The Defense Advanced Research Projects Agency (DARPA) is a research and development agency of the United States Department of Defense responsible for the development of emerging technologies for use by the military. Originally known as the Advanced Research Projects Agency (ARPA), the agency was created on February 7, 1958, by President Dwight D. Eisenhower in response to the Soviet launching of Sputnik 1 in 1957. By collaborating with academia, industry, and government partners, DARPA formulates and executes research and development projects to expand the frontiers of technology and science, often beyond immediate U.S. military requirements. The name of the organization first changed from its founding name, ARPA, to DARPA, in March 1972, changing back to ARPA in February 1993, then reverted to DARPA in March 1996.
An integrated circuit (IC), also known as a microchip or simply chip, is a small electronic device made up of multiple interconnected electronic components such as transistors, resistors, and capacitors. These components are etched onto a small piece of semiconductor material, usually silicon. Integrated circuits are used in a wide range of electronic devices, including computers, smartphones, and televisions, to perform various functions such as processing and storing information. They have greatly impacted the field of electronics by enabling device miniaturization and enhanced functionality.
Xidian University is a public university in Xi'an, Shaanxi, China. It is affiliated with the Ministry of Education, and co-funded by the Ministry of Education, the Ministry of Industry and Information Technology, SASTIND, and China Electronics Technology Group Corporation. The university is part of the Double First-Class Construction and Project 211.
The Centro Nacional de Tecnologia Electrônica Avançada S.A is a Brazilian technology center specialized in project development and fabrication in microelectronics, i.e. integrated circuits, or "chips". This center is one of the agents for the Brazilian Microelectronics Program.
SEMATECH was a not-for-profit consortium that performed research and development to advance chip manufacturing. SEMATECH involved collaboration between various sectors of the R&D community, including chipmakers, equipment and material suppliers, universities, research institutes, and government partners. SEMATECH's mission was to rejuvenate the U.S. semiconductor industry through collective R&D efforts, focused on improving manufacturing processes and introducing cutting-edge technologies.
Microelectronics and Computer Technology Corporation, originally the Microelectronics and Computer Consortium and widely seen by the acronym MCC, was the first, and at one time one of the largest, computer industry research and development consortia in the United States. MCC ceased operations in 2000 and was formally dissolved in 2004.
The International Technology Roadmap for Semiconductors (ITRS) is a set of documents that was coordinated and organized by Semiconductor Research Corporation and produced by a group of experts in the semiconductor industry. These experts were representative of the sponsoring organisations, including the Semiconductor Industry Associations of Taiwan, South Korea, the United States, Europe, Japan, and China.
Multi-project chip (MPC), and multi-project wafer (MPW) semiconductor manufacturing arrangements allow customers to share tooling and microelectronics wafer fabrication cost between several designs or projects.
The Semiconductor Industry Association (SIA) is a trade association and lobbying group founded in 1977 that represents the United States semiconductor industry. It is located in Washington, D.C.
A three-dimensional integrated circuit is a MOS integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
The IEEE Robert N. Noyce Medal is a science award presented by the IEEE for outstanding contributions to the microelectronics industry. It is given to individuals who have demonstrated contributions in multiple areas including technology development, business development, industry leadership, development of technology policy, and standards development. The medal is named in honour of Robert N. Noyce, the co-founder of Intel Corporation. He was also renowned for his 1959 invention of the integrated circuit. The medal is funded by Intel Corporation and was first awarded in 2000.
The Western Institute of Nanoelectronics (WIN) is a research institute founded in 2006 and headquartered at the UCLA Henry Samueli School of Engineering and Applied Science in Los Angeles, California, US. The WIN Center networks multiple universities with the Industry and government based sponsors (members of the Semiconductor Industry Association consortium NRI) and the National Institute of Standards and Technology (NIST) in pursuit of replacing Complementary Metal-Oxide Semiconductor Field-Effect Transistors (CMOS FET). WIN's research is focused on spintronics extending from materials, devices, and device interactions, metrology and circuits/architectures. Sponsors include:
ARPA-E, or Advanced Research Projects Agency–Energy is a United States government agency tasked with promoting and funding research and development of advanced energy technologies. It is modeled after the Defense Advanced Research Projects Agency (DARPA).
Arati Prabhakar is an American engineer and public official. Since October 3, 2022, she has served as the 12th director of the White House Office of Science and Technology Policy and the Science Advisor to the President.
Made in China 2025 is a national strategic plan and industrial policy of the Chinese Communist Party (CCP) to further develop the manufacturing sector of China, issued by CCP general secretary Xi Jinping and Chinese Premier Li Keqiang's cabinet in May 2015. As part of the thirteenth and fourteenth five-year plans, China aims to move away from being the "world's factory"—a producer of cheap low-tech goods facilitated by lower labour costs and supply chain advantages. The industrial policy aims to upgrade the manufacturing capabilities of Chinese industries, growing from labor-intensive workshops into a more technology-intensive powerhouse with more value added.
Dr. Gary Patton is an American technologist and business executive. He is currently the Corporate Vice President and General Manager of the Design Technology Platform organization in the Technology Development Group at Intel. He has spent most of his career in IBM, starting in IBM's Research Division and holding management and executive positions in IBM's Microelectronics Division in Technology Development, Design Enablement, Manufacturing, and Business Line Management.
In semiconductor manufacturing, the 2 nm process is the next MOSFET die shrink after the 3 nm process node.
The Electronics Technology and Devices Laboratory (ETDL) was a research facility under the U.S. Army Materiel Command that specialized in developing and integrating critical electronic technologies, from high frequency devices to tactical power sources, into Army systems. Located at Fort Monmouth, New Jersey, ETDL served as the U.S. Army’s central laboratory for electronics research from 1971 to 1992. In 1992, ETDL was disestablished, and the majority of its operations and personnel were incorporated into the newly created U.S. Army Research Laboratory (ARL).
The Chinese semiconductor industry, including integrated circuit design and manufacturing, forms a major part of mainland China's information technology industry.
The CHIPS and Science Act is a U.S. federal statute enacted by the 117th United States Congress and signed into law by President Joe Biden on August 9, 2022. The act authorizes roughly $280 billion in new funding to boost domestic research and manufacturing of semiconductors in the United States, for which it appropriates $52.7 billion. The act includes $39 billion in subsidies for chip manufacturing on U.S. soil along with 25% investment tax credits for costs of manufacturing equipment, and $13 billion for semiconductor research and workforce training, with the dual aim of strengthening American supply chain resilience and countering China. It also invests $174 billion in the overall ecosystem of public sector research in science and technology, advancing human spaceflight, quantum computing, materials science, biotechnology, experimental physics, research security, social and ethical considerations, workforce development and diversity, equity, and inclusion efforts at NASA, NSF, DOE, EDA, and NIST.
