Megasonic cleaning

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Megasonic cleaning is a specialized cleaning method that utilizes high-frequency sound waves to remove contaminants from delicate surfaces. It is particularly effective in industries like semiconductor manufacturing, optics, and medical device production, where precision and gentle cleaning are crucial. It is a type of acoustic cleaning related to ultrasonic cleaning. Similar to ultrasonic cleaning, megasonic cleaning uses a transducer that sits on top of a piezoelectric substrate. [1] The transducer creates acoustic waves at a higher frequency (typically 0.8–2 MHz) than ultrasonic cleaning (20-200 kHz). As a result, the cavitation that occurs is reduced and on a much smaller scale. [2]

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Comparison to ultrasonic cleaning

Megasonic cleaning differs from ultrasonic cleaning in the frequency that is used to generate the acoustic waves. Ultrasonic cleaning uses lower frequencies and its mechanism relies on cavitation, [3] while megasonic cleaning uses higher frequencies and produces less damaging cavitation.

In ultrasonic devices, cavitation occurs throughout the tank, and all sides of submerged parts are cleaned. In megasonic devices, the acoustic wave is found only in a line of sight from the transducer surface. For this reason, megasonic transducers are typically built using arrays of closely spaced square or rectangular piezoelectric devices that are bonded to a substrate. Semiconductor wafers are typically cleaned in carriers holding the substrates perpendicular to the transducer, allowing both the front and back surfaces to be cleaned. Special carriers are sometimes used to reduce any obstructions that may prevent parts of the wafer surface from being cleaned. [4]

Megasonic cleaners come in many configurations, such as single or dual nozzle systems, or single-wafer transducers. In single-wafer devices, the wafer rotates on a spinning tool, and the megasonic waves are applied from above. [5]

See also

Related Research Articles

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<span class="mw-page-title-main">Piezoelectricity</span> Electric charge generated in certain solids due to mechanical stress

Piezoelectricity is the electric charge that accumulates in certain solid materials—such as crystals, certain ceramics, and biological matter such as bone, DNA, and various proteins—in response to applied mechanical stress. The word piezoelectricity means electricity resulting from pressure and latent heat. It is derived from Ancient Greek πιέζω (piézō) 'to squeeze or press' and ἤλεκτρον (ḗlektron) 'amber'. The German form of the word (Piezoelektricität) was coined in 1881 by the German physicist Wilhelm Gottlieb Hankel; the English word was coined in 1883.

Ultrasound is sound with frequencies greater than 20 kilohertz. This frequency is the approximate upper audible limit of human hearing in healthy young adults. The physical principles of acoustic waves apply to any frequency range, including ultrasound. Ultrasonic devices operate with frequencies from 20 kHz up to several gigahertz.

<span class="mw-page-title-main">Surface acoustic wave</span> Sound wave which travels along the surface of an elastic material

A surface acoustic wave (SAW) is an acoustic wave traveling along the surface of a material exhibiting elasticity, with an amplitude that typically decays exponentially with depth into the material, such that they are confined to a depth of about one wavelength.

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<span class="mw-page-title-main">Ultrasonic motor</span>

An ultrasonic motor is a type of piezoelectric motor powered by the ultrasonic vibration of a component, the stator, placed against another component, the rotor or slider depending on the scheme of operation. Ultrasonic motors differ from other piezoelectric motors in several ways, though both typically use some form of piezoelectric material, most often lead zirconate titanate and occasionally lithium niobate or other single-crystal materials. The most obvious difference is the use of resonance to amplify the vibration of the stator in contact with the rotor in ultrasonic motors. Ultrasonic motors also offer arbitrarily large rotation or sliding distances, while piezoelectric actuators are limited by the static strain that may be induced in the piezoelectric element.

<span class="mw-page-title-main">Ultrasonic cleaning</span> Method of cleaning using ultrasound

Ultrasonic cleaning is a process that uses ultrasound to agitate a fluid, with a cleaning effect. Ultrasonic cleaners come in a variety of sizes, from small desktop units with an internal volume of less than 0.5 litres (0.13 US gal), to large industrial units with volumes approaching 1,000 litres.

<span class="mw-page-title-main">Ultrasonic testing</span> Non-destructive material testing using ultrasonic waves

Ultrasonic testing (UT) is a family of non-destructive testing techniques based on the propagation of ultrasonic waves in the object or material tested. In most common UT applications, very short ultrasonic pulse waves with centre frequencies ranging from 0.1-15 MHz and occasionally up to 50 MHz, are transmitted into materials to detect internal flaws or to characterize materials. A common example is ultrasonic thickness measurement, which tests the thickness of the test object, for example, to monitor pipework corrosion and erosion. Ultrasonic testing is extensively used to detect flaws in welds.

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<span class="mw-page-title-main">Ultrasonic transducer</span> Acoustic sensor

Ultrasonic transducers and ultrasonic sensors are devices that generate or sense ultrasound energy. They can be divided into three broad categories: transmitters, receivers and transceivers. Transmitters convert electrical signals into ultrasound, receivers convert ultrasound into electrical signals, and transceivers can both transmit and receive ultrasound.

<span class="mw-page-title-main">Electromagnetic acoustic transducer</span>

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Surface acoustic wave gas sensor or surface acoustic wave (SAW) sensors consist of an input transducer, a chemically adsorbent polymer film, and an output transducer on a piezoelectric substrate, which is typically made of quartz. The input transducer launches an acoustic wave that travels through the chemical film and is detected by the output transducer.

<span class="mw-page-title-main">Ultrasonic horn</span>

An ultrasonic horn is a tapering metal bar commonly used for augmenting the oscillation displacement amplitude provided by an ultrasonic transducer operating at the low end of the ultrasonic frequency spectrum. The device is necessary because the amplitudes provided by the transducers themselves are insufficient for most practical applications of power ultrasound. Another function of the ultrasonic horn is to efficiently transfer the acoustic energy from the ultrasonic transducer into the treated media, which may be solid or liquid. Ultrasonic processing of liquids relies of intense shear forces and extreme local conditions generated by acoustic cavitation.

Ultrasonic soldering is a flux-less soldering process that uses ultrasonic energy, without the need for chemicals to solder materials, such as glass, ceramics, and composites, hard to solder metals and other sensitive components which cannot be soldered using conventional means.

<span class="mw-page-title-main">Ultrasonic nozzle</span> Type of spray nozzle

Ultrasonic nozzles are a type of spray nozzle that use high frequency vibrations produced by piezoelectric transducers acting upon the nozzle tip that create capillary waves in a liquid film. Once the amplitude of the capillary waves reaches a critical height, they become too tall to support themselves and tiny droplets fall off the tip of each wave resulting in atomization.

Capacitive micromachined ultrasonic transducers (CMUT) are a relatively new concept in the field of ultrasonic transducers. Most of the commercial ultrasonic transducers today are based on piezoelectricity. In CMUTs, the energy transduction is due to change in capacitance. CMUTs are constructed on silicon using micromachining techniques. A cavity is formed in a silicon substrate, and a thin layer suspended on the top of the cavity serves as a membrane on which a metallized layer acts an electrode, together with the silicon substrate which serves as a bottom electrode.

Surface acoustic wave sensors are a class of microelectromechanical systems (MEMS) which rely on the modulation of surface acoustic waves to sense a physical phenomenon. The sensor transduces an input electrical signal into a mechanical wave which, unlike an electrical signal, can be easily influenced by physical phenomena. The device then transduces this wave back into an electrical signal. Changes in amplitude, phase, frequency, or time-delay between the input and output electrical signals can be used to measure the presence of the desired phenomenon.

Ultrasonic antifouling is a technology that uses high frequency sound (ultrasound) to prevent or reduce biofouling on underwater structures, surfaces, and medium. Ultrasound is just high frequency sound. Ultrasound has the same physical properties as human-audible sound. The method has two primary forms: sub-cavitation intensity and cavitation intensity. Sub-cavitation methods create high frequency vibrations, whilst cavitation methods cause more destructive microscopic pressure changes. Both methods inhibit or prevent biofouling by algae and other single-celled organisms.

Acousto-electronics is a branch of physics, acoustics and electronics that studies interactions of ultrasonic and hypersonic waves in solids with electrons and with electro-magnetic fields. Typical phenomena studied in acousto-electronics are acousto-electric effect and also amplification of acoustic waves by flows of electrons in piezoelectric semiconductors, when the drift velocity of the electrons exceeds the velocity of sound. The term 'acousto-electronics' is often understood in a wider sense to include numerous practical applications of the interactions of electro-magnetic fields with acoustic waves in solids. In particular, these are signal processing devices using surface acoustic waves (SAW), different sensors of temperature, pressure, humidity, acceleration, etc.

References

  1. Kanegsberg, Barbara; Kanegsberg, Edward (2001). Handbook for Critical Cleaning (2nd ed.). CRC Press. p. 497. ISBN   978-1-4200-3982-5.
  2. Busnaina, Ahmed A.; Kashkoush, Ismail I.; Gale, Glenn W. (1995). "An Experimental Study of Megasonic Cleaning of Silicon Wafers". Journal of the Electrochemical Society . 142 (8): 2812–2817. Bibcode:1995JElS..142.2812B. doi:10.1149/1.2050096.
  3. Nagarajan, R.; Awad, S.; Gopi, K. R. (2011). "Chapter 2 - Megasonic Cleaning". In Kohli, Rajiv; Mittal, K. L. (eds.). Developments in Surface Contamination and Cleaning. Oxford: William Andrew Publishing. pp. 31–62. ISBN   978-1-4377-7885-4 . Retrieved 2023-10-15.
  4. Kanegsberg, Barbara; Kanegsberg, Edward (2011). Handbook for Critical Cleaning (2nd ed.). CRC Press. pp. 245–247. ISBN   978-1-4398-2828-1.
  5. Holsteyns, Frank; Janssens, Tom; Arnauts, Sophia; Van Der Putte, Wouter; Minsier, Vincent; Brunner, Johann; Straka, Joachim; Mertens, Paul W. (2007). "Ex Situ Bubble Generation, Enhancing the Particle Removal Rate for Single Wafer Megasonic Cleaning Processes". Solid State Phenomena. 134: 201–204. doi:10.4028/www.scientific.net/SSP.134.201.