In electronics and photonics design, tape-out or tapeout is the final result of the design process for integrated circuits or printed circuit boards before they are sent for manufacturing. The tapeout is specifically the point at which the graphic for the photomask of the circuit is sent to the fabrication facility.
Very-large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining millions or billions of MOS transistors onto a single chip. VLSI began in the 1970s when MOS integrated circuit chips were developed and then widely adopted, enabling complex semiconductor and telecommunication technologies. The microprocessor and memory chips are VLSI devices.
A system on a chip or system-on-chip is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include on-chip central processing unit (CPU), memory interfaces, input/output devices and interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip. SoCs may contain digital and also analog, mixed-signal and often radio frequency signal processing functions.
An application-specific integrated circuit is an integrated circuit (IC) chip customized for a particular use, rather than intended for general-purpose use, such as a chip designed to run in a digital voice recorder or a high-efficiency video codec. Application-specific standard product chips are intermediate between ASICs and industry standard integrated circuits like the 7400 series or the 4000 series. ASIC chips are typically fabricated using metal–oxide–semiconductor (MOS) technology, as MOS integrated circuit chips.
Electronic design automation (EDA), also referred to as electronic computer-aided design (ECAD), is a category of software tools for designing electronic systems such as integrated circuits and printed circuit boards. The tools work together in a design flow that chip designers use to design and analyze entire semiconductor chips. Since a modern semiconductor chip can have billions of components, EDA tools are essential for their design; this article in particular describes EDA specifically with respect to integrated circuits (ICs).
In integrated circuit design, integrated circuit (IC) layout, also known IC mask layout or mask design, is the representation of an integrated circuit in terms of planar geometric shapes which correspond to the patterns of metal, oxide, or semiconductor layers that make up the components of the integrated circuit. Originally the overall process was called tapeout, as historically early ICs used graphical black crepe tape on mylar media for photo imaging.
Place and route is a stage in the design of printed circuit boards, integrated circuits, and field-programmable gate arrays. As implied by the name, it is composed of two steps, placement and routing. The first step, placement, involves deciding where to place all electronic components, circuitry, and logic elements in a generally limited amount of space. This is followed by routing, which decides the exact design of all the wires needed to connect the placed components. This step must implement all the desired connections while following the rules and limitations of the manufacturing process.
In semiconductor design, standard-cell methodology is a method of designing application-specific integrated circuits (ASICs) with mostly digital-logic features. Standard-cell methodology is an example of design abstraction, whereby a low-level very-large-scale integration (VLSI) layout is encapsulated into an abstract logic representation.
The front end of line (FEOL) is the first portion of IC fabrication where the individual components are patterned in a semiconductor substrate. FEOL generally covers everything up to the deposition of metal interconnect layers.
Back end of the line or back end of line (BEOL) is a process in semiconductor device fabrication that consists of depositing metal interconnect layers onto a wafer already patterned with devices. It is the second part of IC fabrication, after front end of line (FEOL). In BEOL, the individual devices are connected to each other according to how the metal wiring is deposited.
Integrated circuit design, semiconductor design, chip design or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs. ICs consist of miniaturized electronic components built into an electrical network on a monolithic semiconductor substrate by photolithography.
Rent's rule pertains to the organization of computing logic, specifically the relationship between the number of external signal connections to a logic block with the number of logic gates in the logic block, and has been applied to circuits ranging from small digital circuits to mainframe computers. Put simply, it states that there is a simple power law relationship between these two values.
Placement is an essential step in electronic design automation — the portion of the physical design flow that assigns exact locations for various circuit components within the chip's core area. An inferior placement assignment will not only affect the chip's performance but might also make it non-manufacturable by producing excessive wire-length, which is beyond available routing resources. Consequently, a placer must perform the assignment while optimizing a number of objectives to ensure that a circuit meets its performance demands. Together, the placement and routing steps of IC design are known as place and route.
Design flows are the explicit combination of electronic design automation tools to accomplish the design of an integrated circuit. Moore's law has driven the entire IC implementation RTL to GDSII design flows from one which uses primarily stand-alone synthesis, placement, and routing algorithms to an integrated construction and analysis flows for design closure. The challenges of rising interconnect delay led to a new way of thinking about and integrating design closure tools.
Mask data preparation (MDP), also known as layout post processing, is the procedure of translating a file containing the intended set of polygons from an integrated circuit layout into set of instructions that a photomask writer can use to generate a physical mask. Typically, amendments and additions to the chip layout are performed in order to convert the physical layout into data for mask production.
Design Closure is a part of the digital electronic design automation workflow by which an integrated circuit design is modified from its initial description to meet a growing list of design constraints and objectives.
In the design of integrated circuits, power network design is the analysis and design of on-chip conductor networks that distribute electrical power on a chip. As in all engineering, this involves tradeoffs - the network must have adequate performance, be sufficiently reliable, but should not use more resources than required.
In integrated circuit design, physical design is a step in the standard design cycle which follows after the circuit design. At this step, circuit representations of the components of the design are converted into geometric representations of shapes which, when manufactured in the corresponding layers of materials, will ensure the required functioning of the components. This geometric representation is called integrated circuit layout. This step is usually split into several sub-steps, which include both design and verification and validation of the layout.
A three-dimensional integrated circuit is a MOS integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
Igor Leonidovich Markov is an American professor, computer scientist and engineer. Markov is known for mathematical and algorithmic results in quantum computation, work on limits of computation, research on algorithms for optimizing integrated circuits and on electronic design automation, as well as artificial intelligence. Additionally, Markov is a California non-profit executive responsible for aid to Ukraine worth tens of millions dollars.
