A printed circuit board is a medium used to connect electronic components to one another in a controlled manner. It takes the form of a laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds vias: plated-through holes that allow interconnections between layers.
Epoxy is the family of basic components or cured end products of epoxy resins. Epoxy resins, also known as polyepoxides, are a class of reactive prepolymers and polymers which contain epoxide groups. The epoxide functional group is also collectively called epoxy. The IUPAC name for an epoxide group is an oxirane.
In materials science, a thermosetting polymer, often called a thermoset, is a polymer that is obtained by irreversibly hardening ("curing") a soft solid or viscous liquid prepolymer (resin). Curing is induced by heat or suitable radiation and may be promoted by high pressure, or mixing with a catalyst. Heat is not necessarily applied externally, but is often generated by the reaction of the resin with a curing agent. Curing results in chemical reactions that create extensive cross-linking between polymer chains to produce an infusible and insoluble polymer network.
A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.
In materials science, a refractory is a material that is resistant to decomposition by heat, pressure, or chemical attack, and retains strength and form at high temperatures. Refractories are polycrystalline, polyphase, inorganic, non-metallic, porous, and heterogeneous. They are typically composed of oxides or carbides, nitrides etc. of the following elements: silicon, aluminium, magnesium, calcium, boron, chromium and zirconium.
A hermetic seal is any type of sealing that makes a given object airtight. The term originally applied to airtight glass containers, but as technology advanced it applied to a larger category of materials, including rubber and plastics. Hermetic seals are essential to the correct and safe functionality of many electronic and healthcare products. Used technically, it is stated in conjunction with a specific test method and conditions of use.
FR-2 is a NEMA designation for synthetic resin bonded paper, a composite material made of paper impregnated with a plasticized phenol formaldehyde resin, used in the manufacture of printed circuit boards. Its main properties are similar to NEMA grade XXXP (MIL-P-3115) material, and can be substituted for the latter in many applications.
A via is an electrical connection between two or more metal layers, and are commonly used in printed circuit boards. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal that forms an electrical connection through the insulating layers.
Micarta is a brand name for composites of linen, canvas, paper, fiberglass, carbon fiber, or other fabric in a thermosetting plastic. It was originally used in electrical and decorative applications. Micarta was developed by George Westinghouse at least as early as 1910 using phenolic resins invented by Leo Baekeland. These resins were used to impregnate paper and cotton fabric which were cured under pressure and high temperature to produce laminates. In later years this manufacturing method included the use of fiberglass fabric, and other resin types were also used. Today Micarta high-pressure industrial laminates are produced with a wide variety of resins and fibers. The term has been used generically for most resin impregnated fiber compounds. Common uses of modern high-pressure laminates include electrical insulators, printed circuit board substrates, and knife handles.
Oxygen-free copper (OFC) or oxygen-free high thermal conductivity (OFHC) copper is a group of wrought high-conductivity copper alloys that have been electrolytically refined to reduce the level of oxygen to 0.001% or below. Oxygen-free copper is a premium grade of copper that has a high level of conductivity and is virtually free from oxygen content. The oxygen content of copper affects its electrical properties and can reduce conductivity.
The role of the substrate in power electronics is to provide the interconnections to form an electric circuit, and to cool the components. Compared to materials and techniques used in lower power microelectronics, these substrates must carry higher currents and provide a higher voltage isolation. They also must operate over a wide temperature range.
Perfboard is a material for prototyping electronic circuits. It is a thin, rigid sheet with holes pre-drilled at standard intervals across a grid, usually a square grid of 0.1 inches (2.54 mm) spacing. These holes are ringed by round or square copper pads, though bare boards are also available. Inexpensive perfboard may have pads on only one side of the board, while better quality perfboard can have pads on both sides. Since each pad is electrically isolated, the builder makes all connections with either wire wrap or miniature point to point wiring techniques. Discrete components are soldered to the prototype board such as resistors, capacitors, and integrated circuits. The substrate is typically made of paper laminated with phenolic resin or a fiberglass-reinforced epoxy laminate (FR-4).
Building insulation materials are the building materials that form the thermal envelope of a building or otherwise reduce heat transfer.
Composite epoxy materials (CEM) are a group of composite materials typically made from woven glass fabric surfaces and non-woven glass core combined with epoxy synthetic resin. They are typically used in printed circuit boards.
A thermoset polymer matrix is a synthetic polymer reinforcement where polymers act as binder or matrix to secure in place incorporated particulates, fibres or other reinforcements. They were first developed for structural applications, such as glass-reinforced plastic radar domes on aircraft and graphite-epoxy payload bay doors on the Space Shuttle.
A stamped circuit board (SCB) is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or traces etched from copper sheets laminated onto a non-conductive substrate. This technology is used for small circuits, for instance in the production of LEDs.
Materials for use in vacuum are materials that show very low rates of outgassing in vacuum and, where applicable, are tolerant to bake-out temperatures. The requirements grow increasingly stringent with the desired degree of vacuum to be achieved in the vacuum chamber. The materials can produce gas by several mechanisms. Molecules of gases and water can be adsorbed on the material surface. Materials may sublimate in vacuum. Or the gases can be released from porous materials or from cracks and crevices. Traces of lubricants, residues from machining, can be present on the surfaces. A specific risk is outgassing of solvents absorbed in plastics after cleaning.
Copper has been used in electrical wiring since the invention of the electromagnet and the telegraph in the 1820s. The invention of the telephone in 1876 created further demand for copper wire as an electrical conductor.
G-10 or garolite is a high-pressure fiberglass laminate, a type of composite material. It is created by stacking multiple layers of glass cloth, soaked in epoxy resin, then compressing the resulting material under heat until the epoxy cures. It is manufactured in flat sheets, most often a few millimeters thick.
Conductive anodic filament, also called CAF, is a metallic filament that forms from an electrochemical migration process and is known to cause printed circuit board (PCB) failures.
