Heterojunction bipolar transistor

Last updated

The heterojunction bipolar transistor (HBT) is a type of bipolar junction transistor (BJT) which uses differing semiconductor materials for the emitter and base regions, creating a heterojunction. The HBT improves on the BJT in that it can handle signals of very high frequencies, up to several hundred GHz. It is commonly used in modern ultrafast circuits, mostly radio frequency (RF) systems, and in applications requiring a high power efficiency, such as RF power amplifiers in cellular phones. The idea of employing a heterojunction is as old as the conventional BJT, dating back to a patent from 1951. [1] Detailed theory of heterojunction bipolar transistor was developed by Herbert Kroemer in 1957. [2]

Contents

Materials

Bands in graded heterojunction npn bipolar transistor. Barriers indicated for electrons to move from emitter to base, and for holes to be injected backward from base to emitter; Also, grading of bandgap in base assists electron transport in base region; Light colors indicate depleted regions. Npn heterostructure bands.svg
Bands in graded heterojunction npn bipolar transistor. Barriers indicated for electrons to move from emitter to base, and for holes to be injected backward from base to emitter; Also, grading of bandgap in base assists electron transport in base region; Light colors indicate depleted regions.

The principal difference between the BJT and HBT is in the use of differing semiconductor materials for the emitter-base junction and the base-collector junction, creating a heterojunction. The effect is to limit the injection of holes from the base into the emitter region, since the potential barrier in the valence band is higher than in the conduction band. Unlike BJT technology, this allows a high doping density to be used in the base, reducing the base resistance while maintaining gain. The efficiency of the heterojunction is measured by the Kroemer factor. [3] Kroemer was awarded a Nobel Prize in 2000 for his work in this field at the University of California, Santa Barbara.

Materials used for the substrate include silicon, gallium arsenide, and indium phosphide, while silicon / silicon-germanium alloys, aluminum gallium arsenide / gallium arsenide, and indium phosphide / indium gallium arsenide are used for the epitaxial layers. Wide-bandgap semiconductors such as gallium nitride and indium gallium nitride are especially promising.

In SiGe graded heterostructure transistors, the amount of germanium in the base is graded, making the bandgap narrower at the collector than at the emitter. That tapering of the bandgap leads to a field-assisted transport in the base, which speeds transport through the base and increases frequency response.

Fabrication

Due to the need to manufacture HBT devices with extremely high-doped thin base layers, molecular beam epitaxy is principally employed. In addition to base, emitter and collector layers, highly doped layers are deposited on either side of collector and emitter to facilitate an ohmic contact, which are placed on the contact layers after exposure by photolithography and etching. The contact layer underneath the collector, named subcollector, is an active part of the transistor.

Other techniques are used depending on the material system. IBM and others use ultra-high vacuum chemical vapor deposition (UHVCVD) for SiGe; other techniques used include MOVPE for III-V systems.

Normally the epitaxial layers are lattice matched (which restricts the choice of bandgap etc.). If they are near-lattice-matched the device is pseudomorphic, and if the layers are unmatched (often separated by a thin buffer layer) it is metamorphic.

Limits

A pseudomorphic heterojunction bipolar transistor developed at the University of Illinois at Urbana-Champaign, built from indium phosphide and indium gallium arsenide and designed with compositionally graded collector, base and emitter, was demonstrated to cut off at a speed of 710 GHz. [4] [5]

Besides being record breakers in terms of speed, HBTs made of InP/InGaAs are ideal for monolithic optoelectronic integrated circuits. A PIN-type photo detector is formed by the base-collector-subcollector layers. The bandgap of InGaAs works well for detecting 1550 nm-wavelength infrared laser signals used in optical communication systems. Biasing the HBT to obtain an active device, a photo transistor with high internal gain is obtained. Among other HBT applications are mixed signal circuits such as analog-to-digital and digital-to-analog converters.

See also

Related Research Articles

<span class="mw-page-title-main">Transistor</span> Solid-state electrically operated switch also used as an amplifier

A transistor is a semiconductor device used to amplify or switch electrical signals and power. It is one of the basic building blocks of modern electronics. It is composed of semiconductor material, usually with at least three terminals for connection to an electronic circuit. A voltage or current applied to one pair of the transistor's terminals controls the current through another pair of terminals. Because the controlled (output) power can be higher than the controlling (input) power, a transistor can amplify a signal. Some transistors are packaged individually, but many more in miniature form are found embedded in integrated circuits. Because transistors are the key active components in practically all modern electronics, many people consider them one of the 20th century's greatest inventions.

<span class="mw-page-title-main">Semiconductor device</span> Electronic component that exploits the electronic properties of semiconductor materials

A semiconductor device is an electronic component that relies on the electronic properties of a semiconductor material for its function. Its conductivity lies between conductors and insulators. Semiconductor devices have replaced vacuum tubes in most applications. They conduct electric current in the solid state, rather than as free electrons across a vacuum or as free electrons and ions through an ionized gas.

<span class="mw-page-title-main">Bipolar junction transistor</span> Transistor that uses both electrons and holes as charge carriers

A bipolar junction transistor (BJT) is a type of transistor that uses both electrons and electron holes as charge carriers. In contrast, a unipolar transistor, such as a field-effect transistor (FET), uses only one kind of charge carrier. A bipolar transistor allows a small current injected at one of its terminals to control a much larger current flowing between the terminals, making the device capable of amplification or switching.

<span class="mw-page-title-main">Laser diode</span> Semiconductor laser

A laser diode is a semiconductor device similar to a light-emitting diode in which a diode pumped directly with electrical current can create lasing conditions at the diode's junction.

<span class="mw-page-title-main">Gallium arsenide</span> Chemical compound

Gallium arsenide (GaAs) is a III-V direct band gap semiconductor with a zinc blende crystal structure.

<span class="mw-page-title-main">Monolithic microwave integrated circuit</span>

Monolithic microwave integrated circuit, or MMIC, is a type of integrated circuit (IC) device that operates at microwave frequencies. These devices typically perform functions such as microwave mixing, power amplification, low-noise amplification, and high-frequency switching. Inputs and outputs on MMIC devices are frequently matched to a characteristic impedance of 50 ohms. This makes them easier to use, as cascading of MMICs does not then require an external matching network. Additionally, most microwave test equipment is designed to operate in a 50-ohm environment.

<span class="mw-page-title-main">Epitaxy</span> Crystal growth process relative to the substrate

Epitaxy refers to a type of crystal growth or material deposition in which new crystalline layers are formed with one or more well-defined orientations with respect to the crystalline seed layer. The deposited crystalline film is called an epitaxial film or epitaxial layer. The relative orientation(s) of the epitaxial layer to the seed layer is defined in terms of the orientation of the crystal lattice of each material. For most epitaxial growths, the new layer is usually crystalline and each crystallographic domain of the overlayer must have a well-defined orientation relative to the substrate crystal structure. Epitaxy can involve single-crystal structures, although grain-to-grain epitaxy has been observed in granular films. For most technological applications, single domain epitaxy, which is the growth of an overlayer crystal with one well-defined orientation with respect to the substrate crystal, is preferred. Epitaxy can also play an important role while growing superlattice structures.

<span class="mw-page-title-main">Indium phosphide</span> Chemical compound

Indium phosphide (InP) is a binary semiconductor composed of indium and phosphorus. It has a face-centered cubic ("zincblende") crystal structure, identical to that of GaAs and most of the III-V semiconductors.

SiGe, or silicon–germanium, is an alloy with any molar ratio of silicon and germanium, i.e. with a molecular formula of the form Si1−xGex. It is commonly used as a semiconductor material in integrated circuits (ICs) for heterojunction bipolar transistors or as a strain-inducing layer for CMOS transistors. IBM introduced the technology into mainstream manufacturing in 1989. This relatively new technology offers opportunities in mixed-signal circuit and analog circuit IC design and manufacture. SiGe is also used as a thermoelectric material for high-temperature applications (>700 K).

A MESFET is a field-effect transistor semiconductor device similar to a JFET with a Schottky (metal–semiconductor) junction instead of a p–n junction for a gate.

<span class="mw-page-title-main">High-electron-mobility transistor</span> Type of field-effect transistor

A high-electron-mobility transistor, also known as heterostructure FET (HFET) or modulation-doped FET (MODFET), is a field-effect transistor incorporating a junction between two materials with different band gaps as the channel instead of a doped region. A commonly used material combination is GaAs with AlGaAs, though there is wide variation, dependent on the application of the device. Devices incorporating more indium generally show better high-frequency performance, while in recent years, gallium nitride HEMTs have attracted attention due to their high-power performance. Like other FETs, HEMTs are used in integrated circuits as digital on-off switches. FETs can also be used as amplifiers for large amounts of current using a small voltage as a control signal. Both of these uses are made possible by the FET’s unique current–voltage characteristics. HEMT transistors are able to operate at higher frequencies than ordinary transistors, up to millimeter wave frequencies, and are used in high-frequency products such as cell phones, satellite television receivers, voltage converters, and radar equipment. They are widely used in satellite receivers, in low power amplifiers and in the defense industry.

Indium gallium phosphide (InGaP), also called gallium indium phosphide (GaInP), is a semiconductor composed of indium, gallium and phosphorus. It is used in high-power and high-frequency electronics because of its superior electron velocity with respect to the more common semiconductors silicon and gallium arsenide.

<span class="mw-page-title-main">Indium arsenide</span> Chemical compound

Indium arsenide, InAs, or indium monoarsenide, is a narrow-bandgap semiconductor composed of indium and arsenic. It has the appearance of grey cubic crystals with a melting point of 942 °C.

The Heterojunction-emitter bipolar transistor (HEBT), is a somewhat unusual arrangement with respect to emitter blocking of minority carriers. This is accomplished by using heterostructure confinement in the emitter, introducing an energy barrier to minority-carrier charge flow from the base. This is important as loss of minority carriers from the base to the emitter degrades analog performance. The main difference of the HEBT from the Heterojunction bipolar transistor (HBT) is that the emitter–base interface is the same as in a bipolar junction transistor (BJT) with the blocking energy gap being moved back into the emitter bulk region.

Milton Feng co-created the first transistor laser, working with Nick Holonyak in 2004. The paper discussing their work was voted in 2006 as one of the five most important papers published by the American Institute of Physics since its founding 75 years ago. In addition to the invention of transistor laser, he is also well known for inventions of other "major breakthrough" devices, including the world's fastest transistor and light-emitting transistor (LET). As of May, 2009 he is a professor at the University of Illinois at Urbana–Champaign and holds the Nick Holonyak Jr. Endowed Chair Professorship.

IQE PLC is a British semiconductor company founded 1988 in Cardiff, Wales, which manufactures advanced epitaxial wafers for a wide range of technology applications for wireless, optoelectronic, electronic and solar devices. IQE specialises in advanced silicon and compound semiconductor materials based on gallium arsenide (GaAs), indium phosphide (InP), gallium nitride (GaN) and silicon. The company is the largest independent outsource producer of epiwafers manufactured by metalorganic vapour phase epitaxy (MOCVD), molecular beam epitaxy (MBE) and chemical vapor deposition (CVD).

Transistor laser is a semiconductor device that functions as a transistor with an electrical output and an optical output as opposed to the typical two electrical outputs. This optical output separates it from typical transistors and, because optical signals travel faster than electrical signals, has the potential to speed up computing immensely. Researchers who discovered the transistor laser developed a new model of Kirchhoff's current law to better model the behavior of simultaneous optical and electrical output.

Roger John Malik is a physicist, engineer and inventor.

A light-emitting transistor or LET is a form of transistor that emits light. Higher efficiency than light-emitting diode (LED) is possible.

<span class="mw-page-title-main">Aristos Christou</span> American engineer

Aristos Christou is an American engineer and scientist, academic professor and researcher. He is a Professor of Materials Science, Professor of Mechanical Engineering and Professor of Reliability Engineering at the University of Maryland.

References

  1. W. Shockley: 'Circuit Element Utilizing Semiconductive Material', United States Patent 2,569,347, 1951.
  2. Herbert Kroemer (1957). "Theory of a Wide-Gap Emitter for Transistors". Proceedings of the IRE. 45 (11): 1535–1537. doi:10.1109/JRPROC.1957.278348. S2CID   51651950.
  3. The phototransistor effect: "The Kroemer factor is a function of the physical parameters of the materials making up the heterojunction, and can be expressed in the following way [formula given]"
  4. 12.5 nm base pseudomorphic heterojunction bipolar transistors achieving fT=710GHz fT=710GHz and fMAX=340GHz Hafez et al, Appl. Phys. Lett. 87, 252109, 2005 doi : 10.1063/1.2149510
  5. Indium Phosphide: Transcending frequency and integration limits. Semiconductor Today. Vol 1 Issue 3. Sept 2006