logic gate.
The RC time constant, denoted τ, the time constant of a resistor–capacitor circuit, is equal to the product of the circuit resistance and the circuit capacitance :
In computer engineering, a logic family is one of two related concepts:
Speaker wire is used to make the electrical connection between loudspeakers and audio amplifiers. Modern speaker wire consists of two or more electrical conductors individually insulated by plastic or, less commonly, rubber. The two wires are electrically identical, but are marked to identify the correct audio signal polarity. Most commonly, speaker wire comes in the form of zip cord.
Signal integrity or SI is a set of measures of the quality of an electrical signal. In digital electronics, a stream of binary values is represented by a voltage waveform. However, digital signals are fundamentally analog in nature, and all signals are subject to effects such as noise, distortion, and loss. Over short distances and at low bit rates, a simple conductor can transmit this with sufficient fidelity. At high bit rates and over longer distances or through various mediums, various effects can degrade the electrical signal to the point where errors occur and the system or device fails. Signal integrity engineering is the task of analyzing and mitigating these effects. It is an important activity at all levels of electronics packaging and assembly, from internal connections of an integrated circuit (IC), through the package, the printed circuit board (PCB), the backplane, and inter-system connections. While there are some common themes at these various levels, there are also practical considerations, in particular the interconnect flight time versus the bit period, that cause substantial differences in the approach to signal integrity for on-chip connections versus chip-to-chip connections.
A network on a chip or network-on-chip is a network-based communications subsystem on an integrated circuit ("microchip"), most typically between modules in a system on a chip (SoC). The modules on the IC are typically semiconductor IP cores schematizing various functions of the computer system, and are designed to be modular in the sense of network science. The network on chip is a router-based packet switching network between SoC modules.
A switched capacitor (SC) is an electronic circuit that implements a function by moving charges into and out of capacitors when electronic switches are opened and closed. Usually, non-overlapping clock signals are used to control the switches, so that not all switches are closed simultaneously. Filters implemented with these elements are termed switched-capacitor filters, which depend only on the ratios between capacitances and the switching frequency, and not on precise resistors. This makes them much more suitable for use within integrated circuits, where accurately specified resistors and capacitors are not economical to construct, but accurate clocks and accurate relative ratios of capacitances are economical.
A test probe is a physical device used to connect electronic test equipment to a device under test (DUT). Test probes range from very simple, robust devices to complex probes that are sophisticated, expensive, and fragile. Specific types include test prods, oscilloscope probes and current probes. A test probe is often supplied as a test lead, which includes the probe, cable and terminating connector.
Distributed amplifiers are circuit designs that incorporate transmission line theory into traditional amplifier design to obtain a larger gain-bandwidth product than is realizable by conventional circuits.
A bias tee is a three-port network used for setting the DC bias point of some electronic components without disturbing other components. The bias tee is a diplexer. The low-frequency port is used to set the bias; the high-frequency port passes the radio-frequency signals but blocks the biasing levels; the combined port connects to the device, which sees both the bias and RF. It is called a tee because the 3 ports are often arranged in the shape of a T.
A radio-frequency microelectromechanical system is a microelectromechanical system with electronic components comprising moving sub-millimeter-sized parts that provide radio-frequency (RF) functionality. RF functionality can be implemented using a variety of RF technologies. Besides RF MEMS technology, III-V compound semiconductor, ferrite, ferroelectric, silicon-based semiconductor, and vacuum tube technology are available to the RF designer. Each of the RF technologies offers a distinct trade-off between cost, frequency, gain, large-scale integration, lifetime, linearity, noise figure, packaging, power handling, power consumption, reliability, ruggedness, size, supply voltage, switching time and weight.
In integrated circuits, optical interconnects refers to any system of transmitting signals from one part of an integrated circuit to another using light. Optical interconnects have been the topic of study due to the high latency and power consumption incurred by conventional metal interconnects in transmitting electrical signals over long distances, such as in interconnects classed as global interconnects. The International Technology Roadmap for Semiconductors (ITRS) has highlighted interconnect scaling as a problem for the semiconductor industry.
In electronic design automation, parasitic extraction is the calculation of the parasitic effects in both the designed devices and the required wiring interconnects of an electronic circuit: parasitic capacitances, parasitic resistances and parasitic inductances, commonly called parasitic devices, parasitic components, or simply parasitics.
In electronics, pass transistor logic (PTL) describes several logic families used in the design of integrated circuits. It reduces the count of transistors used to make different logic gates, by eliminating redundant transistors. Transistors are used as switches to pass logic levels between nodes of a circuit, instead of as switches connected directly to supply voltages. This reduces the number of active devices, but has the disadvantage that the difference of the voltage between high and low logic levels decreases at each stage. Each transistor in series is less saturated at its output than at its input. If several devices are chained in series in a logic path, a conventionally constructed gate may be required to restore the signal voltage to the full value. By contrast, conventional CMOS logic switches transistors so the output connects to one of the power supply rails, so logic voltage levels in a sequential chain do not decrease. Simulation of circuits may be required to ensure adequate performance.
Eby G. Friedman is an electrical engineer, and Distinguished Professor of Electrical and Computer Engineering at the University of Rochester. Friedman is also a visiting professor at the Technion - Israel Institute of Technology. He is a Senior Fulbright Fellow and a Fellow of the IEEE.
In nanotechnology, carbon nanotube interconnects refer to the proposed use of carbon nanotubes in the interconnects between the elements of an integrated circuit. Carbon nanotubes (CNTs) can be thought of as single atomic layer graphite sheets rolled up to form seamless cylinders. Depending on the direction on which they are rolled, CNTs can be semiconducting or metallic. Metallic carbon nanotubes have been identified as a possible interconnect material for the future technology generations and to replace copper interconnects. Electron transport can go over long nanotube lengths, 1 μm, enabling CNTs to carry very high currents (i.e. up to a current density of 109 A∙cm−2) with essentially no heating due to nearly one dimensional electronic structure. Despite the current saturation in CNTs at high fields, the mitigation of such effects is possible due to encapsulated nanowires.
