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Advanced Micro Devices, Inc. (AMD) is an American multinational corporation and semiconductor company based in Santa Clara, California, that develops computer processors and related technologies for business and consumer markets.
Athlon is the brand name applied to a series of x86-compatible microprocessors designed and manufactured by AMD. The original Athlon was the first seventh-generation x86 processor and the first desktop processor to reach speeds of one gigahertz (GHz). It made its debut as AMD's high-end processor brand on June 23, 1999. Over the years AMD has used the Athlon name with the 64-bit Athlon 64 architecture, the Athlon II, and Accelerated Processing Unit (APU) chips targeting the Socket AM1 desktop SoC architecture, and Socket AM4 Zen microarchitecture. The modern Zen-based Athlon with a Radeon Graphics processor was introduced in 2019 as AMD's highest-performance entry-level processor.
Itanium is a discontinued family of 64-bit Intel microprocessors that implement the Intel Itanium architecture. The Itanium architecture originated at Hewlett-Packard (HP), and was later jointly developed by HP and Intel. Launched in June 2001, Intel initially marketed the processors for enterprise servers and high-performance computing systems. In the concept phase, engineers said "we could run circles around PowerPC...we could kill the x86." Early predictions were that IA-64 would expand to the lower-end servers, supplanting Xeon, and eventually penetrate into the personal computers, eventually to supplant reduced instruction set computing (RISC) and complex instruction set computing (CISC) architectures for all general-purpose applications.
x86 is a family of complex instruction set computer (CISC) instruction set architectures initially developed by Intel based on the Intel 8086 microprocessor and its 8088 variant. The 8086 was introduced in 1978 as a fully 16-bit extension of Intel's 8-bit 8080 microprocessor, with memory segmentation as a solution for addressing more memory than can be covered by a plain 16-bit address. The term "x86" came into being because the names of several successors to Intel's 8086 processor end in "86", including the 80186, 80286, 80386 and 80486 processors. Colloquially, their names were "186", "286", "386" and "486".
IA-64 is the instruction set architecture (ISA) of the discontinued Itanium family of 64-bit Intel microprocessors. The basic ISA specification originated at Hewlett-Packard (HP), and was subsequently implemented by Intel in collaboration with HP. The first Itanium processor, codenamed Merced, was released in 2001.
A multi-chip module (MCM) is generically an electronic assembly where multiple integrated circuits, semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach.
The transistor count is the number of transistors in an electronic device. It is the most common measure of integrated circuit complexity. The rate at which MOS transistor counts have increased generally follows Moore's law, which observes that transistor count doubles approximately every two years. However, being directly proportional to the area of a chip, transistor count does not represent how advanced the corresponding manufacturing technology is: a better indication of this is transistor density.
Zen is the codename for a family of computer processor microarchitectures from AMD, first launched in February 2017 with the first generation of its Ryzen CPUs. It is used in Ryzen, Ryzen Threadripper, and Epyc (server).
Zen is the codename for the first iteration in a family of computer processor microarchitectures of the same name from AMD. It was first used with their Ryzen series of CPUs in February 2017. The first Zen-based preview system was demonstrated at E3 2016, and first substantially detailed at an event hosted a block away from the Intel Developer Forum 2016. The first Zen-based CPUs, codenamed "Summit Ridge", reached the market in early March 2017, Zen-derived Epyc server processors launched in June 2017 and Zen-based APUs arrived in November 2017.
Zen 2 is a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nm MOSFET node from TSMC. The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips, Ryzen 4000U/H and Ryzen 5000U for mobile applications, as Threadripper 3000 for high-end desktop systems, and as Ryzen 4000G for accelerated processing units (APUs). The Ryzen 3000 series CPUs were released on 7 July 2019, while the Zen 2-based Epyc server CPUs were released on 7 August 2019. An additional chip, the Ryzen 9 3950X, was released in November 2019.
Ryzen is a brand of multi-core x86-64 microprocessors designed and marketed by Advanced Micro Devices (AMD) for desktop, mobile, server, and embedded platforms based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream, enthusiast, server, and workstation segments and accelerated processing units (APUs) marketed for mainstream and entry-level segments and embedded systems applications.
Epyc is a brand of multi-core x86-64 microprocessors designed and sold by AMD, based on the company's Zen microarchitecture. Introduced in June 2017, they are specifically targeted for the server and embedded system markets.
Intel 5-level paging, referred to simply as 5-level paging in Intel documents, is a processor extension for the x86-64 line of processors. It extends the size of virtual addresses from 48 bits to 57 bits by adding an additional level to x86-64's multilevel page tables, increasing the addressable virtual memory from 256 TB to 128 PB. The extension was first implemented in the Ice Lake processors.
Zen 4 is the codename for a CPU microarchitecture designed by AMD, released on September 27, 2022. It is the successor to Zen 3 and uses TSMC's N6 process for I/O dies, N5 process for CCDs, and N4 process for APUs. Zen 4 powers Ryzen 7000 performance desktop processors, Ryzen 8000G series mainstream desktop APUs, and Ryzen Threadripper 7000 series HEDT and workstation processors. It is also used in extreme mobile processors, thin & light mobile processors, as well as EPYC 8004/9004 server processors.
Zen 3 is the codename for a CPU microarchitecture by AMD, released on November 5, 2020. It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. Zen 3 powers Ryzen 5000 mainstream desktop processors and Epyc server processors. Zen 3 is supported on motherboards with 500 series chipsets; 400 series boards also saw support on select B450 / X470 motherboards with certain BIOSes. Zen 3 is the last microarchitecture before AMD switched to DDR5 memory and new sockets, which are AM5 for the desktop "Ryzen" chips alongside SP5 and SP6 for the EPYC server platform and sTRX8. According to AMD, Zen 3 has a 19% higher instructions per cycle (IPC) on average than Zen 2.
A 2.5D integrated circuit is an advanced packaging technique that combines multiple integrated circuit dies in a single package without stacking them into a three-dimensional integrated circuit (3D-IC) with through-silicon vias (TSVs). The term "2.5D" originated when 3D-ICs with TSVs were quite new and still very difficult. Chip designers realized that many of the advantages of 3D integration could be approximated by placing bare dies side by side on an interposer instead of stacking them vertically. If the pitch is very fine and the interconnect very short, the assembly can be packaged as a single component with better size, weight, and power characteristics than a comparable 2D circuit board assembly. This half-way 3D integration was facetiously named "2.5D" and the name stuck. Since then, 2.5D has proven to be far more than just "half-way to 3D." Some benefits:
RDNA 3 is a GPU microarchitecture designed by AMD, released with the Radeon RX 7000 series on December 13, 2022. Alongside powering the RX 7000 series, RDNA 3 is also featured in the SoCs designed by AMD for the Asus ROG Ally and Lenovo Legion Go consoles.
References
- ↑ "2014 elevated fellow". IEEE Fellows Directory. Archived from the original on December 31, 2014. Retrieved April 12, 2017.
- ↑ "Sam Naffziger". AMD. Retrieved April 3, 2023.
- ↑ "AMD Senior VP and Low-Power Guru, Samuel Naffziger, Addresses the Looming Electronics Power Challenge". All About Circuits. Retrieved April 3, 2023.
- ↑ Kanellos, Michael (January 25, 2002). "Intel's Itanium: Plan B in the works". ZDNet. Retrieved April 3, 2023.
- ↑ Shankland, Stephen (March 29, 2006). "AMD lures high-ranking Itanium designer". ZDNet. Retrieved April 3, 2023.
- ↑ Chuang, Tamara (March 3, 2017). "AMD unveils faster, half-price computer chip". The Denver Post. Retrieved April 3, 2023.
- ↑ Alcorn, Paul; Walton, Jarred (June 23, 2022). "Into the GPU Chiplet Era: An Interview With AMD's Sam Naffziger". Tom's Hardware. Retrieved April 3, 2023.
- ↑ Brosdahl, Peter (November 22, 2022). "AMD Lead Engineer Sam Naffziger Explains Advantages of RDNA3 Chiplet Design". The FPS Review. Retrieved April 3, 2023.
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