An integrated circuit, also known as a microchip, chip or IC, is a small electronic device made up of multiple interconnected electronic components such as transistors, resistors, and capacitors. These components are etched onto a small piece of semiconductor material, usually silicon. Integrated circuits are used in a wide range of electronic devices, including computers, smartphones, and televisions, to perform various functions such as processing and storing information. They have greatly impacted the field of electronics by enabling device miniaturization and enhanced functionality.
Moore's law is the observation that the number of transistors in an integrated circuit (IC) doubles about every two years. Moore's law is an observation and projection of a historical trend. Rather than a law of physics, it is an empirical relationship linked to gains from experience in production.
The Fifth Generation Computer Systems was a 10-year initiative begun in 1982 by Japan's Ministry of International Trade and Industry (MITI) to create computers using massively parallel computing and logic programming. It aimed to create an "epoch-making computer" with supercomputer-like performance and to provide a platform for future developments in artificial intelligence. FGCS was ahead of its time, and its excessive ambitions led to commercial failure. However, on a theoretical level, the project spurred the development of concurrent logic programming.
Fabless manufacturing is the design and sale of hardware devices and semiconductor chips while outsourcing their fabrication to a specialized manufacturer called a semiconductor foundry. These foundries are typically, but not exclusively, located in the United States, China, and Taiwan. Fabless companies can benefit from lower capital costs while concentrating their research and development resources on the end market. Some fabless companies and pure play foundries may offer integrated-circuit design services to third parties.
VLSI Technology, Inc., was an American company that designed and manufactured custom and semi-custom integrated circuits (ICs). The company was based in Silicon Valley, with headquarters at 1109 McKay Drive in San Jose. Along with LSI Logic, VLSI Technology defined the leading edge of the application-specific integrated circuit (ASIC) business, which accelerated the push of powerful embedded systems into affordable products.
Microelectronics and Computer Technology Corporation, originally the Microelectronics and Computer Consortium and widely seen by the acronym MCC, was the first, and at one time one of the largest, computer industry research and development consortia in the United States. MCC ceased operations in 2000 and was formally dissolved in 2004.
The VLSI Project was a DARPA-program initiated by Robert Kahn in 1978 that provided research funding to a wide variety of university-based teams in an effort to improve the state of the art in microprocessor design, then known as Very Large Scale Integration (VLSI).
The transistor count is the number of transistors in an electronic device. It is the most common measure of integrated circuit complexity. The rate at which MOS transistor counts have increased generally follows Moore's law, which observes that transistor count doubles approximately every two years. However, being directly proportional to the area of a chip, transistor count does not represent how advanced the corresponding manufacturing technology is: a better indication of this is transistor density.
Multi-project chip (MPC), and multi-project wafer (MPW) semiconductor manufacturing arrangements allow customers to share tooling and microelectronics wafer fabrication cost between several designs or projects.
The Semiconductor Industry Association (SIA) is a trade association and lobbying group founded in 1977 that represents the United States semiconductor industry. It is located in Washington, D.C.
A three-dimensional integrated circuit is a MOS integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
The IEEE Robert N. Noyce Medal is a science award presented by the IEEE for outstanding contributions to the microelectronics industry. It is given to individuals who have demonstrated contributions in multiple areas including technology development, business development, industry leadership, development of technology policy, and standards development. The medal is named in honour of Robert N. Noyce, the co-founder of Intel Corporation. He was also renowned for his 1959 invention of the integrated circuit. The medal is funded by Intel Corporation and was first awarded in 2000.
The United States government's Strategic Computing Initiative funded research into advanced computer hardware and artificial intelligence from 1983 to 1993. The initiative was designed to support various projects that were required to develop machine intelligence in a prescribed ten-year time frame, from chip design and manufacture, computer architecture to artificial intelligence software. The Department of Defense spent a total of $1 billion on the project.
SyNAPSE is a DARPA program that aims to develop electronic neuromorphic machine technology, an attempt to build a new kind of cognitive computer with form, function, and architecture similar to the mammalian brain. Such artificial brains would be used in robots whose intelligence would scale with the size of the neural system in terms of the total number of neurons and synapses and their connectivity.
The following outline is provided as an overview of and topical guide to electronics:
The IEEE International Electron Devices Meeting (IEDM) is an annual micro- and nanoelectronics conference held each December that serves as a forum for reporting technological breakthroughs in the areas of semiconductor and related device technologies, design, manufacturing, physics, modeling and circuit-device interaction.
Walden C. "Wally" Rhines is an American engineer and businessman. Rhines is President and CEO of Cornami, Inc., a fabless semiconductor company focused on fully homomorphic encryption. Previously, he was President and CEO of Mentor Graphics, a Siemens Business for 23 years and Executive VP of the Semiconductor Group of Texas Instruments for 21 years. Rhines was named overall CEO of the Year by Portland Business Journal in 2012 and Oregon Technology Executive of the Year by the Technology Association of Oregon in 2003. He was named an IEEE Fellow in 2017.
Dr. Gary Patton is an American technologist and business executive. He is currently the Corporate Vice President and General Manager of Design Enablement and Components Research in the Technology Development Group at Intel. He has spent most of his career in IBM, starting in IBM's Research Division and holding management and executive positions in IBM's Microelectronics Division in Technology Development, Design Enablement, Manufacturing, and Business Line Management.
The Chinese semiconductor industry, including integrated circuit design and manufacturing, forms a major part of mainland China's information technology industry.
