Tin pest is an autocatalytic, allotropic transformation of the element tin, which causes deterioration of tin objects at low temperatures. Tin pest has also been called tin disease, [1] tin blight, tin plague, [2] or tin leprosy. [3] It is an autocatalytic process, accelerating once it begins. It was first documented in the scientific literature in 1851, having been observed in the pipes of pipe organs in medieval churches that had experienced cool climates. [4]
With the adoption of the Restriction of Hazardous Substances Directive (RoHS) regulations in Europe, and similar regulations elsewhere, traditional lead/tin solder alloys in electronic devices have been replaced by nearly pure tin, introducing tin pest and related problems such as tin whiskers. [5] [6]
At 13.2 °C (55.8 °F) and below, pure tin transforms from the silvery, ductile metallic allotrope of β-form white tin to the brittle, nonmetallic, α-form grey tin with a diamond cubic structure. The transformation is slow to initiate due to a high activation energy but the presence of germanium (or crystal structures of similar form and size) or very low temperatures of roughly −30 °C aids the initiation. There is also a large volume increase of about 27% associated with the phase change to the nonmetallic low temperature allotrope. This frequently makes tin objects (like buttons) decompose into powder during the transformation, hence the name tin pest. [7] The decomposition will catalyze itself, which is why the reaction accelerates once it starts. The mere presence of tin pest leads to more tin pest. Tin objects at low temperatures will simply disintegrate.
In 1910 British polar explorer Robert Scott hoped to be the first to reach the South Pole, but was beaten by Norwegian explorer Roald Amundsen. On foot, the expedition trudged through the frozen deserts of the Antarctic, marching for caches of food and kerosene deposited on the way. In early 1912, at the first cache, there was no kerosene; the cans – soldered with tin – were empty. The cause of the empty tins could have been related to tin pest. [8] The tin cans were recovered and no tin pest was found when analyzed by the Tin Research Institute. [9] [10] Some observers blame poor quality soldering, as tin cans over 80 years old have been discovered in Antarctic buildings with the soldering in good condition.[ citation needed ]
The story is often told of Napoleon's men freezing in the bitter Russian Winter, their clothes falling apart as tin pest ate the buttons. This appears to be an urban legend, as there is no evidence of any failing buttons, and thus they cannot have been a contributing factor in the failure of the invasion. [11] Uniform buttons of that era were generally bone for enlisted, and brass for officers. [12] Critics of the theory point out that any tin that might have been used would have been quite impure, and thus more tolerant of low temperatures. Laboratory tests of the time required for unalloyed tin to develop significant tin pest damage at lowered temperatures is about 18 months, which is more than twice the length of the invasion. [8] Nevertheless, some of the regiments in the campaign did have tin buttons and the temperature reached sufficiently low values (below −40 °C or °F). [11] In the event, none of the many survivors' tales mention problems with buttons and it has been suggested that the legend is an amalgamation of reports of blocks of Banca tin completely disintegrated in a customs warehouse in St. Petersburg in 1868, and earlier Russian reports that cast-in buttons for military uniforms also disintegrated, [13] [10] and the desperate state of Napoleon's army, having turned soldiers into ragged beggars. [11] [14]
With the 2006 adoption of the Restriction of Hazardous Substances Directive (RoHS) regulations in the European Union, California banning most uses of lead, and similar regulations elsewhere, the problem of tin pest has returned, [15] since some manufacturers which previously used tin/lead alloys now use predominantly tin-based alloys. For example, the leads of some electrical and electronic components are plated with pure tin. In cold environments, this can change to α-modification grey tin, which is not electrically conductive, and falls off the leads. After reheating, it changes back to β-modification white tin, which is electrically conductive. This cycle can cause electrical short circuits and failure of equipment. Such problems can be intermittent as the powdered particles of tin move around. Tin pest can be avoided by alloying with small amounts of electropositive metals or semimetals soluble in tin's solid phase, e.g. antimony or bismuth, which prevent the phase change.
A metal is a material that, when polished or fractured, shows a lustrous appearance, and conducts electricity and heat relatively well. These properties are all associated with having electrons available at the Fermi level, as against nonmetallic materials which do not. Metals are typically ductile and malleable.
Solder is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.
Tin is a chemical element; it has symbol Sn and atomic number 50. A silvery-colored metal, tin is soft enough to be cut with little force, and a bar of tin can be bent by hand with little effort. When bent, the so-called "tin cry" can be heard as a result of twinning in tin crystals.
The carbon group is a periodic table group consisting of carbon (C), silicon (Si), germanium (Ge), tin (Sn), lead (Pb), and flerovium (Fl). It lies within the p-block.
Brazing is a metal-joining process in which two or more metal items are joined by melting and flowing a filler metal into the joint, with the filler metal having a lower melting point than the adjoining metal.
In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time. They are used in both extractive metallurgy and metal joining.
The Restriction of Hazardous Substances Directive 2002/95/EC, short for Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment, was adopted in February 2003 by the European Union.
Wave soldering is a bulk soldering process used for the manufacturing of printed circuit boards. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit board makes contact with this wave, the components become soldered to the board. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount. In the latter case, the components are glued onto the surface of a printed circuit board (PCB) by placement equipment, before being run through the molten solder wave. Wave soldering is mainly used in soldering of through hole components.
Plating is a finishing process in which a metal is deposited on a surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for radiation shielding, and for other purposes. Jewelry typically uses plating to give a silver or gold finish.
Metal whiskering is a phenomenon that occurs in electrical devices when metals form long whisker-like projections over time. Tin whiskers were noticed and documented in the vacuum tube era of electronics early in the 20th century in equipment that used pure, or almost pure, tin solder in their production. It was noticed that small metal hairs or tendrils grew between metal solder pads, causing short circuits. Metal whiskers form in the presence of compressive stress. Germanium, zinc, cadmium, and even lead whiskers have been documented. Many techniques are used to mitigate the problem, including changes to the annealing process, the addition of elements like copper and nickel, and the inclusion of conformal coatings. Traditionally, lead has been added to slow down whisker growth in tin-based solders.
Gold plating is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver, by chemical or electrochemical plating. Plating refers to modern coating methods, such as the ones used in the electronics industry, whereas gilding is the decorative covering of an object with gold, which typically involve more traditional methods and much larger objects.
The solderability of a substrate is a measure of the ease with which a soldered joint can be made to that material. Good solderability requires wetting of the substrate by the solder.
A fusible plug is a threaded cylinder of metal, usually bronze, brass or gunmetal, with a tapered hole drilled completely through its length. This hole is sealed with a metal of low melting point that flows away if a predetermined high temperature is reached. The initial use of the fusible plug was as a safety precaution against low water levels in steam engine boilers, but later applications extended its use to other closed vessels, such as air conditioning systems and tanks for transporting corrosive or liquefied petroleum gases.
Zinc pest, also known as zinc rot, mazak rot and zamak rot, is a destructive, intercrystalline corrosion process of zinc alloys containing lead impurities. While impurities of the alloy are the primary cause of the problem, environmental conditions such as high humidity may accelerate the process.
Dip soldering is a small-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The solder wets to the exposed metallic areas of the board, creating a reliable mechanical and electrical connection.
Soldering is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint.
Tin-silver-copper, is a lead-free (Pb-free) alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. Lead-free solder is gaining much attention as the environmental effects of lead in industrial products is recognized, and as a result of Europe's RoHS legislation to remove lead and other hazardous materials from electronics. Japanese electronics companies have also looked at Pb-free solder for its industrial advantages.
Materials for use in vacuum are materials that show very low rates of outgassing in vacuum and, where applicable, are tolerant to bake-out temperatures. The requirements grow increasingly stringent with the desired degree of vacuum to be achieved in the vacuum chamber. The materials can produce gas by several mechanisms. Molecules of gases and water can be adsorbed on the material surface. Materials may sublimate in vacuum. Or the gases can be released from porous materials or from cracks and crevices. Traces of lubricants, residues from machining, can be present on the surfaces. A specific risk is outgassing of solvents absorbed in plastics after cleaning.
Copper has been used in electrical wiring since the invention of the electromagnet and the telegraph in the 1820s. The invention of the telephone in 1876 created further demand for copper wire as an electrical conductor.
Solder fatigue is the mechanical degradation of solder due to deformation under cyclic loading. This can often occur at stress levels below the yield stress of solder as a result of repeated temperature fluctuations, mechanical vibrations, or mechanical loads. Techniques to evaluate solder fatigue behavior include finite element analysis and semi-analytical closed-form equations.
Only officers had metal buttons, and those were made of brass.
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tin pest, transformation of beta tin into alpha modification (grey tin) on YouTube Time lapse video of tin pest on an ingot |