Field effect (semiconductor)

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Field effect: Top panels: An applied voltage bends bands, depleting holes from surface (band diagram, left). The charge inducing the bending is balanced by a layer of negative acceptor-ion charge (right). Bottom panel: A larger applied voltage further depletes holes but conduction band lowers enough in energy to populate an inversion layer. Semiconductor band-bending-en.svg
Field effect: Top panels: An applied voltage bends bands, depleting holes from surface (band diagram, left). The charge inducing the bending is balanced by a layer of negative acceptor-ion charge (right). Bottom panel: A larger applied voltage further depletes holes but conduction band lowers enough in energy to populate an inversion layer.

In physics, the field effect refers to the modulation of the electrical conductivity of a material by the application of an external electric field.

Contents

In a metal, the electron density that responds to applied fields is so large that an external electric field can penetrate only a very short distance into the material. However, in a semiconductor the lower density of electrons (and possibly holes) that can respond to an applied field is sufficiently small that the field can penetrate quite far into the material. This field penetration alters the conductivity of the semiconductor near its surface, and is called the field effect. The field effect underlies the operation of the Schottky diode and of field-effect transistors, notably the MOSFET, the JFET and the MESFET. [1]

Surface conductance and band bending

The change in surface conductance occurs because the applied field alters the energy levels available to electrons to considerable depths from the surface, and that in turn changes the occupancy of the energy levels in the surface region. A typical treatment of such effects is based upon a band-bending diagram showing the positions in energy of the band edges as a function of depth into the material.

An example band-bending diagram is shown in the figure. For convenience, energy is expressed in eV and voltage is expressed in volts, avoiding the need for a factor q for the elementary charge. In the figure, a two-layer structure is shown, consisting of an insulator as left-hand layer and a semiconductor as right-hand layer. An example of such a structure is the MOS capacitor , a two-terminal structure made up of a metal gate contact, a semiconductor body (such as silicon) with a body contact, and an intervening insulating layer (such as silicon dioxide, hence the designation O). The left panels show the lowest energy level of the conduction band and the highest energy level of the valence band. These levels are "bent" by the application of a positive voltage V. By convention, the energy of electrons is shown, so a positive voltage penetrating the surface lowers the conduction edge. A dashed line depicts the occupancy situation: below this Fermi level the states are more likely to be occupied, the conduction band moves closer to the Fermi level, indicating more electrons are in the conducting band near the insulator.

Bulk region

The example in the figure shows the Fermi level in the bulk material beyond the range of the applied field as lying close to the valence band edge. This position for the occupancy level is arranged by introducing impurities into the semiconductor. In this case the impurities are so-called acceptors which soak up electrons from the valence band becoming negatively charged, immobile ions embedded in the semiconductor material. The removed electrons are drawn from the valence band levels, leaving vacancies or holes in the valence band. Charge neutrality prevails in the field-free region because a negative acceptor ion creates a positive deficiency in the host material: a hole is the absence of an electron, it behaves like a positive charge. Where no field is present, neutrality is achieved because the negative acceptor ions exactly balance the positive holes.

Surface region

Next the band bending is described. A positive charge is placed on the left face of the insulator (for example using a metal "gate" electrode). In the insulator there are no charges so the electric field is constant, leading to a linear change of voltage in this material. As a result, the insulator conduction and valence bands are therefore straight lines in the figure, separated by the large insulator energy gap.

In the semiconductor at the smaller voltage shown in the top panel, the positive charge placed on the left face of the insulator lowers the energy of the valence band edge. Consequently, these states are fully occupied out to a so-called depletion depth where the bulk occupancy reestablishes itself because the field cannot penetrate further. Because the valence band levels near the surface are fully occupied due to the lowering of these levels, only the immobile negative acceptor-ion charges are present near the surface, which becomes an electrically insulating region without holes (the depletion layer). Thus, field penetration is arrested when the exposed negative acceptor ion charge balances the positive charge placed on the insulator surface: the depletion layer adjusts its depth enough to make the net negative acceptor ion charge balance the positive charge on the gate.

Inversion

The conduction band edge also is lowered, increasing electron occupancy of these states, but at low voltages this increase is not significant. At larger applied voltages, however, as in the bottom panel, the conduction band edge is lowered sufficiently to cause significant population of these levels in a narrow surface layer, called an inversion layer because the electrons are opposite in polarity to the holes originally populating the semiconductor. This onset of electron charge in the inversion layer becomes very significant at an applied threshold voltage, and once the applied voltage exceeds this value charge neutrality is achieved almost entirely by addition of electrons to the inversion layer rather than by an increase in acceptor ion charge by expansion of the depletion layer. Further field penetration into the semiconductor is arrested at this point, as the electron density increases exponentially with band-bending beyond the threshold voltage, effectively pinning the depletion layer depth at its value at threshold voltages.

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Diode Electronic component that only allows current to flow in one direction

A diode is a two-terminal electronic component that conducts current primarily in one direction ; it has low resistance in one direction, and high resistance in the other.

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Semiconductor device Electronic component that exploits the electronic properties of semiconductor materials

A semiconductor device is an electronic component that relies on the electronic properties of a semiconductor material for its function. Its conductivity lies between conductors and insulators. Semiconductor devices have replaced vacuum tubes in most applications. They conduct electric current in the solid state, rather than as free electrons across a vacuum or as free electrons and ions through an ionized gas.

MOSFET Transistor used for amplifying or switching electronic signals

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Electron hole Conceptual and mathematical opposite of an electron

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In physics, a charge carrier is a particle or quasiparticle that is free to move, carrying an electric charge, especially the particles that carry electric charges in electrical conductors. Examples are electrons, ions and holes. The term is used most commonly in solid state physics. In a conducting medium, an electric field can exert force on these free particles, causing a net motion of the particles through the medium; this is what constitutes an electric current. In conducting media, particles serve to carry charge:

Schottky barrier Potential energy barrier in metal–semiconductor junctions

A Schottky barrier, named after Walter H. Schottky, is a potential energy barrier for electrons formed at a metal–semiconductor junction. Schottky barriers have rectifying characteristics, suitable for use as a diode. One of the primary characteristics of a Schottky barrier is the Schottky barrier height, denoted by ΦB. The value of ΦB depends on the combination of metal and semiconductor.

Tunnel diode Diode that works using quantum tunneling effect

A tunnel diode or Esaki diode is a type of semiconductor diode that has effectively "negative resistance" due to the quantum mechanical effect called tunneling. It was invented in August 1957 by Leo Esaki, Yuriko Kurose, and Takashi Suzuki when they were working at Tokyo Tsushin Kogyo, now known as Sony. In 1973, Esaki received the Nobel Prize in Physics, jointly with Brian Josephson, for discovering the electron tunneling effect used in these diodes. Robert Noyce independently devised the idea of a tunnel diode while working for William Shockley, but was discouraged from pursuing it. Tunnel diodes were first manufactured by Sony in 1957, followed by General Electric and other companies from about 1960, and are still made in low volume today.

p–n junction Semiconductor–semiconductor junction

A p–n junction is a boundary or interface between two types of semiconductor materials, p-type and n-type, inside a single crystal of semiconductor. The "p" (positive) side contains an excess of holes, while the "n" (negative) side contains an excess of electrons in the outer shells of the electrically neutral atoms there. This allows electrical current to pass through the junction only in one direction. The p-n junction is created by doping, for example by ion implantation, diffusion of dopants, or by epitaxy. If two separate pieces of material were used, this would introduce a grain boundary between the semiconductors that would severely inhibit its utility by scattering the electrons and holes.

High-electron-mobility transistor Field-effect transistor incorporating a junction between two materials with different band gaps as the channel

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Organic field-effect transistor Type of field-effect transistor

An organic field-effect transistor (OFET) is a field-effect transistor using an organic semiconductor in its channel. OFETs can be prepared either by vacuum evaporation of small molecules, by solution-casting of polymers or small molecules, or by mechanical transfer of a peeled single-crystalline organic layer onto a substrate. These devices have been developed to realize low-cost, large-area electronic products and biodegradable electronics. OFETs have been fabricated with various device geometries. The most commonly used device geometry is bottom gate with top drain and source electrodes, because this geometry is similar to the thin-film silicon transistor (TFT) using thermally grown SiO2 as gate dielectric. Organic polymers, such as poly(methyl-methacrylate) (PMMA), can also be used as dielectric. One of the benefits of OFETs, especially compared with inorganic TFTs, is their unprecedented physical flexibility, which leads to biocompatible applications, for instance in the future health care industry of personalized biomedicines and bioelectronics.

In semiconductor physics, the depletion region, also called depletion layer, depletion zone, junction region, space charge region or space charge layer, is an insulating region within a conductive, doped semiconductor material where the mobile charge carriers have been diffused away, or have been forced away by an electric field. The only elements left in the depletion region are ionized donor or acceptor impurities.

Capacitance–voltage profiling is a technique for characterizing semiconductor materials and devices. The applied voltage is varied, and the capacitance is measured and plotted as a function of voltage. The technique uses a metal–semiconductor junction or a p–n junction or a MOSFET to create a depletion region, a region which is empty of conducting electrons and holes, but may contain ionized donors and electrically active defects or traps. The depletion region with its ionized charges inside behaves like a capacitor. By varying the voltage applied to the junction it is possible to vary the depletion width. The dependence of the depletion width upon the applied voltage provides information on the semiconductor's internal characteristics, such as its doping profile and electrically active defect densities., Measurements may be done at DC, or using both DC and a small-signal AC signal, or using a large-signal transient voltage.

Band diagram

In solid-state physics of semiconductors, a band diagram is a diagram plotting various key electron energy levels as a function of some spatial dimension, which is often denoted x. These diagrams help to explain the operation of many kinds of semiconductor devices and to visualize how bands change with position. The bands may be coloured to distinguish level filling.

An extrinsic semiconductor is one that has been doped; during manufacture of the semiconductor crystal a trace element or chemical called a doping agent has been incorporated chemically into the crystal, for the purpose of giving it different electrical properties than the pure semiconductor crystal, which is called an intrinsic semiconductor. In an extrinsic semiconductor it is these foreign dopant atoms in the crystal lattice that mainly provide the charge carriers which carry electric current through the crystal. The doping agents used are of two types, resulting in two types of extrinsic semiconductor. An electron donor dopant is an atom which, when incorporated in the crystal, releases a mobile conduction electron into the crystal lattice. An extrinsic semiconductor which has been doped with electron donor atoms is called an n-type semiconductor, because the majority of charge carriers in the crystal are negative electrons. An electron acceptor dopant is an atom which accepts an electron from the lattice, creating a vacancy where an electron should be called a hole which can move through the crystal like a positively charged particle. An extrinsic semiconductor which has been doped with electron acceptor atoms is called a p-type semiconductor, because the majority of charge carriers in the crystal are positive holes.

This article provides a more detailed explanation of p–n diode behavior than is found in the articles p–n junction or diode.

Field-effect transistor Type of transistor

The field-effect transistor (FET) is a type of transistor that uses an electric field to control the flow of current in a semiconductor. FETs are devices with three terminals: source, gate, and drain. FETs control the flow of current by the application of a voltage to the gate, which in turn alters the conductivity between the drain and source.

A quantum field-effect transistor (QFET) or quantum-well field-effect transistor (QWFET) is a type of MOSFET that takes advantage of quantum tunneling to greatly increase the speed of transistor operation by eliminating the traditional transistor's area of electron conduction which typically causes carriers to slow down by a factor of 3000. The result is an increase in logic speed by a factor of 10 with a simultaneous reduction in component power requirement and size also by a factor of 10. It achieves these things through a manufacturing process known as rapid thermal processing (RTP) that uses ultrafine layers of construction materials.

In solid-state physics, band bending refers to the process in which the electronic band structure in a material curves up or down near a junction or interface. It does not involve any physical (spatial) bending. When the electrochemical potential of the free charge carriers around an interface of a semiconductor is dissimilar, charge carriers are transferred between the two materials until an equilibrium state is reached whereby the potential difference vanishes. The band bending concept was first developed in 1938 when Mott, Davidov and Schottky all published theories of the rectifying effect of metal-semiconductor contacts. The use of semiconductor junctions sparked the computer revolution in 1990. Devices such as the diode, the transistor, the photocell and many more still play an important role in technology.

References

  1. The acronyms stand for Metal Oxide Semiconductor Field Effect Transistor, Junction Field Effect Transistor, and MEtal Semiconductor Field Effect Transistor. For a discussion see, for example, M K Achuthan K N Bhat (2007). "Chapter 10: Metal semiconductor contacts: Metal semiconductor and junction field effect transistors". Fundamentals of semiconductor devices. Tata McGraw-Hill. pp. 475 ff. ISBN   978-0070612204.

This article incorporates material from the Citizendium article "Field effect#Field effect", which is licensed under the Creative Commons Attribution-ShareAlike 3.0 Unported License but not under the GFDL.