BTX (for Balanced Technology eXtended) is a form factor for motherboards, originally intended to be the replacement for the aging ATX motherboard form factor.
It was designed in late 2004 and early 2005 to alleviate issues that arose from using the newer technologies of the time (which demanded more power and created more heat) on motherboards compliant with the ATX specification that dated from 1995. The ATX and BTX standards were both proposed by Intel. However, future development of BTX retail products by Intel was canceled in September 2006 following Intel's decision to refocus on low-power CPUs after suffering scaling and thermal issues with the Pentium 4.
The first company to implement BTX was Gateway Inc, followed by Dell and MPC. The first generation of Apple's Mac Pro used some elements of the BTX design system as well, but was not BTX-compliant, instead using a proprietary form factor.
Pico BTX is a motherboard form factor that is meant to miniaturize the 12.8 × 10.5 in (325 × 267 mm) BTX standard. Pico BTX motherboards measure 8 × 10.5 in (203 × 267 mm). This is smaller than many current "micro"-sized motherboards, hence the name "pico". These motherboards share a common top half with the other sizes in the BTX line, but support only one or two expansion slots, [1] designed for half-height or riser card applications.[ citation needed ]
Other smaller BTX sizes include: microBTX at 10.4 × 10.5 in (264 × 267 mm) and nano BTX at 8.8 × 10.5 in (224 × 267 mm).
Specification | Year | Dimensions of motherboard | Expansion slots |
---|---|---|---|
BTX | 2004 | 10.5 × 12.8 in (266.70 × 325.12 mm) | 7 |
microBTX | 10.5 × 10.4 in (266.70 × 264.16 mm) | 4 | |
nanoBTX | 10.5 × 8.8 in (266.70 × 223.52 mm) | 2 | |
picoBTX | 10.5 × 8.0 in (266.70 × 203.20 mm) | 1 |
The heat sink to be attached to the CPU, called "Thermal Module" throughout the official specification, is no longer attached solely to the motherboard, but to the casing itself, so that the inertial load of its mass during a mechanical shock event can no longer damage the motherboard.
The structural interface between the heat sink and the chassis, is defined as 4 mounting holes with the distances of 4.4 × 2.275 in (55.79 × 111.76 mm) between one another. And since this attachment means is also required to have a certain stiffness, it is called "Support and Retention Module (SRM)" in the specification.
The BTX form factor has not been widely adopted despite its improvements over ATX and related standards. As a result, the availability and variety of BTX-compatible components is limited.
One reason for the failure of BTX to gain traction in key markets was the rise of energy-efficient components (CPUs, chipsets and GPUs) which require less power and produce less waste heat, eliminating two of the primary intended benefits of BTX. Another reason was the lack of OEM adopters. [2]
Initially, only Gateway and Dell offered computers with the new format, later HP and Fujitsu-Siemens (now Fujitsu) also offered some BTX-based computers. Most other manufacturers stayed with the ATX standard, and even the handful of manufacturers who did adopt BTX for some products continued to produce the bulk of their machines with the ATX form factor.