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An integrated circuit (IC), also known as a microchip, computer chip, or simply chip, is a small electronic device made up of multiple interconnected electronic components such as transistors, resistors, and capacitors. These components are etched onto a small piece of semiconductor material, usually silicon. Integrated circuits are used in a wide range of electronic devices, including computers, smartphones, and televisions, to perform various functions such as processing and storing information. They have greatly impacted the field of electronics by enabling device miniaturization and enhanced functionality.
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips. It is a multiple-step photolithographic and physico-chemical process during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
The transistor count is the number of transistors in an electronic device. It is the most common measure of integrated circuit complexity. The rate at which MOS transistor counts have increased generally follows Moore's law, which observes that transistor count doubles approximately every two years. However, being directly proportional to the area of a die, transistor count does not represent how advanced the corresponding manufacturing technology is. A better indication of this is transistor density which is the ratio of a semiconductor's transistor count to its die area.
David J. Kuck, a graduate of the University of Michigan, was a professor in the Computer Science Department the University of Illinois at Urbana-Champaign from 1965 to 1993. He is the father of Olympic silver medalist Jonathan Kuck. While at the University of Illinois at Urbana-Champaign he developed the Parafrase compiler system (1977), which was the first testbed for the development of automatic vectorization and related program transformations. In his role as Director (1986–93) of the Center for Supercomputing Research and Development (CSRD-UIUC), Kuck led the construction of the CEDAR project, a hierarchical shared-memory 32-processor SMP supercomputer completed in 1988 at the University of Illinois.
Thomas Martin Conte is the Associate Dean for Research and Professor of Computer Science at Georgia Institute of Technology College of Computing; and, since 2011, also Professor of Electrical and Computer Engineering at Georgia Institute of Technology College of Engineering. He is a fellow of Institute of Electrical and Electronics Engineers (IEEE). He served as the president of the IEEE Computer Society in 2015.
A three-dimensional integrated circuit is a MOS integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
The IEEE Robert N. Noyce Medal is a science award presented by the IEEE for outstanding contributions to the microelectronics industry. It is given to individuals who have demonstrated contributions in multiple areas including technology development, business development, industry leadership, development of technology policy, and standards development. The medal is named in honour of Robert N. Noyce, the co-founder of Intel Corporation. He was also renowned for his 1959 invention of the integrated circuit. The medal is funded by Intel Corporation and was first awarded in 2000.
Tatsuo Itoh was an electrical engineer who was professor and holder of the Northrop Grumman Chair in Microwave and Millimeter Wave Electronics in the Electrical Engineering Department at the University of California, Los Angeles (UCLA), where he taught and conducted research on microwave and millimeter wave electronics, guided wave structures, low power wireless electronics, and integrated passive components and antennas.
Behzad Razavi is an Iranian-American professor and researcher of electrical and electronic engineering. Noted for his research in communications circuitry, Razavi is the director of the Communication Circuits Laboratory at the University of California Los Angeles. He is a Fellow and a distinguished lecturer for the Institute of Electrical and Electronics Engineers. Among his awards, Razavi is a two-time recipient of the Beatrice Winner Award for Editorial Excellence at the 1994 and 2001 International Solid-State Circuits Conferences. In 2017, he was elected as a member into the National Academy of Engineering for contributions to low-power broadband communication circuits.
Sung-Mo "Steve" Kang is an American electrical engineering scientist, professor, writer, inventor, entrepreneur and 15th president of KAIST. Kang was appointed as the second chancellor of the University of California, Merced in 2007. He was the first department head of foreign origin at the electrical and computer engineering department at the University of Illinois at Urbana-Champaign and Dean of the Baskin School of Engineering at UC Santa Cruz. Kang teaches and has written extensively in the field of computer-aided design for electronic circuits and systems; he is recognized and respected worldwide for his outstanding research contributions. Kang has led the development of the world’s first 32-bit microprocessor chips as a technical supervisor at AT&T Bell Laboratories and designed satellite-based private communication networks as a member of technical staff. Kang holds 15 U.S. patents and has won numerous awards for his ground breaking achievements in the field of electrical engineering.
Nikil Dutt is a Distinguished Professor of Computer Science at University of California, Irvine, United States. Professor Dutt's research interests are in embedded systems, electronic design automation, computer architecture, optimizing compilers, system specification techniques, distributed systems, and formal methods.
Ilesanmi Adesida is a Nigerian American physicist of Yoruba descent. He has been the provost at Nazarbayev University in Astana, Kazakhstan, from September 2016.
M. George Craford is an American electrical engineer known for his work in Light Emitting Diodes (LEDs).
Microelectromechanical system oscillators are devices that generate highly stable reference frequencies used to sequence electronic systems, manage data transfer, define radio frequencies, and measure elapsed time. The core technologies used in MEMS oscillators have been in development since the mid-1960s, but have only been sufficiently advanced for commercial applications since 2006. MEMS oscillators incorporate MEMS resonators, which are microelectromechanical structures that define stable frequencies. MEMS clock generators are MEMS timing devices with multiple outputs for systems that need more than a single reference frequency. MEMS oscillators are a valid alternative to older, more established quartz crystal oscillators, offering better resilience against vibration and mechanical shock, and reliability with respect to temperature variation.
Levent Gürel is a Turkish scientist and electrical engineer. He was the director of Computational Electromagnetics Research Center (BiLCEM) and a professor in the Department of Electrical and Electronics Engineering at the Bilkent University, Turkey until November 2014. Currently, he is serving as an adjunct professor at the University of Illinois Urbana-Champaign, Department of Electrical and Computer Engineering. He is also serving as the founder and CEO of ABAKUS Computing Technologies.
Nancy Marie Amato is an American computer scientist noted for her research on the algorithmic foundations of motion planning, computational biology, computational geometry and parallel computing. Amato is the Abel Bliss Professor of Engineering and Head of the Department of Computer Science at the University of Illinois at Urbana-Champaign. Amato is noted for her leadership in broadening participation in computing, and is currently a member of the steering committee of CRA-WP, of which she has been a member of the board since 2000.
Shun Lien Chuang was a Taiwanese-American electrical engineer, optical engineer, and physicist. He was a Fellow of the IEEE, OSA, APS and JSPS, and professor at the University of Illinois at Urbana-Champaign.
Francesca Iacopi is an engineer, researcher and an academic. She specializes in materials and nanoelectronics engineering and is a professor at the University of Technology Sydney. She is a chief investigator of the ARC Centre of Excellence in Transformative Meta-Optical Systems, a Fellow of the Institution of Engineers Australia, and a senior member of Institute of Electrical and Electronics Engineers.
Conilee Gay Kirkpatrick is an American electronics engineer.
References
- 1 2 3 Guy, Sandra (Spring 2023), "Lateral Career Moves Bring Unexpected Opportunities", SWE, vol. 69, no. 3, Society of Women Engineers, retrieved 2023-05-13
- 1 2 "How I became a techie: Beth Keser", OnQ Blog, Qualcomm, 30 May 2016, retrieved 2023-05-13
- 1 2 3 4 Karlin, Susan (August 2016), "Profile: Beth Keser - This engineer is MacGyvering a jump to Hollywood", Resources – Careers, IEEE Spectrum, 53 (8): 21, doi:10.1109/mspec.2016.7524163
- 1 2 "Beth Keser", Women in Engineering, University of Illinois Urbana–Champaign Grainger College of Engineering, retrieved 2023-05-14
- ↑ Executive Council 2022-2023, International Microelectronics and Packaging Society, retrieved 2023-05-13
- ↑ "Distinguished Lecturer Program", Electronics Packaging Society, IEEE, retrieved 2023-05-13
- ↑ 2020 Newly Elevated Fellows (PDF), IEEE, archived from the original (PDF) on 2019-12-04, retrieved 2023-05-13
- ↑ "EPS Exceptional Technical Achievement Award: Past Recipients" (PDF), Electronics Packaging Society, IEEE, retrieved 2023-05-13